专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09210388B2 Laser source module and scanning image display device equipped with such module 有权
标题翻译：激光源模块和扫描图像显示装置配有这样的模块
公开(公告)号：US09210388B2
公开(公告)日：2015-12-08
申请号：US13429920
申请日：2012-03-26
申请人： Atsushi Kazama , Takeshi Nakao , Yasuo Amano
发明人： Atsushi Kazama , Takeshi Nakao , Yasuo Amano
IPC分类号： H04N9/31 , G02B19/00 , G02B26/10 , G02B27/09 , H01S5/40 , H01S5/022 , H01S5/024
CPC分类号： H04N9/3173 , G02B19/0057 , G02B26/101 , G02B27/0905 , H01L2224/48091 , H01L2924/1461 , H01S5/02212 , H01S5/02469 , H01S5/4012 , H01S5/4093 , H04N9/3129 , H04N9/3144 , H04N9/3164 , H01L2924/00014 , H01L2924/00
摘要： In a laser source module aligning laser beams from laser sources for three colors, red, green, and blue on a single combined beam optical axis, decreasing relative displacements of beam spots of three colors, occurring due to thermal deformation by temperature rise, is achieved by a laser source module including plural laser sources, each incorporating a laser having a laser chip installed on a heat sink and a lens converting a light radiated from the laser into a laser beam, and a beam combining unit aligning the laser beams from the laser sources on a single combined beam optical axis, wherein the lasers in at least two or more ones of the laser sources are arranged so that their laser beams will be decentered toward a same direction on the combined beam optical axis upon displacement of an emission point of the laser chip away from the heat sink.
摘要翻译：在激光源模块中，在单个组合光束光轴上对准来自三种颜色，红色，绿色和蓝色的激光源的激光束，减少由于温度升高引起的热变形而产生的三种光斑的相对位移通过包括多个激光源的激光源模块，每个激光源包括具有安装在散热器上的激光芯片的激光器和将从激光器照射的光转换为激光束的透镜，以及将来自激光器的激光束对准的光束组合单元源于单个组合光束光轴，其中至少两个或更多个激光源中的激光器被布置成使得它们的激光束将在组合光束光轴上朝向相同方向偏心，激光芯片远离散热片。

2. 发明授权

US08873173B2 Object lens drive unit and optical pickup using the same 有权
标题翻译：物镜驱动单元和使用其的光学拾取器
公开(公告)号：US08873173B2
公开(公告)日：2014-10-28
申请号：US13430816
申请日：2012-03-27
申请人： Atsushi Kazama , Katsuhiko Kimura , Takahiro Yamaguchi , Souichirou Yamada
发明人： Atsushi Kazama , Katsuhiko Kimura , Takahiro Yamaguchi , Souichirou Yamada
IPC分类号： G02B7/02 , G11B7/09
CPC分类号： G11B7/0932
摘要： In the object lens drive unit including a lens holder with an object lens attached to, a plurality of driving coils attached to the lens holder, connection substrates attached to both sides of the lens holder, and a plurality of suspension wires with end parts thereof connected to the connection substrates for operatively supporting the lens holder, a plurality of sets of wire connection electrodes for connecting the suspension wires and coil connection electrodes electrically connected to the wire connection electrodes for connecting terminal wires of the coils are arranged in line in an optic axis direction of the object lens and the wire connection electrodes and the coil connection electrodes are formed in a symmetric shape to a central axis parallel to the optic axis direction on the connection substrates.
摘要翻译：在包括安装有物镜的透镜保持器的物镜驱动单元中，安装在透镜保持器上的多个驱动线圈，连接到透镜保持器两侧的连接基板和多个悬挂线，其端部连接到用于可操作地支撑透镜保持器的连接基板，用于连接悬挂线的多组线连接电极和电连接到用于连接线圈的端子线的线连接电极的线圈连接电极在光轴物镜和线连接电极和线圈连接电极的方向形成为与连接基板上的光轴方向平行的中心轴对称的形状。

3. 发明授权

US08474318B2 Acceleration sensor 失效
标题翻译：加速度传感器
公开(公告)号：US08474318B2
公开(公告)日：2013-07-02
申请号：US12670964
申请日：2008-06-25
申请人： Atsushi Kazama , Masakatsu Saitoh , Ryoji Okada , Takanori Aono
发明人： Atsushi Kazama , Masakatsu Saitoh , Ryoji Okada , Takanori Aono
IPC分类号： G01P15/12
CPC分类号： G01P15/18 , G01P15/123 , G01P2015/0842 , H01L24/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/00012
摘要： An acceleration sensor having a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam.
摘要翻译：一种加速度传感器，其具有支撑框架，通过柔性梁支撑在支撑框架内的重物，设置在梁上的半导体压阻元件和互连压阻元件的布线。加速度传感器根据压阻元件的电阻变化来检测加速度。应力阻尼部分设置在梁的那些部分上，排除了设置压电元件的部分。每个应力阻尼部分相对于梁的长度中心线和梁的宽度中心线之间的交点相对称。

4. 发明授权

US08438931B2 Semiconductor strain sensor 有权
标题翻译：半导体应变传感器
公开(公告)号：US08438931B2
公开(公告)日：2013-05-14
申请号：US12674419
申请日：2008-07-25
申请人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
发明人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
IPC分类号： G01L1/22
CPC分类号： G01L1/18 , G01B7/16 , G01L1/2293
摘要： A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.
摘要翻译：一种半导体应变传感器，具有由具有压阻元件的半导体基板构成的应变传感器芯片作为应变检测部。半导体应变传感器在待测尺寸的应变范围内长时间地具有稳定的特性，并且在应变传感器芯片中产生的应变对应于被测量物体的应变的稳定的转换系数。应变传感器芯片用金属接合材料接合到金属基板上。金属基板具有从应变传感器芯片的一侧突出的两个或四个延伸部件，用于将应变传感器芯片附接到待测量对象。优选地，在对应于应变传感器芯片与金属基板接合的接合区域的金属底板下表面区域和延伸构件的下表面之间布置有凹槽，以及由凹槽夹持的突出部分布置在金属底板的下表面上。

5. 发明申请

US20120314313A1 OBJECT LENS DRIVE UNIT AND OPTICAL PICKUP USING THE SAME 有权
标题翻译：对象镜头驱动单元和使用相同的光学拾取单元
公开(公告)号：US20120314313A1
公开(公告)日：2012-12-13
申请号：US13430816
申请日：2012-03-27
申请人： Atsushi KAZAMA , Katsuhiko KIMURA , Takahiro YAMAGUCHI , Souichirou YAMADA
发明人： Atsushi KAZAMA , Katsuhiko KIMURA , Takahiro YAMAGUCHI , Souichirou YAMADA
IPC分类号： G02B7/04
CPC分类号： G11B7/0932
摘要： In the object lens drive unit including a lens holder with an object lens attached to, a plurality of driving coils attached to the lens holder, connection substrates attached to both sides of the lens holder, and a plurality of suspension wires with end parts thereof connected to the connection substrates for operatively supporting the lens holder, a plurality of sets of wire connection electrodes for connecting the suspension wires and coil connection electrodes electrically connected to the wire connection electrodes for connecting terminal wires of the coils are arranged in line in an optic axis direction of the object lens and the wire connection electrodes and the coil connection electrodes are formed in a symmetric shape to a central axis parallel to the optic axis direction on the connection substrates.
摘要翻译：在包括安装有物镜的透镜保持器的物镜驱动单元中，安装在透镜保持器上的多个驱动线圈，连接到透镜保持器两侧的连接基板和多个悬挂线，其端部连接到用于可操作地支撑透镜保持器的连接基板，用于连接悬挂线的多组线连接电极和电连接到用于连接线圈的端子线的线连接电极的线圈连接电极在光轴物镜和线连接电极和线圈连接电极的方向形成为与连接基板上的光轴方向平行的中心轴对称的形状。

6. 发明申请

US20110227178A1 SEMICONDUCTOR STRAIN SENSOR 有权
标题翻译：半导体应变传感器
公开(公告)号：US20110227178A1
公开(公告)日：2011-09-22
申请号：US12674419
申请日：2008-07-25
申请人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
发明人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
IPC分类号： H01L29/84
CPC分类号： G01L1/18 , G01B7/16 , G01L1/2293
摘要： A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.
摘要翻译：一种半导体应变传感器，具有由具有压阻元件的半导体基板构成的应变传感器芯片作为应变检测部。半导体应变传感器在待测尺寸的应变范围内长时间地具有稳定的特性，并且在应变传感器芯片中产生的应变对应于被测量物体的应变的稳定的转换系数。应变传感器芯片用金属接合材料接合到金属基板上。金属基板具有从应变传感器芯片的一侧突出的两个或四个延伸部件，用于将应变传感器芯片附接到待测量对象。优选地，在对应于应变传感器芯片与金属基板接合的接合区域的金属底板下表面区域和延伸构件的下表面之间布置有凹槽，以及由凹槽夹持的突出部分布置在金属底板的下表面上。

7. 发明授权

US08022433B2 Semiconductor sensor device and method for manufacturing same 有权
标题翻译：半导体传感器装置及其制造方法
公开(公告)号：US08022433B2
公开(公告)日：2011-09-20
申请号：US12282986
申请日：2007-08-27
申请人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
发明人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
IPC分类号： H01L33/00 , H01L29/84 , H01L21/00
CPC分类号： G01P15/125 , B81C1/00873 , G01C19/5719 , G01P1/023 , G01P15/0802 , G01P15/123 , G01P15/18 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2924/1461 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.
摘要翻译：提供了一种通过MEMS技术制造的半导体传感器装置，其中加工技术和/或材料技术与用于检测和测量各种物理量的半导体技术相结合。在半导体传感器装置中，消除了在帽芯片和模塑树脂中产生的裂纹，并且确保了半导体传感器芯片和盖芯片之间的气密性。通过使盖片的圆周侧表面作为湿蚀刻表面，可以消除由于切割时施加的振动引起的裂纹。此外，通过用绝缘保护膜涂覆盖芯片侧表面来确保绝缘。

8. 发明申请

US20080217752A1 Functional Device Package 有权
标题翻译：功能器件封装
公开(公告)号：US20080217752A1
公开(公告)日：2008-09-11
申请号：US12028108
申请日：2008-02-08
申请人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
发明人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
IPC分类号： H01L23/02
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.
摘要翻译：一种用于通过在晶片级焊接连接来密封功能器件的封装结构，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

9. 发明授权

US07388295B2 Multi-chip module 有权
标题翻译：多芯片模块
公开(公告)号：US07388295B2
公开(公告)日：2008-06-17
申请号：US11350919
申请日：2006-02-10
申请人： Atsushi Kazama , Akihiro Yaguchi , Hideo Miura , Asao Nishimura
发明人： Atsushi Kazama , Akihiro Yaguchi , Hideo Miura , Asao Nishimura
IPC分类号： H01L23/48
CPC分类号： H01L23/3157 , H01L23/3114 , H01L23/3171 , H01L24/10 , H01L24/13 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L25/105 , H01L2224/05599 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2225/1005 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The distance between farthest ones of external terminal positioned at an outermost end portions of said second semiconductor chip is smaller than that of the first semiconductor chip.
摘要翻译：多芯片模块具有至少两个半导体芯片。每个半导体芯片具有半导体芯片的芯片电极，用于与芯片电极电连接的导电互连，用于与互连电连接的导电焊盘，设置在焊盘上的外部端子以及介于两者之间的应力松弛层土地和半导体芯片。半导体芯片通过外部端子放置在安装板上。位于所述第二半导体芯片的最外端部的最外侧端子之间的距离小于第一半导体芯片的距离。

10. 发明授权

US07184619B2 Beam direction module and optical switch using the same 失效
标题翻译：光束方向模块和光开关使用相同
公开(公告)号：US07184619B2
公开(公告)日：2007-02-27
申请号：US10890131
申请日：2004-07-14
申请人： Atsushi Kazama , Kazuyuki Fukuda , Toshiya Shiramatsu , Masaya Horino , Yasuhiro Itou
发明人： Atsushi Kazama , Kazuyuki Fukuda , Toshiya Shiramatsu , Masaya Horino , Yasuhiro Itou
IPC分类号： G02B6/26
CPC分类号： G02B6/3556 , G02B6/32 , G02B6/3512 , G02B6/3544 , G02B6/357 , G02B6/3572 , G02B6/3578 , G02B6/3584
摘要： A beam direction module which can be applied to an optical switch, comprising: a collimator support member; a first mirror substrate including first micro-mirrors, and first windows through which beams can pass; a first electrode substrate including first mirror driving electrodes, and second windows through which beams can pass; a first spacer; a second mirror substrate including second micro-mirrors, and third windows through which beams can pass; a second electrode substrate including second mirror driving electrodes, and fourth windows through which beams can pass; a second spacer; and an inter-mirror spacer, wherein the first electrode substrate, the first spacer, the first mirror substrate, the inter-mirror spacer, the second mirror substrate, the second spacer and the second electrode substrate are stacked successively on the collimator support member and fixed between caps and the collimator support member while pins protruding from the collimator support member are inserted into alignment through-holes formed.
摘要翻译：可以应用于光开关的光束方向模块，包括：准直器支撑部件; 包括第一微反射镜的第一反射镜基板和光束能穿过的第一窗口; 第一电极基板，包括第一反射镜驱动电极和光束能通过的第二窗口; 第一间隔物包括第二微反射镜的第二反射镜基板和光束能穿过的第三窗口; 第二电极基板，包括第二反射镜驱动电极和第四窗口，波束可以通过该第四窗口; 第二间隔物以及反射镜间隔件，其中所述第一电极基板，所述第一间隔件，所述第一反射镜基板，所述反射镜间隔件，所述第二反射镜基板，所述第二间隔物和所述第二电极基板依次堆叠在所述准直器支撑部件上，固定在盖和准直器支撑构件之间，而从准直器支撑构件突出的销插入形成的对准通孔中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式