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31. 发明申请

US20220106700A1 PLATING APPARATUS 有权
公开(公告)号：US20220106700A1
公开(公告)日：2022-04-07
申请号：US17471609
申请日：2021-09-10
申请人： EBARA CORPORATION
发明人： Kazuhito Tsuji
IPC分类号： C25D17/00 , C25D17/06 , C25D17/02
摘要： Provided is a technique that can suppress remaining of air bubbles on a lower surface of an electric field shielding plate. A plating apparatus 1000 include a plating tank 10, a substrate holder 30, and an electric field shielding plate 60 configured to be arranged in a portion between an anode 50 and a substrate Wf in an inside of the plating tank for shielding a part of an electric field formed between the anode and the substrate. In a top view of the electric field shielding plate, in the inside of the plating tank, an unshielded region 70 that is without shielded by the electric field shielding plate is disposed. An inclined surface is disposed in a lower surface 61a of the electric field shielding plate, the inclined surface is inclined with respect to a horizontal direction and is configured to release an air bubble existing on the lower surface thereof to the unshielded region.

32. 发明申请

US20220093409A1 INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, PROGRAM, AND SUBSTRATE PROCESSING APPARATUS 有权
公开(公告)号：US20220093409A1
公开(公告)日：2022-03-24
申请号：US17425195
申请日：2019-12-04
申请人： EBARA CORPORATION
发明人： Keisuke Namiki , Makoto Fukushima , Osamu Nabeya
IPC分类号： H01L21/306 , G06N3/08 , B24B37/005 , G06N20/00 , G06F17/15
摘要： A system includes a first artificial intelligence unit that performs learning using a plurality of first learning datasets input values of which are sets of parameters different from each other in a combination of parameter types and output values of which are corresponding performance values of the substrate processing apparatus, and after the learning uses, as an input, each of a plurality of verification datasets including combinations of the parameter types that are same as the combinations of the parameter types at the time of learning, to predict a performance value; a selection unit that selects one set of parameter types from a plurality of sets of parameter types included in the plurality of verification datasets, by using at least one of a value indicating a percentage of correct answer of the predicted performance value, a time required for the learning, and a time required for predicting the performance value; and a second artificial intelligence unit that performs learning using a plurality of second learning datasets an input value of which is a set of past parameter values including the selected set of parameter types and an output value of which is a corresponding past performance value, and after the learning, predicts performance values of the target substrate processing apparatus obtained by changing variable parameters among the parameters including the selected set of parameter types with, as an input, a fixed parameter intrinsically determined for a target substrate processing apparatus among parameters including the selected set of parameter types, and outputs a combination of parameter values yielding a performance value, among the predicted performance values, satisfying an extraction criterion.

33. 发明申请

US20220074064A1 COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRODUCING THE COPPER OXIDE SOLID, AND APPARATUS FOR SUPPLYING A PLATING SOLUTION INTO A PLATING TANK 有权
公开(公告)号：US20220074064A1
公开(公告)日：2022-03-10
申请号：US17529769
申请日：2021-11-18
申请人： EBARA CORPORATION
发明人： Junitsu Yamakawa , Chunhui Dou , Risa Kimura , Toshio Yokoyama
IPC分类号： C25D3/38 , C25D7/12 , C25D17/00 , C25D21/14
摘要： The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.

34. 发明申请

US20220072679A1 PAD-TEMPERATURE REGULATING APPARATUS, METHOD OF REGULATING PAD-TEMPERATURE, POLISHING APPARATUS, AND POLISHING SYSTEM 有权
公开(公告)号：US20220072679A1
公开(公告)日：2022-03-10
申请号：US17417294
申请日：2019-12-19
申请人： EBARA CORPORATION
发明人： Toru MARUYAMA
IPC分类号： B24B37/015 , B24B37/20 , B24B49/14
摘要： The present application relates to a pad-temperature regulating apparatus for regulating a temperature of a surface of a polishing pad. The pad-temperature regulating apparatus includes a pad-contact member, a supply system for supplying a heating liquid and a cooling liquid into the pad contact member, a pad-temperature measuring device for measuring the temperature of the surface of the polishing pad, and a controller for performing a PID control of manipulated variables of a first flow control valve and a second flow control valve. The controller includes a memory in which a learned model constructed to maintain a temperature behavior curve, created based on measured values of the pad-temperature measuring device, within a predetermined allowable range, is stored; and a processing device which inputs at least one temperature behavior parameter to the learned model, and performs a calculation to output a change value of PID parameter for the PID control.

35. 发明申请

US20220063056A1 OUTPUT SIGNAL PROCESSING APPARATUS FOR EDDY CURRENT SENSOR 有权
公开(公告)号：US20220063056A1
公开(公告)日：2022-03-03
申请号：US17410099
申请日：2021-08-24
申请人： EBARA CORPORATION
发明人： Atsushi ABE , Taro TAKAHASHI , Hiroaki SHIBUE , Shinpei TOKUNAGA , Katsuhide WATANABE
IPC分类号： B24B49/10 , G01B7/06
摘要： An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.

36. 发明授权

US11221239B2 Substrate processing apparatus and method of detecting indentation formed in substrate 有权
公开(公告)号：US11221239B2
公开(公告)日：2022-01-11
申请号：US16037085
申请日：2018-07-17
申请人： Ebara Corporation
发明人： Zhongxin Wen , Nobuyuki Takahashi , Suguru Sakugawa
IPC分类号： G01D5/46 , B24B37/005 , B24B49/08 , B24B37/04 , B08B3/02 , H01L21/67 , B08B5/02 , H01L21/687 , B24B7/22 , G01D5/42
摘要： A polishing device has a substrate stage which holds a substrate Wf, a processing head which processes a surface of the substrate Wf, an indentation detecting system which detects a position of an indentation in the substrate Wf, a movement mechanism which moves the processing head in a radial direction of the substrate stage, and a rotation mechanism which rotates the substrate stage, and the indentation detecting system has a fluid injection nozzle configured to inject a fluid to a circumferential edge portion of the substrate Wf when the substrate Wf is held on the substrate stage, a fluid measuring device which measures a physical quantity which is pressure or a flow rate of the fluid, and a position detector which detects the position of the indentation formed in the circumferential edge portion of the substrate Wf based on a change in physical quantity.

37. 发明授权

US11217421B2 Adjustment method and electron beam device 有权
公开(公告)号：US11217421B2
公开(公告)日：2022-01-04
申请号：US16879151
申请日：2020-05-20
申请人： EBARA CORPORATION
发明人： Takehide Hayashi , Ryo Tajima , Tatsuya Kohama , Kenji Watanabe , Tsutomu Karimata
IPC分类号： H01J37/147 , H01J37/244 , H01J37/32 , H01J37/14
摘要： An adjustment method for adjusting a path of an electron beam passing through an electron beam device including at least one unit having at least one lens and at least one aligner electrode, and a detector configured to detect the electron beam, the method including: a step of measuring, by a coordinate measuring machine, an assembly tolerance for each of a plurality of the units constituting the electron beam device; a step of determining a shift amount of the electron beam at a position of the at least one of the lenses; a step of determining an electrode condition for each of a plurality of the aligner electrodes included in the units in a manner such that a shift amount of the electron beam is to be the determined shift amount; and a step of setting each of the aligner electrodes to the corresponding determined electrode condition.

38. 发明申请

US20210381521A1 IMPELLER, PUMP HAVING THE IMPELLER, AND METHOD OF PRODUCING THE IMPELLER 有权
公开(公告)号：US20210381521A1
公开(公告)日：2021-12-09
申请号：US17287351
申请日：2019-11-14
申请人： Ebara Corporation
发明人： Miwa HIDEKURA , Ryoken YOMOGIDA
IPC分类号： F04D29/24 , F04D1/00 , B23P15/04
摘要： The impeller (1) includes a main plate (3) formed from a metal plate; and vanes (5) each formed from a metal plate. Each of the vanes (5) has a three-dimensional portion (5A) having a surface inclined with respect to a rotation axis (CA) of the impeller (1) and a two-dimensional portion (5B) having a surface parallel to the rotation axis (CA) of the impeller (1), and the two-dimensional portion (5B) is fixed to the main plate (3) by a first weld (10) formed by projection welding.

39. 发明授权

US11195729B2 Substrate polishing apparatus and method 有权
公开(公告)号：US11195729B2
公开(公告)日：2021-12-07
申请号：US16044137
申请日：2018-07-24
申请人： EBARA CORPORATION
发明人： Yuki Watanabe , Keita Yagi
IPC分类号： H01L21/67 , B24B37/013 , B24B49/05 , B24B37/32 , B24B37/10
摘要： A substrate polishing apparatus includes a top ring for pressing a substrate against a polishing pad to perform substrate polishing; a spectrum generating unit that directs light onto a surface of the substrate of interest for polishing, receives reflected light, and calculates a reflectivity spectrum corresponding to the wavelength of the reflected light; and a storage that stores a plurality of thickness estimating algorithms for estimating the thickness of the polished surface in accordance with the reflectivity spectrum. A plurality of thickness estimating algorithms is selected among the thickness estimating algorithms stored in the storage, and a switching condition is set. The thickness of the polished surface is estimated by using the set thickness estimating algorithms, and if the switching condition is satisfied, the thickness estimating algorithm to be applied is switched.

40. 发明申请

US20210370461A1 POLISHING APPARATUS HAVING SURFACE-PROPERTY MEASURING DEVICE OF POLISHING PAD AND POLISHING SYSTEM 有权
公开(公告)号：US20210370461A1
公开(公告)日：2021-12-02
申请号：US17048674
申请日：2019-04-25
申请人： EBARA CORPORATION
发明人： Keisuke KAMIKI , Toru MARUYAMA , Yasuyuki MOTOSHIMA
IPC分类号： B24B37/005
摘要： The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.

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