专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08664562B2 Systems and methods for forming apertures in microfeature workpieces 有权
标题翻译：用于在微型工件中形成孔的系统和方法
公开(公告)号：US08664562B2
公开(公告)日：2014-03-04
申请号：US11414999
申请日：2006-05-01
申请人： Charles M. Watkins , William M. Hiatt
发明人： Charles M. Watkins , William M. Hiatt
IPC分类号： B23K26/38
CPC分类号： B23K26/382 , B23K26/03 , B23K26/0342 , B23K26/361 , B23K26/362 , B23K26/38 , B23K26/40 , B23K2101/40 , B23K2103/50 , B23K2103/56 , H01L21/486 , H01L21/76898 , H05K3/0026 , H05K2203/163 , Y10T29/49165
摘要： Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.
摘要翻译：本文公开了用于在微特征工件中形成孔的系统和方法。在一个实施例中，一种方法包括将激光束引向微特征工件以形成孔径并且感测激光束实时地通过微特征工件。该方法还可以包括确定激光束的脉冲数量和/或经过的时间以形成孔径并且基于所确定的脉冲数量和/或确定的经过时间来控制激光束以形成第二孔径微特工件。

2. 发明申请

US20120298950A1 LIGHT EMITTING DEVICES WITH BUILT-IN CHROMATICITY CONVERSION AND METHODS OF MANUFACTURING 有权
标题翻译：具有内置色度转换的发光装置和制造方法
公开(公告)号：US20120298950A1
公开(公告)日：2012-11-29
申请号：US13116366
申请日：2011-05-26
申请人： Cem Basceri , Thomas Gehrke , Charles M. Watkins
发明人： Cem Basceri , Thomas Gehrke , Charles M. Watkins
IPC分类号： H01L33/04 , H01L33/58 , H01L33/02
CPC分类号： H01L33/0075 , H01L33/005 , H01L33/06 , H01L33/08 , H01L33/38 , H01L33/502 , H01L33/508 , H01L2933/0033 , H01L2933/0041
摘要： Various embodiments of light emitting devices with built-in chromaticity conversion and associated methods of manufacturing are described herein. In one embodiment, a method for manufacturing a light emitting device includes forming a first semiconductor material, an active region, and a second semiconductor material on a substrate material in sequence, the active region being configured to produce a first emission. A conversion material is then formed on the second semiconductor material. The conversion material has a crystalline structure and is configured to produce a second emission. The method further includes adjusting a characteristic of the conversion material such that a combination of the first and second emission has a chromaticity at least approximating a target chromaticity of the light emitting device.
摘要翻译：本文描述了具有内置色度转换和相关制造方法的发光器件的各种实施例。在一个实施例中，制造发光器件的方法包括依次在衬底材料上形成第一半导体材料，有源区和第二半导体材料，所述有源区被配置为产生第一发射。然后在第二半导体材料上形成转换材料。转换材料具有晶体结构并且被配置为产生第二发射。该方法还包括调整转换材料的特性，使得第一和第二发射的组合具有至少近似于发光器件的目标色度的色度。

3. 发明申请

US20110217800A1 METHOD FOR FORMING A LIGHT CONVERSION MATERIAL 有权
标题翻译：形成光转换材料的方法
公开(公告)号：US20110217800A1
公开(公告)日：2011-09-08
申请号：US12716014
申请日：2010-03-02
申请人： Charles M. Watkins , Kevin Tetz , Thomas Gehrke
发明人： Charles M. Watkins , Kevin Tetz , Thomas Gehrke
IPC分类号： H01L21/56 , B05C11/02
CPC分类号： H01L33/44 , H01L33/507 , H01L2933/0041
摘要： A method and system for manufacturing a light conversion structure for a light emitting diode (LED) is disclosed. The method includes forming a transparent, thermally insulating cover over an LED chip. The method also includes dispensing a conversion material onto the cover to form a conversion coating on the cover, and encapsulating the LED, the silicone cover, and the conversion coating within an encapsulant. Additional covers and conversion coatings can be added.
摘要翻译：公开了一种用于制造发光二极管（LED）的光转换结构的方法和系统。该方法包括在LED芯片上形成透明的隔热盖。该方法还包括将转换材料分配到盖上以在盖上形成转化涂层，并且将密封剂中的LED，硅树脂盖和转化膜封装。可以添加额外的盖子和转换涂层。

4. 发明申请

US20110217794A1 MICROELECTRONIC WORKPIECE PROCESSING SYSTEMS AND ASSOCIATED METHODS OF COLOR CORRECTION 有权
标题翻译：微电子工件加工系统及相关的颜色校正方法
公开(公告)号：US20110217794A1
公开(公告)日：2011-09-08
申请号：US12715820
申请日：2010-03-02
申请人： Kevin Tetz , Charles M. Watkins
发明人： Kevin Tetz , Charles M. Watkins
IPC分类号： H01L21/66 , B05C11/00
CPC分类号： H01L33/005 , B05C11/00
摘要： Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
摘要翻译：本文公开了半导体系统的几个实施例和颜色校正的相关联的方法。在一个实施例中，一种制造发光二极管（LED）的方法包括在衬底上形成（LED），测量形成的LED的基极发射特性，并且基于所形成的LED的测量的基极发射特性来选择荧光体使得来自LED和磷光体的组合发射至少近似于白光。该方法还包括通过例如喷墨印刷将所选择的荧光体引入到LED上。

5. 发明授权

US07858429B2 Packaged microelectronic imagers and methods of packaging microelectronic imagers 有权
标题翻译：封装的微电子成像器和包装微电子成像器的方法
公开(公告)号：US07858429B2
公开(公告)日：2010-12-28
申请号：US11863087
申请日：2007-09-27
申请人： Salman Akram , Charles M. Watkins , Kyle K. Kirby , Alan G. Wood , William M. Hiatt
发明人： Salman Akram , Charles M. Watkins , Kyle K. Kirby , Alan G. Wood , William M. Hiatt
IPC分类号： H01L21/00 , G02F1/13
CPC分类号： H01L27/146 , H01L21/76898 , H01L27/14618 , H01L27/148 , H01L31/02016 , H01L2224/48227 , H01L2924/01046 , H01L2924/01066 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microelectronic substrate, an integrated circuit, and an image sensor electrically coupled to the integrated circuit. A bond-pad is carried by the substrate and electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the substrate and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad, a dielectric liner deposited into the passage and in contact with the substrate, first and second conductive layers deposited onto at least a portion of the dielectric liner, and a conductive fill material deposited into the passage over at least a portion of the second conductive layer and electrically coupled to the bond-pad.
摘要翻译：本文公开了微电子成像器，用于封装微电子成像器的方法，以及用于在微电子成像器中形成导电晶片间互连的方法。在一个实施例中，微电子成像管芯可以包括微电子衬底，集成电路和电耦合到集成电路的图像传感器。接合焊盘由衬底承载并电耦合到集成电路。导电晶片互连延伸穿过衬底并与接合焊盘接触。互连可以包括完全延伸穿过衬底和接合焊盘的通道，沉积到通道中并与衬底接触的电介质衬垫，沉积在电介质衬垫的至少一部分上的第一和第二导电层以及导电在第二导电层的至少一部分上沉积到通道中并且电耦合到接合焊盘的填充材料。

6. 发明授权

US07683458B2 Through-wafer interconnects for photoimager and memory wafers 失效
标题翻译：用于光刻机和存储晶圆的透晶片互连
公开(公告)号：US07683458B2
公开(公告)日：2010-03-23
申请号：US11924781
申请日：2007-10-26
申请人： Salman Akram , Charles M. Watkins , William M. Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
发明人： Salman Akram , Charles M. Watkins , William M. Hiatt , David R. Hembree , James M. Wark , Warren M. Farnworth , Mark E. Tuttle , Sidney B. Rigg , Steven D. Oliver , Kyle K. Kirby , Alan G. Wood , Lu Velicky
IPC分类号： H01L23/485
CPC分类号： H01L21/76877 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/45 , H01L27/14634 , H01L27/14636 , H01L2221/6834 , H01L2224/02166 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
摘要翻译：公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

7. 发明授权

US07442643B2 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials 有权
标题翻译：使用有机金属层和可流动的可固化导电材料形成导电元件的方法
公开(公告)号：US07442643B2
公开(公告)日：2008-10-28
申请号：US11336540
申请日：2006-01-20
申请人： Alan G. Wood , Warren M. Farnworth , Charles M. Watkins , Peter A. Benson
发明人： Alan G. Wood , Warren M. Farnworth , Charles M. Watkins , Peter A. Benson
IPC分类号： H01L21/44 , H01L23/58
CPC分类号： H01L27/14685 , B33Y10/00 , B33Y80/00 , H01L21/56 , H01L23/3128 , H01L27/14618 , H01L27/14627 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01027 , H01L2924/01046 , H01L2924/12041
摘要： A conductive element is formed on a substrate by forming an organometallic layer on at least a portion of a surface of the substrate, heating a portion of the organometallic layer, and removing an unheated portion of the organometallic layer. In other methods, a flowable, uncured conductive material may be deposited on a surface of the substrate, the flowable, uncured conductive material may be selectively cured over at least a portion of the surface of the substrate, and a portion of the cured conductive material may be removed. A conductive via is formed by forming a hole at least partially through a thickness of a substrate, depositing an organometallic material within at least a portion of the hole, and selectively heating at least a portion of the organometallic material.
摘要翻译：通过在基板表面的至少一部分上形成有机金属层，加热部分有机金属层，去除有机金属层的未加热部分，在基板上形成导电元件。在其他方法中，可流动的未固化的导电材料可以沉积在基底的表面上，可流动的未固化的导电材料可以选择性地固化在基底表面的至少一部分上，并且一部分固化的导电材料可能被删除。通过至少部分地穿过衬底的厚度形成孔，在孔的至少一部分内沉积有机金属材料并选择性地加热至少一部分有机金属材料来形成导电通孔。

8. 发明授权

US07439169B2 Integrated circuit and methods of redistributing bondpad locations 失效
标题翻译：集成电路和重新分配键盘位置的方法
公开(公告)号：US07439169B2
公开(公告)日：2008-10-21
申请号：US11445813
申请日：2006-06-02
申请人： Charles M. Watkins
发明人： Charles M. Watkins
IPC分类号： H01L21/00
CPC分类号： H01L23/525 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： Integrated circuits and methods of redistributing bondpad locations are disclosed. In one implementation, a method of redistributing a bondpad location of an integrated circuit includes providing an integrated circuit comprising an inner lead bondpad. A first insulative passivation layer is formed over the integrated circuit. A bondpad-redistribution line is formed over the first insulative passivation layer and in electrical connection with the inner lead bondpad through the first insulative passivation layer. The bondpad-redistribution line includes an outer lead bondpad area. A second insulative passivation layer is formed over the integrated circuit and the bondpad-redistribution line. The second insulative passivation layer is formed to have a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of the bondpad-redistribution line. Other aspects and implementations are contemplated.
摘要翻译：公开了重新分配焊盘位置的集成电路和方法。在一个实现中，重新分配集成电路的接合板位置的方法包括提供包括内部引线接合板的集成电路。在集成电路上形成第一绝缘钝化层。在第一绝缘钝化层上形成键合 - 再分配线，并通过第一绝缘钝化层与内部引线键合电连接。键盘 - 再分配线包括外部引线键合区域。第二绝缘钝化层形成在集成电路和键合 - 再分配线上。第二绝缘钝化层形成为具有侧壁轮廓，其侧面轮廓的至少一部分接近并符合键合 - 再分配线的至少一部分。考虑了其他方面和实现。

9. 发明授权

US07265330B2 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 有权
标题翻译：具有光学器件的微电子成像器和制造这种微电子成像器的方法
公开(公告)号：US07265330B2
公开(公告)日：2007-09-04
申请号：US11476015
申请日：2006-06-28
申请人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
发明人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
IPC分类号： H01L27/00 , H01L31/0232
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
摘要翻译：微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。微电子成像器组件还包括相对于成像管芯叠加的光学支架。光学支撑件可以直接在基板上或衬底上的盖上。单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

10. 发明授权

US07148715B2 Systems and methods for testing microelectronic imagers and microfeature devices 有权
公开(公告)号：US07148715B2
公开(公告)日：2006-12-12
申请号：US10860699
申请日：2004-06-02
申请人： Salman Akram , William M. Hiatt , Alan G. Wood , Charles M. Watkins , Kyle K. Kirby
发明人： Salman Akram , William M. Hiatt , Alan G. Wood , Charles M. Watkins , Kyle K. Kirby
IPC分类号： G01R31/02 , G01R31/26 , H01L27/00
CPC分类号： G01R31/2635 , G01R31/2831
摘要： Systems and methods for testing microelectronic imagers and microfeature devices are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece including a substrate having a front side, a backside, and a plurality of microelectronic dies. The individual dies include an integrated circuit and a plurality of contact pads at the backside of the substrate operatively coupled to the integrated circuit. The method includes contacting individual contact pads with corresponding pins of a probe card. The method further includes testing the dies. In another embodiment, the individual dies can further comprise an image sensor at the front side of the substrate and operatively coupled to the integrated circuit. The image sensors are illuminated while the dies are tested.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式