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21. 发明申请

US20120188682A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20120188682A1
公开(公告)日：2012-07-26
申请号：US13354369
申请日：2012-01-20
申请人： Koji SATO , Yukio SANADA , Makoto OGAWA , Yasuhiro NISHISAKA
发明人： Koji SATO , Yukio SANADA , Makoto OGAWA , Yasuhiro NISHISAKA
IPC分类号： H01G4/008 , H01C7/13 , H01L41/047 , H01F5/00
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1≦t/d≦0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.
摘要翻译：陶瓷电子部件包括陶瓷体，第一外部电极和第二外部电极。第一外部电极和第二外部电极被设置在陶瓷体的朝向安装面侧的主面上，以便在它们之间以预定的间隙区域彼此面对。外部电极各自包括基层和覆盖基层的Cu镀层。在第一外部电极和第二外部电极中的每一个中，满足表达式0.1＆nlE; t / d＆nlE; 0.5，其中t是在间隙区域侧的基底层的端部处的Cu镀层的厚度，d是从间隙区域侧的基底层的端部到间隙区域侧的Cu镀层的端部的距离。

22. 发明申请

US20120018205A1 METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT, AND WIRING BOARD 有权
标题翻译：制造陶瓷电子元件，陶瓷电子元器件和接线板的方法
公开(公告)号：US20120018205A1
公开(公告)日：2012-01-26
申请号：US13184607
申请日：2011-07-18
申请人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
发明人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
IPC分类号： H05K1/18 , H01C7/02 , H01C7/13
CPC分类号： H05K1/183 , H01C1/14 , H01C7/008 , H01C7/02 , H01F27/2804 , H01F2027/2809 , H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/228 , H01L41/083 , H05K1/186 , H05K3/321 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10439 , H05K2201/10636 , Y02P70/611 , Y10T29/49085 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
摘要： A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
摘要翻译：陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。在每个陶瓷生片的表面上形成第一导电糊层。层叠陶瓷生片以形成原料陶瓷层叠体。在原料陶瓷层叠体的表面上形成第二导电糊层。形成有第二导电膏层的原料陶瓷层叠体被烧制。

23. 发明申请

US20110290542A1 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US20110290542A1
公开(公告)日：2011-12-01
申请号：US13115243
申请日：2011-05-25
申请人： Yasuhiro NISHISAKA , Yukio SANADA , Koji SATO , Seiichi MATSUMOTO
发明人： Yasuhiro NISHISAKA , Yukio SANADA , Koji SATO , Seiichi MATSUMOTO
IPC分类号： H05K1/09 , B05D3/02 , B05D5/12
CPC分类号： H05K1/182 , H01C7/008 , H01F27/28 , H01F27/2804 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083 , H01L41/1876
摘要： A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
摘要翻译：陶瓷电子部件包括陶瓷元件组件和外部电极。外部电极设置在陶瓷元件组件上。外部电极包括下面的电极层和第一个Cu镀膜。底层电极层设置在陶瓷元件组件上。第一Cu镀膜设置在下面的电极层上。底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

24. 发明授权

US07699020B2 Method and device for applying conductive paste 有权
标题翻译：用于涂敷导电膏的方法和装置
公开(公告)号：US07699020B2
公开(公告)日：2010-04-20
申请号：US10927321
申请日：2004-08-27
申请人： Yukio Sanada , Takeshi Ohkura , Hirokazu Naito
发明人： Yukio Sanada , Takeshi Ohkura , Hirokazu Naito
IPC分类号： B05C13/00
CPC分类号： H01C1/148 , H01G4/232 , H01G13/006 , H01L21/4853
摘要： A tabular holding jig has a plurality of holding holes whose side walls are made from an elastic material. When electronic parts are inserted into the holding holes of the holding jig, deflection of the holding jig is prevented by (a) disposing an intermediate plate between the holding jig and a base plate, or (b) using a base plate having a stepped portion with a raised surface that covers an area of the holding jig where the plurality of holding holes is formed.
摘要翻译：平板状保持夹具具有多个保持孔，其侧壁由弹性材料制成。当将电子部件插入保持夹具的保持孔中时，通过（a）在保持夹具和基板之间设置中间板，或（b）使用具有阶梯部的基板来防止保持夹具的偏转具有覆盖形成有多个保持孔的保持夹具的区域的凸起表面。

25. 发明授权

US06197221B1 Electrically conductive paste and electronic element 有权
公开(公告)号：US06197221B1
公开(公告)日：2001-03-06
申请号：US09262572
申请日：1999-03-04
申请人： Yukio Sanada , Hiromasa Takahashi , Shinichiro Kuroiwa , Masaki Fujiyama , Kunihiko Hamada , Akira Otani
发明人： Yukio Sanada , Hiromasa Takahashi , Shinichiro Kuroiwa , Masaki Fujiyama , Kunihiko Hamada , Akira Otani
IPC分类号： H01B106
CPC分类号： H01G4/0085 , H01B1/16
摘要： An electrically conductive paste which ensures formation of a dense electrode film even in a low-oxygen-concentration atmosphere without strict control of the atmosphere is described. The electrically conductive paste comprising Cu powder, glass frit and an organic binder resin, wherein the glass frit comprises Zn- and Cu-containing borosilicate glass and in the melt state has a contact angle with respect to Cu of 90° or less as measured in a nitrogen atmosphere.

26. 发明授权

US5781402A Conducting thick film composition, thick film electrode, ceramic electronic component and laminated ceramic capacitor 失效
标题翻译：传导厚膜组合物，厚膜电极，陶瓷电子元件和层压陶瓷电容器
公开(公告)号：US5781402A
公开(公告)日：1998-07-14
申请号：US578105
申请日：1995-12-26
申请人： Masaki Fujiyama , Yukio Sanada , Shuji Mushimoto, deceased
发明人： Masaki Fujiyama , Yukio Sanada , Shuji Mushimoto, deceased
IPC分类号： B22F1/00 , C09D5/24 , C22C32/00 , H01B1/00 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/09 , H01G4/06 , B22F7/04 , H01G4/008
CPC分类号： H01G4/2325 , B22F1/0007 , C22C32/0089 , H05K1/092 , B22F2999/00 , Y10T428/12014 , Y10T428/1209
摘要： A conducting thick film composition, a thick film electrode made by sintering this composition, and a ceramic electronic component and a laminated ceramic capacitor in which this thick film electrode is used of which the electrical reliability are improved by the strength of the bond between the ceramic substrate and a thick film electrode being increased by the elimination of blistering and cracking of the electrode during sintering of the composition and the adherence of solder to the electrode being improved by the elimination of glass separation out onto the surface of the electrode during sintering. The conducting thick film composition comprises Cu powder, glass powder and an organic vehicle, the Cu powder comprises spherical powder and scaly powder and the glass powder comprises borosilicate zinc glass and borosilicate barium glass.
摘要翻译：导电厚膜组合物，通过烧结该组合物制成的厚膜电极以及陶瓷电子部件和层叠陶瓷电容器，其中使用该厚膜电极，通过陶瓷之间的结合强度提高电可靠性通过在烧结期间消除电极的起泡和破裂，并且通过在烧结期间消除在电极表面上的玻璃分离来改善焊料对电极的粘附，从而提高了衬底和厚膜电极。导电厚膜组合物包括Cu粉末，玻璃粉末和有机载体，Cu粉末包含球形粉末和鳞片状粉末，玻璃粉末包含硼硅酸锌玻璃和硼硅酸钡玻璃。

27. 发明授权

US08754335B2 Ceramic electronic component and wiring board 有权
标题翻译：陶瓷电子元件及接线板
公开(公告)号：US08754335B2
公开(公告)日：2014-06-17
申请号：US13178530
申请日：2011-07-08
申请人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01G4/232 , H01G4/236 , H01G4/30 , H01L23/49822 , H01L23/50 , H01L2924/0002 , H05K2201/10015 , H05K2203/1469 , H01L2924/00
摘要： A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.
摘要翻译：陶瓷电子部件包括具有大致长方体形状的陶瓷元件体以及第一外部电极和第二外部电极。第一和第二外部电极设置在第一主表面上。第一外部电极和第二外部电极的部分在厚度方向上比其他部分突出。第一外部电极的突出部设置在第一外部电极的长度方向的一端，第二外部电极的第二突出部设置在第二外部电极的长度方向的另一端。因此，在突出部之间设置有凹部，露出第一和第二外部电极之间的第一主面的一部分。

28. 发明授权

US08465830B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08465830B2
公开(公告)日：2013-06-18
申请号：US13118629
申请日：2011-05-31
申请人： Koji Sato , Yukio Sanada , Kosuke Onishi , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Kosuke Onishi , Yasuhiro Nishisaka
IPC分类号： B32B3/00
CPC分类号： H01G4/30 , H01G4/005 , H01G4/01 , H01G4/12 , Y10T428/24752 , Y10T428/24926
摘要： A ceramic electronic component includes a ceramic body having a substantially rectangular parallelpiped shape. The ceramic body includes a central portion in which first and second internal electrodes are arranged, and first and second end portions in which the first and second internal electrodes are not arranged. The ceramic electronic component satisfies Expressions (1) and (2) below: W1>T (1) W2>T (2) where T denotes the dimension of the ceramic body in a thickness direction, W1 denotes the dimension of the first end portion in a width direction, and W2 denotes the dimension of the second end portion in the width direction.
摘要翻译：陶瓷电子部件包括具有大致矩形的平行形状的陶瓷体。陶瓷体包括其中布置有第一和第二内部电极的中心部分，以及未布置第一和第二内部电极的第一和第二端部。陶瓷电子元件满足以下表达式（1）和（2）：W1> T（1）W2> T（2）其中，T表示陶瓷体的厚度方向的尺寸，W1表示第一端部宽度方向，W2表示第二端部在宽度方向上的尺寸。

29. 发明授权

US08144449B2 Electronic component and electronic component built-in substrate 有权
标题翻译：电子元器件和电子元器件内置基板
公开(公告)号：US08144449B2
公开(公告)日：2012-03-27
申请号：US12621655
申请日：2009-11-19
申请人： Kosuke Onishi , Yukio Sanada
发明人： Kosuke Onishi , Yukio Sanada
IPC分类号： H01G5/16 , H01G4/005 , H01G5/01 , H01G4/35
CPC分类号： H01G4/30 , H01G4/232
摘要： An electronic component includes an electronic component main body including opposed first and second main surfaces, opposed first and second side surfaces, and opposed first and second end surfaces and also includes first and second external terminal electrodes disposed on the first main surface. The first and second external terminal electrodes are spaced apart by a gap region. When a dimension in a longitudinal direction being a direction linking the first and second end surfaces of the electronic component main body is L, a dimension in a width direction being a direction linking the first and second side surfaces is W, and a dimension of the gap region along the longitudinal direction is g, W (L−g)/2 are satisfied.
摘要翻译：电子部件包括电子部件主体，其具有相对的第一主面和第二主面，相对的第一和第二侧面以及相对的第一和第二端面，并且还包括设置在第一主表面上的第一外部端子电极和第二外部端子电极。第一外部端子电极和第二外部端子电极间隔开间隙区域。当长度方向上的尺寸是连接电子部件主体的第一和第二端面的方向是L时，宽度方向上的尺寸是连接第一和第二侧面的方向是W，并且尺寸沿长度方向的间隙区域为g，W （L-g）/ 2。

30. 发明申请

US20120018204A1 CERAMIC ELECTRONIC COMPONENT AND WIRING BOARD 有权
标题翻译：陶瓷电子元件和接线板
公开(公告)号：US20120018204A1
公开(公告)日：2012-01-26
申请号：US13178530
申请日：2011-07-08
申请人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
发明人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
IPC分类号： H05K1/16 , H01L41/00 , H01C7/13 , H01G4/12 , H01F5/00
CPC分类号： H05K1/185 , H01G4/232 , H01G4/236 , H01G4/30 , H01L23/49822 , H01L23/50 , H01L2924/0002 , H05K2201/10015 , H05K2203/1469 , H01L2924/00
摘要： A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.
摘要翻译：陶瓷电子部件包括具有大致长方体形状的陶瓷元件体以及第一外部电极和第二外部电极。第一和第二外部电极设置在第一主表面上。第一外部电极和第二外部电极的部分在厚度方向上比其他部分突出。第一外部电极的突出部设置在第一外部电极的长度方向的一端，第二外部电极的第二突出部设置在第二外部电极的长度方向的另一端。因此，在突出部之间设置有凹部，露出第一和第二外部电极之间的第一主面的一部分。

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