专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US09474158B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US09474158B2
公开(公告)日：2016-10-18
申请号：US14329453
申请日：2014-07-11
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Takeshi Furusawa , Keisuke Shimizu , Yuichi Nakamura
IPC分类号： H05K1/18 , H05K3/46 , H01L23/00 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/34 , H01L21/56
CPC分类号： H05K1/185 , H01L21/568 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/73267 , H01L2224/83005 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/15311 , H01L2924/1533 , H01L2924/18162 , H01L2924/19105 , H05K1/0203 , H05K1/113 , H05K3/0097 , H05K3/3489 , H05K3/4602 , H05K3/4673 , H05K2201/068 , H05K2201/094 , H05K2203/1536 , H05K2203/308 , H01L2224/19
摘要： A wiring board includes a first resin insulation layer, an electronic component positioned on first surface of the first insulation layer, a second resin insulation layer formed on the first surface of the first insulation layer such that the second insulation layer is embedding the electronic component, a conductive layer formed on the second insulation layer, a third resin insulation layer formed on the conductive layer and second insulation layer, and a connection via conductor formed in the second insulation layer such that the connection via conductor is connecting electrode of the electronic component and conductive layer on the second insulation layer. The first insulation layer has a pad structure on second surface side of the first insulation layer on opposite side of the first surface, and the first insulation layer has coefficient of thermal expansion set lower than coefficients of thermal expansion of the second and third insulation layers.
摘要翻译：布线板包括第一树脂绝缘层，位于第一绝缘层的第一表面上的电子部件，形成在第一绝缘层的第一表面上的第二树脂绝缘层，使得第二绝缘层嵌入电子部件，形成在第二绝缘层上的导电层，形成在导电层和第二绝缘层上的第三树脂绝缘层和形成在第二绝缘层中的连接通孔导体，使得连接通孔导体是电子部件的连接电极和第二绝缘层上的导电层。第一绝缘层在第一绝缘层的与第一表面相对的第二表面侧具有衬垫结构，第一绝缘层的热膨胀系数设定为低于第二绝缘层和第三绝缘层的热膨胀系数。

12. 发明授权

US09439289B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US09439289B2
公开(公告)日：2016-09-06
申请号：US13687016
申请日：2012-11-28
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Yukinobu Mikado , Toyotaka Shimabe , Shinobu Kato
IPC分类号： H05K1/02 , H05K1/18 , H05K3/10 , H05K3/30 , H05K1/11 , H01L23/00 , H05K3/46
CPC分类号： H05K1/186 , H01L24/19 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92144 , H01L2924/15153 , H05K1/0296 , H05K1/111 , H05K1/116 , H05K1/185 , H05K3/10 , H05K3/30 , H05K3/306 , H05K3/4697 , H05K2201/10636 , Y02P70/611 , Y10T29/49146
摘要： A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate.
摘要翻译：布线基板包括具有多个开口部分和分离开口部分的一个或多个边界部分的基板，分别位于基板的开口部分中的多个电子装置，形成在边界部分的表面上的导电图案，以及形成在基板上的绝缘层和基板的边界部分上的导电图案，使得绝缘层覆盖基板的开口部分中的电子器件。

13. 发明申请

US20160095215A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20160095215A1
公开(公告)日：2016-03-31
申请号：US14865050
申请日：2015-09-25
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani
IPC分类号： H05K1/09 , H05K3/07 , H05K1/11
CPC分类号： H05K1/09 , H05K1/0265 , H05K3/0097 , H05K3/4652 , H05K2201/0376 , H05K2201/096 , H05K2201/09727 , H05K2203/1536
摘要： A printed wiring board includes a resin insulating layer, and a first conductor layer including a fine wiring pattern and a thick-film wiring pattern. The fine wiring pattern is embedded in the resin insulating layer such that the fine wiring pattern has an exposed surface exposed on a first surface of the resin insulating layer. The thick-film wiring pattern includes an embedded wiring portion and a thick-film wiring portion such that the embedded wiring portion is embedded in the resin insulating layer and the thick-film wiring portion is projecting from the first surface of the resin insulating layer. The embedded wiring portion of the thick-film wiring pattern has a line width which is greater than a line width of the fine wiring pattern.
摘要翻译：印刷电路板包括树脂绝缘层和包括精细布线图案和厚膜布线图案的第一导体层。精细布线图案嵌入在树脂绝缘层中，使得精细布线图案具有暴露在树脂绝缘层的第一表面上的暴露表面。厚膜布线图案包括嵌入布线部分和厚膜布线部分，使得嵌入布线部分嵌入在树脂绝缘层中，并且厚膜布线部分从树脂绝缘层的第一表面突出。厚膜布线图形的嵌入布线部分的线宽大于精细布线图案的线宽。

14. 发明授权

US09232656B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US09232656B2
公开(公告)日：2016-01-05
申请号：US14175128
申请日：2014-02-07
申请人： IBIDEN CO., LTD.
发明人： Yukinobu Mikado , Mitsuhiro Tomikawa , Yusuke Tanaka , Toshiki Furutani
IPC分类号： H05K1/18 , H01L23/498 , H01L23/50 , H01L23/00 , H05K3/30 , H05K3/46
CPC分类号： H05K1/185 , H01L23/49822 , H01L23/50 , H01L24/19 , H01L2224/04105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2924/12042 , H01L2924/15153 , H05K3/306 , H05K3/4602 , H05K2201/10015 , H05K2201/1003 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , Y10T29/49139 , H01L2924/00
摘要： A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion such that the electronic devices are arrayed in the lateral direction of each of the electronic devices, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.
摘要翻译：布线板包括具有开口部分的基板，位于开口部分中的多个电子装置，使得电子装置沿每个电子装置的横向方向排列;以及绝缘层，其形成在基板上，使得绝缘层覆盖基板的开口部分中的电子器件。衬底具有限定开口部分的壁表面，并且形成为使得开口部分被部分分隔并且电子器件保持彼此接触。

15. 发明申请

US20140216800A1 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT 有权
标题翻译：配有电子元器件的接线板
公开(公告)号：US20140216800A1
公开(公告)日：2014-08-07
申请号：US14168414
申请日：2014-01-30
申请人： Ibiden Co., Ltd.
发明人： Masahiro ZANMA , Masafumi Niwa , Toshiki Furutani
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H05K3/007 , H05K3/4602 , H05K3/4644
摘要： A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 μm and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode.
摘要翻译：具有内置电子部件的布线基板包括厚度不超过300μm的芯基板，在芯基板的表面具有开口的空腔，厚度不超过300μm的电子部件，芯基板的空腔，以及形成在芯基板的表面上并且包括绝缘树脂层和布线层的层叠结构，使得层叠结构覆盖芯基板的空腔的开口和容纳在芯基板中的电子部件核心衬底的腔体。电子部件具有绝缘材料体和形成在绝缘材料体的表面上的电极，并且层叠结构的布线层形成为使得布线层的厚度设定为小于电极的厚度。

16. 发明申请

US20140133119A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20140133119A1
公开(公告)日：2014-05-15
申请号：US14160766
申请日：2014-01-22
申请人： IBIDEN CO., LTD.
发明人： Takashi Kariya , Toshiki Furutani
IPC分类号： H05K1/02 , H05K3/00 , H05K3/46
CPC分类号： H05K1/0298 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L2224/16225 , H01L2224/1703 , H01L2924/15151 , H01L2924/15311 , H05K1/181 , H05K1/182 , H05K3/0047 , H05K3/4602 , H05K3/4623 , H05K3/4644 , H05K2201/10159 , H05K2201/10363 , H05K2201/10522 , H05K2201/1053 , H05K2201/10674 , Y02P70/611 , Y10T29/49155 , Y10T29/49165
摘要： A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the fist substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including conductive circuits for being connected to semiconductor elements, a filler filling the opening portion such that the interposer is held in the opening portion of the built-up layer, and mounting pads formed on the first substrate and positioned to mount the semiconductor elements. The mounting pads are positioned to form a matrix on the first substrate.
摘要翻译：布线基板包括具有穿透第一基板的穿透孔的第一基板，形成在第一基板的表面上并且包括层间树脂绝缘层和布线层的积层，所述积层具有连通的开口部与第一基板的贯通孔相通并且向构成层的最外表面开放，插入到容纳在积层的开口部分的内插件，并且包括形成在第二基板上的第二基板和布线层，所述插入器的布线层包括用于连接到半导体元件的导电电路，填充所述开口部的填充物，使得所述插入件保持在所述积层的开口部中，以及安装焊盘，其形成在所述第一基板上并且被定位成安装半导体元件。定位安装垫以在第一基板上形成矩阵。

17. 发明申请

US20130215586A1 WIRING SUBSTRATE 审中-公开
标题翻译：接线基板
公开(公告)号：US20130215586A1
公开(公告)日：2013-08-22
申请号：US13690689
申请日：2012-11-30
申请人： IBIDEN Co., Ltd.
发明人： Takeshi Furusawa , Shinobu Kato , Toshiki Furutani
IPC分类号： H05K1/18
CPC分类号： H05K1/184 , H01L23/3677 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L2224/16 , H01L2224/73204 , H05K1/0206 , H05K1/113 , H05K1/115 , H05K3/4644 , H05K2201/096
摘要： A wiring substrate includes a motherboard including insulation layers, conductive layers and interlayer connection conductors, a packaging substrate mounted to the motherboard and having through-hole conductors, pads positioned to mount a semiconductor, uppermost via conductors connecting the through-hole conductors and the pads for the semiconductor, pads positioned to connect a motherboard and lowermost via conductors connecting the through-hole conductors and the pads for the motherboard, and bonding members interposed between the motherboard and packaging substrate and connecting the pads for the motherboard and an outermost conductive layer of the motherboard facing the packaging substrate. The pads for the motherboard, lowermost via conductors, through-hole conductors, uppermost via conductors, bonding members and interlayer connection conductors include a pad, a lowermost via conductor, a through-hole conductor, a bonding member and a stacked interlayer connection conductor structure which are positioned to align in a straight line.
摘要翻译：布线基板包括：主板，包括绝缘层，导电层和层间连接导体，安装在母板上并具有通孔导体的封装基板，定位成安装半导体的焊盘，最上层通孔导体，连接通孔导体和焊盘对于半导体，定位成连接主板和连接通孔导体和用于母板的焊盘的最下通孔导体的焊盘以及插入在母板和封装衬底之间的接合构件并且连接用于母板的焊盘和最外层的导电层主板面向封装基板。用于母板，最下通孔导体，通孔导体，最上通孔导体，接合部件和层间连接导体的焊盘包括焊盘，最下通孔导体，通孔导体，接合部件和层叠的层间连接导体结构其被定位成直线对准。

18. 发明授权

US10745819B2 Printed wiring board, semiconductor package and method for manufacturing printed wiring board 有权
公开(公告)号：US10745819B2
公开(公告)日：2020-08-18
申请号：US15958332
申请日：2018-04-20
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Yuki Yoshikawa
IPC分类号： H05K3/46 , H05K3/18 , H05K1/11 , H05K1/02 , C25D7/12 , C25D5/02 , C23C18/16 , C25D5/48 , H05K1/03 , C25D7/00
摘要： A printed wiring board includes a core laminate including insulating layers and conductor layers, a first build-up layer formed on first surface of the laminate and including first interlayer resin and conductor layers, and a second build-up layer formed on second surface of the core laminate on the opposite side and including second interlayer resin and conductor layers. The conductor layers in the laminate include first and second conductor layers such that the first conductor layer is embedded in one of the insulating layers forming the first surface of the laminate and has an exposed surface exposed from the insulating layer and that the second conductor layer is formed on one of the insulating layers forming the second surface of the laminate, and the first interlayer resin layer has thickness greater than thickness of the second interlayer resin layer.

19. 发明授权

US10645819B2 Printed wiring board 有权
公开(公告)号：US10645819B2
公开(公告)日：2020-05-05
申请号：US16233210
申请日：2018-12-27
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Takema Adachi , Toshihide Makino , Yasushi Usami
IPC分类号： H05K1/18 , H05K3/46 , H05K1/11
CPC分类号： H05K3/4608 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/4602 , H05K3/4655 , H05K3/4697 , H05K3/4652 , H05K2201/10636 , H05K2203/0191 , H05K2203/1469
摘要： A printed wiring board includes a core substrate having cavity to accommodate an electronic component and including a front conductor layer formed on front side of the core substrate, and a back conductor layer formed on back side of the core substrate, through-hole conductors formed through the core substrate such that the through-hole conductors connect the front and back conductor layers of the core substrate, a front build-up layer formed on front surface of the core substrate and including interlayer insulating layers and conductor layers, and a back build-up layer formed on back surface of the core substrate and including interlayer insulating layers and conductor layers. The conductor layers in the front build-up layer include a conductor layer sandwiching one of the interlayer insulating layers with the front conductor layer such that the conductor layer and the front conductor layer have the same electric potential in region surrounding the cavity.

20. 发明申请

US20190200462A1 PRINTED WIRING BOARD 审中-公开
公开(公告)号：US20190200462A1
公开(公告)日：2019-06-27
申请号：US16233210
申请日：2018-12-27
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Takema Adachi , Toshihide Makino , Yasushi Usami
IPC分类号： H05K3/46 , H05K1/11 , H05K1/18
CPC分类号： H05K3/4608 , H05K1/115 , H05K1/183 , H05K3/4655 , H05K3/4697
摘要： A printed wiring board includes a core substrate having cavity to accommodate an electronic component and including a front conductor layer formed on front side of the core substrate, and a back conductor layer formed on back side of the core substrate, through-hole conductors formed through the core substrate such that the through-hole conductors connect the front and back conductor layers of the core substrate, a front build-up layer formed on front surface of the core substrate and including interlayer insulating layers and conductor layers, and a back build-up layer formed on back surface of the core substrate and including interlayer insulating layers and conductor layers. The conductor layers in the front build-up layer include a conductor layer sandwiching one of the interlayer insulating layers with the front conductor layer such that the conductor layer and the front conductor layer have the same electric potential in region surrounding the cavity.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式