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1. 发明公开

US20240079806A1 DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY 审中-公开
公开(公告)号：US20240079806A1
公开(公告)日：2024-03-07
申请号：US18307946
申请日：2023-04-27
申请人： Japan Aviation Electronics Industry, Ltd.
发明人： Kenta OONISHI
IPC分类号： H01R12/71 , H01R12/58 , H01R13/6471 , H05K1/02 , H05K7/10
CPC分类号： H01R12/714 , H01R12/58 , H01R13/6471 , H05K1/0298 , H05K7/1069
摘要： A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.

2. 发明授权

US11844184B2 Information processing system 有权
公开(公告)号：US11844184B2
公开(公告)日：2023-12-12
申请号：US17864558
申请日：2022-07-14
申请人： Fulian Precision Electronics (Tianjin) Co., LTD.
发明人： Tung-Ho Shih , Hung-Wei Chen , Kuan-Chin Yu , Ming-Heng Lu
IPC分类号： H05K7/14 , H05K5/02 , H05K7/10
CPC分类号： H05K7/1401 , H05K5/023 , H05K7/1069
摘要： An information processing system includes a housing, a circuit board in the housing, a functional module in the housing, and a module fixing device in the housing. The functional module is inserted into the circuit board. The module fixing device is connected to the functional module and is connected to the circuit board. The module fixing device comprises a clamping member and an elastic member. The clamping member is movably connected to the circuit board in a first direction and a second direction opposite to the first direction, the clamping member comprises a first clamping portion to clamp the functional module. The elastic member is connected to the clamping member, the elastic member is deformable in the first direction to drive the clamping member to move in the first direction to clamp the functional module.

3. 发明申请

US20190214759A1 ELECTRICAL CONNECTOR 审中-公开
公开(公告)号：US20190214759A1
公开(公告)日：2019-07-11
申请号：US16053898
申请日：2018-08-03
申请人： SHENZHEN DEREN ELECTRONIC CO., LTD.
发明人： Zhudong HUO
IPC分类号： H01R13/11 , H01R13/24 , H05K7/10 , H01R12/70 , H01R12/71 , H01R12/57
CPC分类号： H01R13/11 , H01R12/57 , H01R12/7082 , H01R12/714 , H01R12/716 , H01R13/24 , H05K7/1069
摘要： An electrical connector includes an insulating body and conductive terminals. The insulating body defines receiving holes, each of the receiving holes receiving a respective one of the conductive terminals. Each receiving hole includes a first hole portion, a second hole portion and a third hole portion. Each conductive terminal includes a main body, an elastic arm, and a connection portion. The main body is received in the second hole portion, the first hole portion and the third hole portion are respectively positioned on two opposite sides of the main body, and the elastic arm is at least partially positioned above the first hole portion. The insulating body includes a support portion located on a side of the main body, and the support portion and the third hole portion are located on the same side of the main body.

4. 发明授权

US09882296B1 Electrical connector 有权
公开(公告)号：US09882296B1
公开(公告)日：2018-01-30
申请号：US15602549
申请日：2017-05-23
申请人： LOTES CO., LTD
发明人： Ted Ju
IPC分类号： H01R12/70 , H01R13/24 , H01R13/432
CPC分类号： H01R12/7076 , H01R12/7082 , H01R13/2435 , H01R13/428 , H01R13/432 , H05K7/1069
摘要： An electrical connector includes an insulating body having multiple receiving holes, and multiple conductive terminals respectively received in the receiving holes. Each conductive terminal has first and second elastic arms, and third and fourth elastic arms. When a chip module downwardly presses the conductive terminals, the first elastic arm are conducted upwardly with the chip module, and the third elastic arm are conducted downwardly with a circuit board. At the same time, the first elastic arm elastically deform to urge against the second elastic arm, and the third elastic arm elastically deform to urge against the fourth elastic arm, thereby forming two conductive paths to reduce terminal impedance, and improving signal transmission performance. Further, the second elastic arm provide elastic force for the first elastic arm and the fourth elastic arm provide elastic force for the third elastic arm.

5. 发明授权

US09865953B2 Electrical contact assembly for printed circuit boards 有权
公开(公告)号：US09865953B2
公开(公告)日：2018-01-09
申请号：US15646234
申请日：2017-07-11
申请人： International Business Machines Corporation
发明人： Na Fan , Jun Hu , Sen Xiong Huang , YongDong Shi , XiYuan Yin
IPC分类号： H01R13/415 , H01R13/11 , H01R43/04 , H01R12/71
CPC分类号： H01R13/11 , H01R12/57 , H01R12/716 , H01R43/04 , H01R43/205 , H05K1/184 , H05K3/3447 , H05K7/1069 , H05K2201/10303 , H05K2201/10704 , H05K2201/1078 , H05K2201/10803
摘要： A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

6. 发明申请

US20170256875A1 ELECTRICAL CONTACT ASSEMBLY FOR PRINTED CIRCUIT BOARDS 有权
公开(公告)号：US20170256875A1
公开(公告)日：2017-09-07
申请号：US15060728
申请日：2016-03-04
申请人： International Business Machines Corporation
发明人： Na Fan , Jun Hu , Sen Xiong Huang , YongDong Shi , XiYuan Yin
IPC分类号： H01R13/11 , H01R12/71 , H01R43/04
CPC分类号： H01R13/11 , H01R12/57 , H01R12/716 , H01R43/04 , H01R43/205 , H05K1/184 , H05K3/3447 , H05K7/1069 , H05K2201/10303 , H05K2201/10704 , H05K2201/1078 , H05K2201/10803
摘要： A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

7. 发明授权

US09655266B2 Mounting member and socket for electric component 有权
公开(公告)号：US09655266B2
公开(公告)日：2017-05-16
申请号：US15025101
申请日：2014-09-22
申请人： ENPLAS CORPORATION
发明人： Yuki Ueyama
IPC分类号： H01R13/64 , H05K7/10 , H05K1/18
CPC分类号： H05K7/1069 , H05K1/18
摘要： To improve a seating property of a mounting member with respect to a supporting member and enhance the positional accuracy of the mounting member. The mounting member has a protruding portion that protrudes from a support face of a frame body, and a shaft body that is thinner than the protruding portion. At a base portion of the shaft body, a relief recess is formed over the entire circumference of a boundary region with the protruding portion, and a supported face of the protruding portion is configured so as to contact with a support face of the frame body in a state in which the mounting member is supported by the frame body. In a preferred embodiment of the present invention, the mounting member is used as a guide pin of a floating plate that accommodates an IC socket.

8. 发明授权

US09491881B2 Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate 有权
标题翻译：微电子插座，其包括衬底和与衬底中的开口配合的绝缘插入件
公开(公告)号：US09491881B2
公开(公告)日：2016-11-08
申请号：US14164403
申请日：2014-01-27
申请人： Joshua D. Heppner , Zhichao Zhang , Srikant Nekkanty , Michael Garcia
发明人： Joshua D. Heppner , Zhichao Zhang , Srikant Nekkanty , Michael Garcia
IPC分类号： H05K7/10 , H01R12/70 , H05K1/18 , H05K3/42
CPC分类号： H05K7/1069 , H01R12/7076 , H01R12/7082 , H05K1/184 , H05K3/42 , H05K2201/09545 , H05K2201/10189 , H05K2201/10265 , Y10T29/49222
摘要： A microelectronic socket having a two piece construction, wherein a first piece comprises a conductive socket substrate and the second piece comprises an insulative insert. The conductive socket substrate has a first surface, a second surface, and at least one opening extending therebetween. The insulative insert has a base portion with at least one projection extending therefrom. The insulative insert is mated with the conductive socket substrate such that the at least one projection resides within a corresponding conductive socket substrate opening. The insulative insert further includes a plurality of vias, wherein at least one of the plurality of vias extends through the insulative base and through an insulative insert projection, wherein a contact may be disposed within the via.
摘要翻译：一种具有两件式结构的微电子插座，其中第一件包括导电插座衬底，第二件包括绝缘插入件。导电插座基板具有第一表面，第二表面和在它们之间延伸的至少一个开口。绝缘插入件具有从其延伸的至少一个突起的基部。绝缘插入件与导电插座基板配合，使得至少一个突起位于相应的导电插座衬底开口内。绝缘插入件还包括多个通孔，其中多个通孔中的至少一个延伸穿过绝缘基底并穿过绝缘插入物突起，其中触点可以设置在通孔内。

9. 发明授权

US09474147B2 Socket for semiconductor component, printed circuit board unit, and information processing apparatus 有权
标题翻译：用于半导体元件的插座，印刷电路板单元和信息处理设备
公开(公告)号：US09474147B2
公开(公告)日：2016-10-18
申请号：US14684470
申请日：2015-04-13
申请人： FUJITSU LIMITED
发明人： Yasushi Masuda , Akira Tamura , Yoshihiro Morita , Satoshi Ohsawa
IPC分类号： H01R12/00 , H05K1/02 , H01R12/70 , H01R13/6588 , H05K7/10 , H01R12/52 , H01R13/24
CPC分类号： H05K1/0216 , H01R9/096 , H01R12/52 , H01R12/7076 , H01R12/7082 , H01R13/2435 , H01R13/6588 , H05K7/1069
摘要： A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.
摘要翻译：所公开的用于半导体部件的插座包括具有第一主表面和第二主表面的板状绝缘体，其中形成在绝缘体中的通孔，插入在通孔中的端子，该端子被配置为连接到所述半导体部件的信号电极，并且具有被配置为连接到印刷电路板的信号电极的另一端以及掩埋在所述绝缘体中以从所述端子的侧面包围所述端子的屏蔽，所述屏蔽包括第一接触从所述第一主表面突出并且被配置为连接到所述半导体部件的接地电极，以及从所述第二主表面突出并被配置为连接到所述印刷电路板的接地电极的第二接触。

10. 发明申请

US20160242306A1 MOUNTING MEMBER AND SOCKET FOR ELECTRIC COMPONENT 有权
标题翻译：电气部件安装座和插座
公开(公告)号：US20160242306A1
公开(公告)日：2016-08-18
申请号：US15025101
申请日：2014-09-22
申请人： ENPLAS CORPORATION
发明人： Yuki UEYAMA
IPC分类号： H05K7/10 , H05K1/18
CPC分类号： H05K7/1069 , H05K1/18
摘要： To improve a seating property of a mounting member with respect to a supporting member and enhance the positional accuracy of the mounting member. The mounting member has a protruding portion that protrudes from a support face of a frame body, and a shaft body that is thinner than the protruding portion. At a base portion of the shaft body, a relief recess is formed over the entire circumference of a boundary region with the protruding portion, and a supported face of the protruding portion is configured so as to contact with a support face of the frame body in a state in which the mounting member is supported by the frame body. In a preferred embodiment of the present invention, the mounting member is used as a guide pin of a floating plate that accommodates an IC socket.
摘要翻译：为了提高安装部件相对于支撑部件的安放性，提高了安装部件的位置精度。安装构件具有从框体的支撑面突出的突出部和比突出部更薄的轴体。在轴体的基部，在与突出部分的边界区域的整个圆周上形成有凹槽，突出部分的支撑面被构造成与框体的支撑面接触其中安装构件由框架体支撑的状态。在本发明的优选实施例中，安装构件用作容纳IC插座的浮动板的引导销。

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