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1. 发明授权

US08474318B2 Acceleration sensor 失效
标题翻译：加速度传感器
公开(公告)号：US08474318B2
公开(公告)日：2013-07-02
申请号：US12670964
申请日：2008-06-25
申请人： Atsushi Kazama , Masakatsu Saitoh , Ryoji Okada , Takanori Aono
发明人： Atsushi Kazama , Masakatsu Saitoh , Ryoji Okada , Takanori Aono
IPC分类号： G01P15/12
CPC分类号： G01P15/18 , G01P15/123 , G01P2015/0842 , H01L24/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/00012
摘要： An acceleration sensor having a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam.
摘要翻译：一种加速度传感器，其具有支撑框架，通过柔性梁支撑在支撑框架内的重物，设置在梁上的半导体压阻元件和互连压阻元件的布线。加速度传感器根据压阻元件的电阻变化来检测加速度。应力阻尼部分设置在梁的那些部分上，排除了设置压电元件的部分。每个应力阻尼部分相对于梁的长度中心线和梁的宽度中心线之间的交点相对称。

2. 发明授权

US08438931B2 Semiconductor strain sensor 有权
标题翻译：半导体应变传感器
公开(公告)号：US08438931B2
公开(公告)日：2013-05-14
申请号：US12674419
申请日：2008-07-25
申请人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
发明人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
IPC分类号： G01L1/22
CPC分类号： G01L1/18 , G01B7/16 , G01L1/2293
摘要： A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.
摘要翻译：一种半导体应变传感器，具有由具有压阻元件的半导体基板构成的应变传感器芯片作为应变检测部。半导体应变传感器在待测尺寸的应变范围内长时间地具有稳定的特性，并且在应变传感器芯片中产生的应变对应于被测量物体的应变的稳定的转换系数。应变传感器芯片用金属接合材料接合到金属基板上。金属基板具有从应变传感器芯片的一侧突出的两个或四个延伸部件，用于将应变传感器芯片附接到待测量对象。优选地，在对应于应变传感器芯片与金属基板接合的接合区域的金属底板下表面区域和延伸构件的下表面之间布置有凹槽，以及由凹槽夹持的突出部分布置在金属底板的下表面上。

3. 发明申请

US20110227178A1 SEMICONDUCTOR STRAIN SENSOR 有权
标题翻译：半导体应变传感器
公开(公告)号：US20110227178A1
公开(公告)日：2011-09-22
申请号：US12674419
申请日：2008-07-25
申请人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
发明人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
IPC分类号： H01L29/84
CPC分类号： G01L1/18 , G01B7/16 , G01L1/2293
摘要： A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.
摘要翻译：一种半导体应变传感器，具有由具有压阻元件的半导体基板构成的应变传感器芯片作为应变检测部。半导体应变传感器在待测尺寸的应变范围内长时间地具有稳定的特性，并且在应变传感器芯片中产生的应变对应于被测量物体的应变的稳定的转换系数。应变传感器芯片用金属接合材料接合到金属基板上。金属基板具有从应变传感器芯片的一侧突出的两个或四个延伸部件，用于将应变传感器芯片附接到待测量对象。优选地，在对应于应变传感器芯片与金属基板接合的接合区域的金属底板下表面区域和延伸构件的下表面之间布置有凹槽，以及由凹槽夹持的突出部分布置在金属底板的下表面上。

4. 发明授权

US08022433B2 Semiconductor sensor device and method for manufacturing same 有权
标题翻译：半导体传感器装置及其制造方法
公开(公告)号：US08022433B2
公开(公告)日：2011-09-20
申请号：US12282986
申请日：2007-08-27
申请人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
发明人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
IPC分类号： H01L33/00 , H01L29/84 , H01L21/00
CPC分类号： G01P15/125 , B81C1/00873 , G01C19/5719 , G01P1/023 , G01P15/0802 , G01P15/123 , G01P15/18 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2924/1461 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.
摘要翻译：提供了一种通过MEMS技术制造的半导体传感器装置，其中加工技术和/或材料技术与用于检测和测量各种物理量的半导体技术相结合。在半导体传感器装置中，消除了在帽芯片和模塑树脂中产生的裂纹，并且确保了半导体传感器芯片和盖芯片之间的气密性。通过使盖片的圆周侧表面作为湿蚀刻表面，可以消除由于切割时施加的振动引起的裂纹。此外，通过用绝缘保护膜涂覆盖芯片侧表面来确保绝缘。

5. 发明申请

US20080217752A1 Functional Device Package 有权
标题翻译：功能器件封装
公开(公告)号：US20080217752A1
公开(公告)日：2008-09-11
申请号：US12028108
申请日：2008-02-08
申请人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
发明人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
IPC分类号： H01L23/02
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.
摘要翻译：一种用于通过在晶片级焊接连接来密封功能器件的封装结构，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

6. 发明授权

US07298972B2 Optical switch and a control method thereof 失效
标题翻译：光开关及其控制方法
公开(公告)号：US07298972B2
公开(公告)日：2007-11-20
申请号：US10670355
申请日：2003-09-26
申请人： Ryoji Okada , Tadaaki Ishikawa
发明人： Ryoji Okada , Tadaaki Ishikawa
IPC分类号： H04B10/08 , H04J14/00
CPC分类号： G02B6/3582 , G02B6/3512 , G02B6/3556 , G02B6/359 , G02B6/4204
摘要： An optical switch for switching communication light beams propagating through a plurality of optical fibers. The switch includes a plurality of input-side lenses, a plurality of moving mirrors, a plurality of output-side lenses, light emitting units, and light receiving units arranged for optical communication. The plurality of input-side lenses include first input-side lenses to which communication light beams coming from first external units and propagating through input-side optical fibers connect optically and second input-side lenses to which the light beams from the light emitting units connect optically. The plurality of output-side lenses include first output-side lenses for causing light beams passing therethrough to optically connect to second output-side optical fibers adapted to propagate the communication light beams to second external units and second output-side lenses for causing the light beams coming from the light emitting units and passing therethrough to optically connect to the light receiving units.
摘要翻译：一种用于切换通过多根光纤传播的通信光束的光学开关。该开关包括多个输入侧透镜，多个移动反射镜，多个输出侧透镜，发光单元和布置成用于光通信的光接收单元。多个输入侧透镜包括第一输入侧透镜，来自第一外部单元的通信光束和通过输入侧光纤传播的第一输入侧透镜与光发射单元的光束连接的第二输入侧透镜和第二输入侧透镜光学地。多个输出侧透镜包括第一输出侧透镜，用于使通过其的光束光学地连接到适于将通信光束传播到第二外部单元的第二输出侧光纤和用于引起光的第二输出侧透镜来自发光单元的光束通过其光学连接到光接收单元。

7. 发明申请

US20050117838A1 Optical switch and a control method thereof 失效
标题翻译：光开关及其控制方法
公开(公告)号：US20050117838A1
公开(公告)日：2005-06-02
申请号：US10670355
申请日：2003-09-26
申请人： Ryoji Okada , Tadaaki Ishikawa
发明人： Ryoji Okada , Tadaaki Ishikawa
IPC分类号： G02B26/08 , G02B6/26 , G02B6/35 , G02B6/42
CPC分类号： G02B6/3582 , G02B6/3512 , G02B6/3556 , G02B6/359 , G02B6/4204
摘要： An optical switch for switching communication light beams propagating through a plurality of optical fibers. The switch includes a plurality of input-side lenses, a plurality of moving mirrors, a plurality of output-side lenses, light emitting units, and light receiving units arranged for optical communication. The plurality of input-side lenses include first input-side lenses to which communication light beams coming from first external units and propagating through input-side optical fibers connect optically and second input-side lenses to which the light beams from the light emitting units connect optically. The plurality of output-side lenses include first output-side lenses for causing light beams passing therethrough to optically connect to second output-side optical fibers adapted to propagate the communication light beams to second external units and second output-side lenses for causing the light beams coming from the light emitting units and passing therethrough to optically connect to the light receiving units.
摘要翻译：一种用于切换通过多根光纤传播的通信光束的光学开关。该开关包括多个输入侧透镜，多个移动反射镜，多个输出侧透镜，发光单元和布置成用于光通信的光接收单元。多个输入侧透镜包括第一输入侧透镜，来自第一外部单元的通信光束和通过输入侧光纤传播的第一输入侧透镜与光发射单元的光束连接的第二输入侧透镜和第二输入侧透镜光学地。多个输出侧透镜包括第一输出侧透镜，用于使通过其的光束光学地连接到适于将通信光束传播到第二外部单元的第二输出侧光纤和用于引起光的第二输出侧透镜来自发光单元的光束通过其光学连接到光接收单元。

8. 发明授权

US4610718A Method for manufacturing ultra-fine particles 失效
标题翻译：超细颗粒的制造方法
公开(公告)号：US4610718A
公开(公告)日：1986-09-09
申请号：US726651
申请日：1985-04-24
申请人： Takeshi Araya , Ryoji Okada , Yoshiro Ibaraki , Susumu Hioki , Masatoshi Kanamaru , Yoshishige Endo , Mitsuaki Haneda
发明人： Takeshi Araya , Ryoji Okada , Yoshiro Ibaraki , Susumu Hioki , Masatoshi Kanamaru , Yoshishige Endo , Mitsuaki Haneda
IPC分类号： B22F9/14 , H05H1/28 , B01J2/04
CPC分类号： B22F9/14 , H05H1/28 , B22F2998/00
摘要： In a method wherein arcs are struck across a material to vaporize into ultra-fine particles and an electrode, thereby to manufacture the ultra-fine particles; the material to turn into the ultra-fine particles is arranged for at least either of the electrodes, and plasma currents are generated from the material and the electrode, whereby the formation rate of the ultra-fine particles per unit input is increased, and the material is formed in the shape of a rod or a wire, and a feeder capable of continuously supplying the material is disposed, whereby the ultra-fine particles can be continuously manufactured.
摘要翻译：在将电弧撞击穿过材料蒸发成超细颗粒和电极的方法中，从而制造超细颗粒; 对于电极中的至少任一个设置变成超细颗粒的材料，并且从材料和电极产生等离子体电流，由此每单位输入的超细颗粒的形成速率增加，并且材料形成为棒状或线状，并且配置能够连续供给材料的馈线，由此可以连续地制造超细颗粒。

9. 发明申请

US20090050990A1 SEMICONDUCTOR SENSOR DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体传感器装置及其制造方法
公开(公告)号：US20090050990A1
公开(公告)日：2009-02-26
申请号：US12282986
申请日：2007-08-27
申请人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
发明人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
IPC分类号： H01L29/84 , H01L21/58
CPC分类号： G01P15/125 , B81C1/00873 , G01C19/5719 , G01P1/023 , G01P15/0802 , G01P15/123 , G01P15/18 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2924/1461 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.
摘要翻译：提供了一种通过MEMS技术制造的半导体传感器装置，其中加工技术和/或材料技术与用于检测和测量各种物理量的半导体技术相结合。在半导体传感器装置中，消除了在帽芯片和模塑树脂中产生的裂纹，并且确保了半导体传感器芯片和盖芯片之间的气密性。通过使盖片的圆周侧表面作为湿蚀刻表面，可以消除由于切割时施加的振动引起的裂纹。此外，通过用绝缘保护膜涂覆盖芯片侧表面来确保绝缘。

10. 发明申请

US20070062282A1 Combined sensor and its fabrication method 审中-公开
标题翻译：组合传感器及其制造方法
公开(公告)号：US20070062282A1
公开(公告)日：2007-03-22
申请号：US11516927
申请日：2006-09-06
申请人： Teruhisa Akashi , Ryoji Okada , Masahide Hayashi , Kengo Suzuki
发明人： Teruhisa Akashi , Ryoji Okada , Masahide Hayashi , Kengo Suzuki
IPC分类号： G01P15/08
CPC分类号： G01P15/0802 , G01C19/5719 , G01P15/097 , G01P15/14 , G01P15/18 , G01P2015/082
摘要： A sensor structure using vibrating sensor elements which can detect an angular rate and accelerations in two axes at the same time is provided. 2 sets of vibration units which vibrate in out-of-phase mode (tunning-fork vibration) and include four vibrating sensor elements of the approximately same shape supported on a substrate in a vibratile state are provided and the vibrating sensor elements are disposed so that vibration axes of the vibration units cross each other at right angles. Each of the vibrating sensor elements includes a pair of detection units and adjustment units for adjusting a vibration frequency. The vibrating sensor elements constitute a combined sensor having supporting structure for supporting the vibrating sensor elements independently so that the vibrating sensor elements do not interfere with each other.
摘要翻译：提供了使用能够同时检测两个轴的角速度和加速度的振动传感器元件的传感器结构。提供了2组以异相模式（调音叉振动）振动的振动单元，并且包括以振动状态支撑在基板上的大致相同形状的四个振动传感器元件，并且将振动传感器元件设置成振动单元的振动轴线成直角交叉。每个振动传感器元件包括一对检测单元和用于调节振动频率的调节单元。振动传感器元件构成具有用于独立地支撑振动传感器元件的支撑结构的组合传感器，使得振动传感器元件彼此不干涉。

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