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1. 发明申请

US20220402094A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 有权
公开(公告)号：US20220402094A1
公开(公告)日：2022-12-22
申请号：US17776642
申请日：2020-11-02
申请人： Tokyo Electron Limited
发明人： Nobutaka FUKUNAGA , Takeshi MATSUMOTO , Tomohiro KANEKO
IPC分类号： B24B49/05 , H01L21/304 , H01L21/66
摘要： A substrate processing method includes measuring a first thickness distribution of a first substrate in a first one of multiple combined substrates before being subjected to a finishing grinding; measuring a second thickness distribution of the first substrate in a second one of the multiple combined substrates before being subjected to the finishing grinding; deciding a relative inclination between a substrate holder configured to hold the second one of the multiple combined substrates and a grinder configured to perform the finishing grinding on the corresponding combined substrate, based on first difference data between the first thickness distribution and the second thickness distribution; and performing finishing grinding on the first substrate in the second one of the multiple combined substrates while holding the second one of the multiple combined substrates at the inclination which is decided.

2. 发明授权

US11285579B2 Method for producing bearing components 有权
公开(公告)号：US11285579B2
公开(公告)日：2022-03-29
申请号：US16329066
申请日：2017-09-13
申请人： Schaeffler Technologies AG & Co. KG
发明人： Wolfgang Schnabel , Martin Schreiber , Oliver Jung
IPC分类号： B24B49/02 , B24B49/05 , B24B19/06 , B24B51/00 , F16C33/14 , F16C33/64 , F16C43/02 , F16C43/04 , B24B49/03 , F16C41/04 , B24B27/00 , B24B41/00 , F16C17/00 , F16C19/00
摘要： A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

3. 发明申请

US20090247049A1 POST-PROCESS SIZING CONTROL DEVICE FOR GRINDING MACHINE 有权
标题翻译：研磨机后处理尺寸控制装置
公开(公告)号：US20090247049A1
公开(公告)日：2009-10-01
申请号：US12362999
申请日：2009-01-30
申请人： Masaharu INOUE , Tomohisa Yamaguchi
发明人： Masaharu INOUE , Tomohisa Yamaguchi
IPC分类号： B24B49/04 , B24B49/05
CPC分类号： B24B19/125 , B23Q17/20 , B24B5/04 , B24B49/03 , G05B19/401 , G05B2219/37576 , G05B2219/45218
摘要： A post-process sizing control device is provided with origin compensation means for controlling a size measuring device to measure an actual size of a workpiece portion and for compensating the origin of a wheel head by a position compensation amount which corresponds to a difference between the actual size and a theoretical size derived from calculation and size measuring interval setting means for setting the number of workpieces which should be ground during the next size measuring interval which begins after the preceding origin compensation operation and ends with the next origin compensation operation. The size measuring interval setting means sets the number of workpieces which should be ground during the next size measuring interval, based on an average position compensation amount derived by dividing a position compensation amount for the last workpiece ground during the present size measuring interval by the number of workpieces ground during the present size measuring interval.
摘要翻译：后处理尺寸控制装置设置有原点补偿装置，用于控制尺寸测量装置，以测量工件部分的实际尺寸，并且用于通过对应于实际的尺寸和理论尺寸从计算和尺寸测量间隔设定装置得出，用于设定在先前原始补偿操作之后开始的下一个尺寸测量间隔期间应接地的工件数量，并以下一个原点补偿操作结束。尺寸测量间隔设定装置基于通过将当前尺寸测量间隔期间的最后一个工件接地的位置补偿量除以导出的平均位置补偿量来设定在下一个尺寸测量间隔期间应接地的工件的数量的工件在当前尺寸测量间隔期间接地。

4. 发明授权

US4703587A Method and relevant apparatus for controlling machine tools 失效
标题翻译：用于控制机床的方法和相关设备
公开(公告)号：US4703587A
公开(公告)日：1987-11-03
申请号：US911751
申请日：1986-09-26
申请人： Antonio Bolognesi , Narciso Selleri , Giancarlo Gherdovich
发明人： Antonio Bolognesi , Narciso Selleri , Giancarlo Gherdovich
IPC分类号： B23Q15/02 , B23Q15/04 , B24B49/05 , B24B49/04
CPC分类号： B23Q15/04 , B24B49/05
摘要： Two machine tools are provided with control systems for machining two different types of pieces to be matched to each other. In order to obtain small batches of relevant pieces that basically can be completely matched to one another, the control systems are independent from each other and each of them comprises post-process and in-process checking stations; the first station, besides checking the proper operation of the in-process station progressively and at short regular intervals changes its zero condition, so as to obtain machining pieces having dimensions evenly distributed within the relevant tolerance range.
摘要翻译：两台机床配有控制系统，用于加工两种不同类型的件，以便彼此匹配。为了获得基本上可以完全匹配的小批量的相关件，控制系统相互独立，每个都包括后处理和过程中检验站; 第一站除了逐步检查正在进行的处理站的正确操作之外，还要以较短的时间间隔改变其零点状况，以获得具有均匀分布在相关公差范围内的尺寸的加工件。

5. 发明授权

US11195729B2 Substrate polishing apparatus and method 有权
公开(公告)号：US11195729B2
公开(公告)日：2021-12-07
申请号：US16044137
申请日：2018-07-24
申请人： EBARA CORPORATION
发明人： Yuki Watanabe , Keita Yagi
IPC分类号： H01L21/67 , B24B37/013 , B24B49/05 , B24B37/32 , B24B37/10
摘要： A substrate polishing apparatus includes a top ring for pressing a substrate against a polishing pad to perform substrate polishing; a spectrum generating unit that directs light onto a surface of the substrate of interest for polishing, receives reflected light, and calculates a reflectivity spectrum corresponding to the wavelength of the reflected light; and a storage that stores a plurality of thickness estimating algorithms for estimating the thickness of the polished surface in accordance with the reflectivity spectrum. A plurality of thickness estimating algorithms is selected among the thickness estimating algorithms stored in the storage, and a switching condition is set. The thickness of the polished surface is estimated by using the set thickness estimating algorithms, and if the switching condition is satisfied, the thickness estimating algorithm to be applied is switched.

6. 发明申请

US20190240806A1 METHOD FOR PRODUCING BEARING COMPONENTS 审中-公开
公开(公告)号：US20190240806A1
公开(公告)日：2019-08-08
申请号：US16329066
申请日：2017-09-13
申请人： Schaeffler Technologies AG & Co. KG
发明人： Wolfgang Schnabel , Martin Schreiber , Oliver Jung
IPC分类号： B24B51/00 , B24B49/03 , B24B49/05 , F16C33/14 , F16C33/64
CPC分类号： B24B51/00 , B24B49/03 , B24B49/05 , F16C17/00 , F16C19/00 , F16C33/14 , F16C33/64 , F16C41/04
摘要： A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

7. 发明申请

US20170190020A1 POLISHING METHOD AND POLISHING APPARATUS 审中-公开
公开(公告)号：US20170190020A1
公开(公告)日：2017-07-06
申请号：US15304829
申请日：2015-04-10
申请人： EBARA CORPORATION
发明人： Yoichi KOBAYASHI , Keita YAGI , Masaki KINOSHITA , Yoichi SHIOKAWA
IPC分类号： B24B49/05 , H01L21/67 , H01L21/66 , B24B49/03
CPC分类号： B24B49/05 , B24B37/013 , B24B37/105 , B24B37/32 , B24B37/34 , B24B49/02 , B24B49/03 , B24B49/04 , B24B49/12 , H01L21/67 , H01L22/12 , H01L22/26
摘要： The present invention relates to a polishing method and a polishing apparatus for polishing a substrate such as a wafer while measuring a film thickness based on optical information included in reflected light from the substrate. The polishing method includes preparing a plurality of spectrum groups each containing a plurality of reference spectra corresponding to different film thicknesses; directing light to a substrate and receiving reflected light from the substrate; producing, from the reflected light, a sampling spectrum for selecting a spectrum group; selecting a spectrum group containing a reference spectrum which is closest in shape to the sampling spectrum; producing a measurement spectrum for obtaining a film thickness while polishing the substrate; selecting, from the selected spectrum group, a reference spectrum which is closest in shape to the measurement spectrum that has been produced when the substrate is being polished; and obtaining a film thickness corresponding to the selected reference spectrum.

8. 发明授权

US4231158A Electronic apparatus for checking the linear dimensions of mechanical workpieces 失效
标题翻译：用于检查机械工件线性尺寸的电子设备
公开(公告)号：US4231158A
公开(公告)日：1980-11-04
申请号：US965528
申请日：1978-12-01
申请人： Mario Possati
发明人： Mario Possati
IPC分类号： G01B7/02 , B23Q17/20 , B24B49/02 , B24B49/04 , B24B49/05 , G01B7/00 , G01B7/12 , G01B21/10 , G01B5/08
CPC分类号： G01B7/12 , B24B49/04 , G01B7/001
摘要： Apparatus for checking diameters of workpieces in a broad range of operation, including two arms moving with a scissorwise movement.The two arms carry relevant measuring heads and are coupled to coaxial shafts.A rotary transducer has two moving elements coupled to the coaxial shafts. A processing and control circuit includes pre-selectors for zero-setting the apparatus with reference to different diameters to be checked. The processing and control circuit provides a measurement signal depending on the output signals of the measuring heads and of the rotary transducer.
摘要翻译：用于在宽范围的操作中检查工件的直径的装置，包括以剪刀运动移动的两个臂。两个手臂携带相关的测量头，并连接到同轴轴。旋转传感器具有联接到同轴轴的两个移动元件。处理和控制电路包括用于参考要检查的不同直径对设备进行零点设定的预选择器。处理和控制电路根据测量头和旋转传感器的输出信号提供测量信号。

9. 发明申请

US20220402087A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 有权
公开(公告)号：US20220402087A1
公开(公告)日：2022-12-22
申请号：US17776639
申请日：2020-11-02
申请人： Tokyo Electron Limited
发明人： Nobutaka FUKUNAGA , Tomohiro KANEKO , Takeshi MATSUMOTO
IPC分类号： B24B7/04 , B24B49/05
摘要： A substrate processing method of grinding a first substrate in a combined substrate in which the first substrate and a second substrate are bonded to each other includes measuring a total thickness distribution of the combined substrate; measuring a thickness distribution of the first substrate; calculating a thickness distribution of the second substrate by subtracting the thickness distribution of the first substrate from the total thickness distribution of the combined substrate; deciding a relative inclination between a substrate holder configured to hold the combined substrate and a grinder configured to grind the combined substrate, based on the thickness distribution of the second substrate; and grinding the first substrate while holding the combined substrate at the inclination which is decided.

10. 发明申请

US20210122002A1 METHOD AND GRINDING MACHINE FOR FABRICATING A WORKPIECE COMPRISING A HELICAL GROOVE 有权
公开(公告)号：US20210122002A1
公开(公告)日：2021-04-29
申请号：US16971611
申请日：2019-03-27
申请人： ROLLOMATIC SA
发明人： Jean-Charles MARTY
IPC分类号： B24B19/04 , B24B49/05
摘要： The invention concerns a method and a grinding machine (4) for machining a workpiece (1) comprising a desired helical groove. The method comprises a step of grinding a calibration groove (12) on the surface (10) of the workpiece according to a predetermined helix pattern of the desired helical groove and by means of an abrasive wheel (2) of the grinding machine. The calibration groove (12) has a calibration length that is equal or smaller than the predetermined length of the desired helical groove and has a calibration depth (120) that is smaller than the predetermined depth of the desired helical groove. The method comprises steps of: determine an abrasive wheel dimension (22, 23, 24, 25) of the abrasive wheel (2) by measuring the calibration depth; and using the determined wheel dimension (22, 23, 24, 25) for grinding the desired helical groove by means of the abrasive wheel (2).

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