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    • 3. 发明授权
    • Spike anneal residence time reduction in rapid thermal processing chambers
    • 快速热处理室中尖峰退火停留时间的减少
    • US08939760B2
    • 2015-01-27
    • US13370164
    • 2012-02-09
    • Jiping LiBlake KoelmelAaron Muir HunterWolfgang R. Aderhold
    • Jiping LiBlake KoelmelAaron Muir HunterWolfgang R. Aderhold
    • F27D15/02
    • H01L21/67109F27B17/0025H01L21/67115
    • The present invention generally relates to methods of cooling a substrate during rapid thermal processing. The methods generally include positioning a substrate in a chamber and applying heat to the substrate. After the temperature of the substrate is increased to a desired temperature, the substrate is rapidly cooled. Rapid cooling of the substrate is facilitated by increasing a flow rate of a gas through the chamber. Rapid cooling of the substrate is further facilitated by positioning the substrate in close proximity to a cooling plate. The cooling plate removes heat from substrate via conduction facilitated by gas located therebetween. The distance between the cooling plate and the substrate can be adjusted to create a turbulent gas flow therebetween, which further facilitates removal of heat from the substrate. After the substrate is sufficiently cooled, the substrate is removed from the chamber.
    • 本发明一般涉及在快速热处理期间冷却衬底的方法。 所述方法通常包括将基底定位在腔室中并向基底施加热量。 在将衬底的温度升高到所需温度之后,快速冷却衬底。 通过增加通过室的气体的流速来促进衬底的快速冷却。 通过将衬底定位在靠近冷却板的方式进一步促进衬底的快速冷却。 冷却板通过由位于其间的气体促进的传导从衬底去除热量。 可以调节冷却板和基板之间的距离以在它们之间产生湍流气流,这进一步有助于从基板去除热量。 在衬底充分冷却之后,将衬底从腔室中取出。
    • 7. 发明申请
    • METHODS OF THERMALLY PROCESSING A SUBSTRATE
    • 热处理基板的方法
    • US20130029499A1
    • 2013-01-31
    • US13553224
    • 2012-07-19
    • Aaron Muir Hunter
    • Aaron Muir Hunter
    • H01L21/26
    • H01L21/2636H01L21/02686H01L21/02691H01L21/268
    • The present invention generally relates to methods for thermally processing substrates. In one embodiment, a substrate having an amorphous thin film thereon is subjected to a first pulse of electromagnetic energy having a first fluence insufficient to complete thermal processing. After a predetermined amount of time, the substrate is then subjected to a second pulse of electromagnetic energy having a second fluence greater than the first fluence. The second fluence is generally sufficient to complete the thermal processing. Exposing the substrate to the lower fluence first pulse before the second pulse reduces damage to a thin film disposed on the substrate. In another embodiment, a substrate is exposed to a plurality of electromagnetic energy pulses. The plurality of electromagnetic energy pulses are spaced at increasing intervals to reduce the rate of recrystallization of a film on the substrate, thus increasing the size of the crystals formed during the recrystallization.
    • 本发明一般涉及用于热处理衬底的方法。 在一个实施例中,其上具有非晶薄膜的基板经受第一能量密度不足以完成热处理的电磁能的第一脉冲。 在预定量的时间之后,然后使衬底经受具有大于第一注量的第二注量的第二电磁能脉冲。 第二个通量通常足以完成热处理。 在第二脉冲之前将衬底暴露于较低能量密度的第一脉冲减少对设置在衬底上的薄膜的损伤。 在另一个实施例中,衬底暴露于多个电磁能量脉冲。 多个电磁能脉冲以增加的间隔隔开以降低衬底上的膜的再结晶速率,从而增加在重结晶期间形成的晶体的尺寸。
    • 10. 发明授权
    • Ambient laminar gas flow distribution in laser processing systems
    • 激光加工系统环境层流气流分布
    • US09557111B2
    • 2017-01-31
    • US13204068
    • 2011-08-05
    • Stephen MoffattAaron Muir Hunter
    • Stephen MoffattAaron Muir Hunter
    • F27D5/00
    • F27D21/00F27D5/0037F27D2021/0078H01L21/67115
    • A method and apparatus for annealing semiconductor substrates is disclosed. The apparatus has an annealing energy source and a substrate support, with a shield member disposed between the annealing energy source and the substrate support. The shield member is a substantially flat member having a dimension larger than a substrate processed on the substrate support, with a window covering a central opening in the substantially flat member. The central opening has a gas inlet portal and a gas outlet portal, each in fluid communication with a gas inlet plenum and gas outlet plenum, respectively. A connection member is disposed around the central opening and holds the window over the central opening. Connection openings in the connection member are in fluid communication with the gas inlet plenum and gas outlet plenum, respectively, through a gas inlet conduit and a gas outlet conduit formed through the connection member.
    • 公开了半导体衬底退火的方法和装置。 该装置具有退火能量源和衬底支撑件,其中屏蔽构件设置在退火能量源和衬底支撑件之间。 屏蔽构件是具有大于在基板支撑件上处理的基板的尺寸的基本上平坦的构件,窗口覆盖基本平坦的构件中的中心开口。 中心开口具有气体入口入口和气体出口入口,每个入口入口和气体出口通道分别与气体入口气室和气体出口增压室流体连通。 连接构件设置在中心开口周围并将窗口保持在中心开口的上方。 连接构件中的连接开口分别通过气体入口导管和通过连接构件形成的气体出口导管与气体入口气室和气体出口增压室流体连通。