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1. 发明申请

US20100184305A1 COMPENSATION OF THERMAL EXPANSION IN SMT INTERCONNECTS 失效
标题翻译： SMT互连中热膨胀补偿
公开(公告)号：US20100184305A1
公开(公告)日：2010-07-22
申请号：US12357836
申请日：2009-01-22
申请人： WILLIAM LOUIS BRODSKY , AMANDA ELISA ENNIS MIKHAIL
发明人： WILLIAM LOUIS BRODSKY , AMANDA ELISA ENNIS MIKHAIL
IPC分类号： H01R12/00
CPC分类号： H05K1/0271 , H05K3/303 , H05K2201/068 , H05K2201/10189 , H05K2203/167 , Y02P70/613 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144
摘要： The present invention relates to a method of providing end and center locating connectors in interconnects between surface mount technology (SMT) connectors and printed circuit boards (PCBs). The connectors are adapted to maintain their connection even when the printed circuit board and/or the SMT connector expands or contracts.
摘要翻译：本发明涉及在表面贴装技术（SMT）连接器和印刷电路板（PCB）之间的互连中提供端部和中心定位连接器的方法。即使当印刷电路板和/或SMT连接器膨胀或收缩时，连接器也适于保持连接。

2. 发明授权

US07632127B2 Socket and method for compensating for differing coefficients of thermal expansion 失效
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US07632127B2
公开(公告)日：2009-12-15
申请号：US12100480
申请日：2008-04-10
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R13/62
CPC分类号： H01R12/7052 , H01R12/714 , Y10T29/49144 , Y10T29/49149 , Y10T29/49208 , Y10T29/53174 , Y10T29/53265
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。插座包括表面安装的触点和细长的外壳。所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

3. 发明申请

US20080182443A1 Socket and Method for Compensating for Differing Coefficients of Thermal Expansion 失效
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US20080182443A1
公开(公告)日：2008-07-31
申请号：US12100480
申请日：2008-04-10
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R13/15
CPC分类号： H01R12/7052 , H01R12/714 , Y10T29/49144 , Y10T29/49149 , Y10T29/49208 , Y10T29/53174 , Y10T29/53265
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。插座包括表面安装的触点和细长的外壳。所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

4. 发明授权

US07303443B1 Socket and method for compensating for differing coefficients of thermal expansion 有权
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US07303443B1
公开(公告)日：2007-12-04
申请号：US11548789
申请日：2006-10-12
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R24/00
CPC分类号： H01R13/533 , H01R12/716 , Y10T29/49222
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的热膨胀系数的差异的方法。插座包括表面安装的触点和细长的外壳。细长壳体包括孔，其中表面安装的接触件从孔径延伸。至少一个板连接到细长壳体，其中至少一个板具有选择的热膨胀系数以补偿插座和印刷电路板之间的热膨胀系数差。

5. 发明授权

US07293994B2 Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member 有权
标题翻译：使用通过保持构件捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置
公开(公告)号：US07293994B2
公开(公告)日：2007-11-13
申请号：US11297307
申请日：2005-12-08
申请人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
发明人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , H01R12/52 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208
摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
摘要翻译：一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。弹性线束设置在每个孔中。非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

6. 发明授权

US07606033B2 Mounting a heat sink in thermal contact with an electronic component 失效
公开(公告)号：US07606033B2
公开(公告)日：2009-10-20
申请号：US12164339
申请日：2008-06-30
申请人： John Lee Colbert , Eric Alan Eckberg , Roger Duane Hamilton , Mark Kenneth Hoffmeyer , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： John Lee Colbert , Eric Alan Eckberg , Roger Duane Hamilton , Mark Kenneth Hoffmeyer , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4081 , H01L2924/0002 , H01L2924/3011 , Y10T29/4913 , Y10T29/49826 , H01L2924/00
摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

7. 发明授权

US07138896B2 Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference 失效
公开(公告)号：US07138896B2
公开(公告)日：2006-11-21
申请号：US10879811
申请日：2004-06-29
申请人： Jessica Rose Berens , Don Alan Gilliland , Amanda Elisa Ennis Mikhail
发明人： Jessica Rose Berens , Don Alan Gilliland , Amanda Elisa Ennis Mikhail
IPC分类号： H01F27/02
CPC分类号： H01F17/06 , H01F3/10 , H01F27/255 , H01F2017/065
摘要： Ferrite cores are provided with rounded, convex head ends and complimentary rounded, concave tail ends. The configuration of the head and tail ends permits a reduction in gap width between adjacent cores when they are joined together into a core assembly that suppresses electromagnetic interference emitted from a cable.

8. 发明授权

US07084344B1 V-seal EMC gasket assembly for precise placement, conduction and retention without adhesives 有权
标题翻译： V型密封EMC垫片组件，用于精确的放置，导电和保留，无需粘合剂
公开(公告)号：US07084344B1
公开(公告)日：2006-08-01
申请号：US11326572
申请日：2006-01-05
申请人： Don Alan Gilliland , Amanda Elisa Ennis Mikhail , Scott Alan Shurson
发明人： Don Alan Gilliland , Amanda Elisa Ennis Mikhail , Scott Alan Shurson
IPC分类号： H05K9/00
CPC分类号： H05K9/0016 , Y10S277/92
摘要： A V-seal EMC gasket assembly is provided for implementing precise placement, conduction and retention, while eliminating the need for adhesives. A V-seal EMC gasket and a supporting member include cooperating notch and protrusion features for positioning and retaining the V-seal EMC gasket on the supporting member. A distal end of the V-seal EMC gasket is received and retained within angled stops formed in the supporting member. A retaining clip member holds the V-seal EMC gasket in contact engagement with the supporting member. The protrusion features of the supporting member are received through corresponding mating slots formed near a first end of the retaining clip member, for example, in press-fit engagement. The angle stops formed in the supporting member hold a second end of the retaining clip member with the V-seal EMC gasket clamped and retained in position between the supporting member and the retaining clip member.
摘要翻译：提供V型密封EMC垫片组件，用于实现精确的放置，传导和保持，同时消除对粘合剂的需要。 V型密封EMC垫圈和支撑构件包括用于将V型密封EMC垫圈定位和保持在支撑构件上的协作槽口和突起特征。 V形密封EMC垫片的远端被接收并保持在形成在支撑构件中的成角度的止动件中。保持夹构件保持V型密封EMC垫片与支撑构件接触接合。支撑构件的突出特征通过形成在保持夹构件的第一端附近的相应配合槽被接收，例如以压配合接合。形成在支撑构件上的角度挡块保持夹紧构件的第二端，V形密封EMC垫圈夹紧并保持在支撑构件和保持夹构件之间的适当位置。

9. 发明授权

US07944698B2 Mounting a heat sink in thermal contact with an electronic component 有权
标题翻译：安装与电子元件热接触的散热片
公开(公告)号：US07944698B2
公开(公告)日：2011-05-17
申请号：US12164367
申请日：2008-06-30
申请人： John Lee Colbert , Eric Alan Eckberg , Roger Duane Hamilton , Mark Kenneth Hoffmeyer , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： John Lee Colbert , Eric Alan Eckberg , Roger Duane Hamilton , Mark Kenneth Hoffmeyer , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4081 , H01L2924/0002 , H01L2924/3011 , Y10T29/4913 , Y10T29/49826 , H01L2924/00
摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.
摘要翻译：传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。负载框架安装在其上安装电子部件的印刷电路板上。散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。散热器组件具有用于接合负载弹簧的负载臂。负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙主体和电子部件。不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

10. 发明申请

US20080282539A1 Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member 失效
标题翻译：使用由保持构件在插入件的孔径中捕获的弹性线束电连接两个基板
公开(公告)号：US20080282539A1
公开(公告)日：2008-11-20
申请号：US12183288
申请日：2008-07-31
申请人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
发明人： William Louis Brodsky , John Lee Colbert , Roger Duane Hamilton , Amanda Elisa Ennis Mikhail , Mark David Plucinski
IPC分类号： H01R43/00
CPC分类号： H01R13/2407 , H01R12/52 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208
摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
摘要翻译：一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。弹性线束设置在每个孔中。非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

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