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1. 发明授权

US09096784B2 Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance 有权
标题翻译：用于石墨纳米纤维排列的方法和系统，用于增强热界面材料性能
公开(公告)号：US09096784B2
公开(公告)日：2015-08-04
申请号：US13775157
申请日：2013-02-23
申请人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
发明人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
IPC分类号： B32B9/00 , C09K5/00 , B32B3/14 , C09K5/06 , B32B27/12 , B82Y30/00 , B32B5/24 , B32B5/02 , C23C16/26 , B23B5/12
CPC分类号： C09K5/00 , B23B5/12 , B32B3/14 , B32B5/02 , B32B5/12 , B32B5/24 , B32B27/12 , B82Y30/00 , C09K5/06 , C09K5/063 , C23C16/26 , Y10T428/24802 , Y10T428/30
摘要： The exemplary embodiments of the present invention provide an apparatus and a thermal interface material with aligned graphite nanofibers in the thermal interface material to enhance the thermal interface material performance. The thermal interface material having a thickness between a first surface and a second surface opposite the first surface. The comprising thermal interface material includes a plurality of carbon nanofibers (CNFs), wherein a majority of the CNFs are oriented orthogonal to a plane of the first surface. The apparatus includes the thermal interface material, and a first object having a third surface; and a second object having a fourth surface; wherein the thermal interface material is sandwiched between the third surface and the fourth surface.
摘要翻译：本发明的示例性实施例提供了一种在热界面材料中具有对准的石墨纳米纤维的装置和热界面材料，以增强热界面材料性能。所述热界面材料具有在第一表面和与所述第一表面相对的第二表面之间的厚度。包括热界面材料包括多个碳纳米纤维（CNF），其中大部分CNF定向成垂直于第一表面的平面。该装置包括热界面材料和具有第三表面的第一物体; 和具有第四表面的第二物体; 其中所述热界面材料夹在所述第三表面和所述第四表面之间。

2. 发明授权

US08750704B2 Implementing reduced signal degradation for fiber optic modules 失效
标题翻译：实现光纤模块降低的信号劣化
公开(公告)号：US08750704B2
公开(公告)日：2014-06-10
申请号：US12691845
申请日：2010-01-22
申请人： Joseph Kuczynski , Arvind Kumar Sinha
发明人： Joseph Kuczynski , Arvind Kumar Sinha
IPC分类号： H04B10/08 , G02B1/06 , G02B27/64
CPC分类号： G02B6/4206 , G02B3/14 , G02B6/4225 , G02B26/005
摘要： A method and circuit are provided for implementing reduced signal degradation for fiber optic modules, and a design structure on which the subject circuit resides. Responsive to a detected signal input, an optical misalignment calculation is performed. A voltage potential for a lens shape control is selected responsive to the optical misalignment calculation. An optical signal loss calculation and threshold compare are performed. Responsive to the optical signal loss calculation less than the threshold, the lens shape and voltage potential are fixed. A fluidic lens provides variable lens shape responsive to the selected voltage potential being applied to the fluidic lens.
摘要翻译：提供了一种用于实现光纤模块的降低的信号劣化的方法和电路，以及被摄体电路所在的设计结构。响应于检测信号输入，执行光学偏移计算。响应于光学偏移计算选择透镜形状控制的电压电位。执行光信号丢失计算和阈值比较。响应于光信号损耗计算小于阈值，透镜形状和电压电位是固定的。流体透镜提供响应于施加到流体透镜的选定电压电位的可变透镜形状。

3. 发明授权

US08431048B2 Method and system for alignment of graphite nanofibers for enhanced thermal interface material performance 有权
标题翻译：用于石墨纳米纤维对准的方法和系统，用于增强热界面材料性能
公开(公告)号：US08431048B2
公开(公告)日：2013-04-30
申请号：US12842200
申请日：2010-07-23
申请人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
发明人： Joseph Kuczynski , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
IPC分类号： H05K7/20
CPC分类号： B82Y40/00 , B82Y30/00 , C01B32/15 , C01B32/20 , H01L23/373 , H01L23/3733 , H01L2924/0002 , H01L2924/00
摘要： The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.
摘要翻译：本发明的示例性实施例提供了一种用于在石墨纳米纤维中对准热界面材料以提高热界面材料性能的方法和系统。该方法包括以人字形配置制备石墨纳米纤维，并将石英纳米纤维以人字形构型分散到热界面材料中。该方法还包括施加足够强度的磁场以使石墨纳米纤维在热界面材料中对准。该系统包括以人字形配置的石墨纳米纤维和用于将人字形配置中的石墨纳米纤维分散到热界面材料中的装置。该系统还包括用于施加足够强度的磁场以对准热界面材料中的石墨纳米纤维的装置。

4. 发明授权

US07632127B2 Socket and method for compensating for differing coefficients of thermal expansion 失效
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US07632127B2
公开(公告)日：2009-12-15
申请号：US12100480
申请日：2008-04-10
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R13/62
CPC分类号： H01R12/7052 , H01R12/714 , Y10T29/49144 , Y10T29/49149 , Y10T29/49208 , Y10T29/53174 , Y10T29/53265
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。插座包括表面安装的触点和细长的外壳。所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

5. 发明申请

US20080182443A1 Socket and Method for Compensating for Differing Coefficients of Thermal Expansion 失效
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US20080182443A1
公开(公告)日：2008-07-31
申请号：US12100480
申请日：2008-04-10
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R13/15
CPC分类号： H01R12/7052 , H01R12/714 , Y10T29/49144 , Y10T29/49149 , Y10T29/49208 , Y10T29/53174 , Y10T29/53265
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。插座包括表面安装的触点和细长的外壳。所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

6. 发明授权

US07303443B1 Socket and method for compensating for differing coefficients of thermal expansion 有权
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US07303443B1
公开(公告)日：2007-12-04
申请号：US11548789
申请日：2006-10-12
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R24/00
CPC分类号： H01R13/533 , H01R12/716 , Y10T29/49222
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的热膨胀系数的差异的方法。插座包括表面安装的触点和细长的外壳。细长壳体包括孔，其中表面安装的接触件从孔径延伸。至少一个板连接到细长壳体，其中至少一个板具有选择的热膨胀系数以补偿插座和印刷电路板之间的热膨胀系数差。

7. 发明授权

US07068510B2 Dissipating heat reliably in computer systems 失效
标题翻译：在计算机系统中可靠地散热
公开(公告)号：US07068510B2
公开(公告)日：2006-06-27
申请号：US10728299
申请日：2003-12-04
申请人： Martin Joseph Crippen , Pat Gallarelli , Benjamin Michael Kreuz , Arvind Kumar Sinha
发明人： Martin Joseph Crippen , Pat Gallarelli , Benjamin Michael Kreuz , Arvind Kumar Sinha
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , H01L23/427 , H01L2224/16 , H01L2224/73253 , H05K7/2049
摘要： A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.
摘要翻译：一种刀片服务器模块，包括：壳体组件; 布置在壳体组件内的印刷电路板，并以与其自由浮动的关系安装; 安装在印刷电路板上的处理器; 散热器组件设置在壳体组件中，靠近处理器; 以及一个或多个柔性压缩元件，其设置在壳体组件内，以便被预加载以在印刷电路板上提供力以迫使热源与散热器组件热接合。公开了用于在紧凑的包装布置中可靠地散热的方法和系统，其特别适用于包括刀片服务器的计算系统。

8. 发明申请

US20140242349A1 METHOD AND SYSTEM FOR ALLIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE 有权
标题翻译：用于提高石墨纳米纤维增强热界面材料性能的方法和系统
公开(公告)号：US20140242349A1
公开(公告)日：2014-08-28
申请号：US13775157
申请日：2013-02-23
申请人： JOSEPH KUCZYNSKI , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
发明人： JOSEPH KUCZYNSKI , Arvind Kumar Sinha , Kevin Albert Splittstoesser , Timothy Jerome Tofil
IPC分类号： C09K5/00 , B32B3/14 , C09K5/06
CPC分类号： C09K5/00 , B23B5/12 , B32B3/14 , B32B5/02 , B32B5/12 , B32B5/24 , B32B27/12 , B82Y30/00 , C09K5/06 , C09K5/063 , C23C16/26 , Y10T428/24802 , Y10T428/30
摘要： The exemplary embodiments of the present invention provide an apparatus and a thermal interface material with aligned graphite nanofibers in the thermal interface material to enhance the thermal interface material performance. The thermal interface material having a thickness between a first surface and a second surface opposite the first surface. The comprising thermal interface material includes a plurality of carbon nanofibers (CNFs), wherein a majority of the CNFs are oriented orthogonal to a plane of the first surface. The apparatus includes the thermal interface material, and a first object having a third surface; and a second object having a fourth surface; wherein the thermal interface material is sandwiched between the third surface and the fourth surface.
摘要翻译：本发明的示例性实施例提供了一种在热界面材料中具有对准的石墨纳米纤维的装置和热界面材料，以增强热界面材料性能。所述热界面材料具有在第一表面和与所述第一表面相对的第二表面之间的厚度。包括热界面材料包括多个碳纳米纤维（CNF），其中大部分CNF定向成垂直于第一表面的平面。该装置包括热界面材料和具有第三表面的第一物体; 和具有第四表面的第二物体; 其中所述热界面材料夹在所述第三表面和所述第四表面之间。

9. 发明授权

US08287336B2 Method of manufacturing a venting device for tamper resistant electronic modules 失效
标题翻译：制造防篡改电子模块通风装置的方法
公开(公告)号：US08287336B2
公开(公告)日：2012-10-16
申请号：US11686102
申请日：2007-03-14
申请人： John Richard Dangler , Phillip Duane Isaacs , Arvind Kumar Sinha
发明人： John Richard Dangler , Phillip Duane Isaacs , Arvind Kumar Sinha
IPC分类号： H05K5/00
CPC分类号： H05K5/0213 , H01L23/573 , H01L23/585 , H01L2924/0002 , H05K5/0208 , Y10T29/49885 , H01L2924/00
摘要： A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.
摘要翻译：用于电子电路的防篡改外壳包括内铜壳，围绕内壳缠绕的篡改感测网，包围内壳和篡改感测网的外铜壳，以及从内部内部形成通风通道的排气装置壳体到外壳外部，排气通道在篡改感测网的重叠层之间通过，并且沿其长度具有至少一个直角弯曲。排气装置由沿着其长度层压在一起的两条薄的聚酰胺覆盖层材料组成，并且一长度的羊毛纱线夹在两条薄条之间并从条的一端延伸到条的另一端以形成通风口渠道。纱线的长度遵循第一和第二条带之间的之字形路径，之字形路径包括至少一个直角弯曲部。

10. 发明授权

US07438558B1 Three-dimensional stackable die configuration for an electronic circuit board 失效
标题翻译：电子电路板的三维可堆叠模具配置
公开(公告)号：US07438558B1
公开(公告)日：2008-10-21
申请号：US11939272
申请日：2007-11-13
申请人： Arvind Kumar Sinha
发明人： Arvind Kumar Sinha
IPC分类号： H01R12/00
CPC分类号： H01R13/22 , Y10T29/4913
摘要： A three-dimensional die configuration for mounting electronic components to a circuit board includes a circuit board having at least one circuit board die, a first electronic component mounted at the circuit board die and a first substrate member including a first surface electrically connected to the first chip. The three-dimensional die configuration further includes a double-sided land grid array having a first surface electrically connected to a second surface of the first substrate member. A second substrate member is electrically connected to a second surface of the double-sided land grid array. A second electronic component is electrically connected to a second surface of the second substrate member. A thermal interface member abuts the second chip and is covered by a cap member. The resulting three-dimensional die configuration establishes a multiple electronic component mounting arrangement having a footprint of a single electronic component.
摘要翻译：用于将电子部件安装到电路板的三维管芯构造包括具有至少一个电路板裸片，安装在电路板裸片上的第一电子部件和第一基板部件的电路板，第一基板部件包括电连接到第一芯片。三维管芯配置还包括双面焊盘栅格阵列，其具有电连接到第一衬底构件的第二表面的第一表面。第二基板部件电连接到双面焊盘格栅阵列的第二表面。第二电子部件电连接到第二基板部件的第二表面。热接口构件邻接第二芯片并被盖构件覆盖。所得到的三维模具配置建立了具有单个电子部件的占地面积的多个电子部件安装装置。

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