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1. 发明授权

US09559137B2 Color filter of illumination image sensor and method for fabricating the same 有权
标题翻译：照明图像传感器的滤色器及其制造方法
公开(公告)号：US09559137B2
公开(公告)日：2017-01-31
申请号：US12940756
申请日：2010-11-05
申请人： Hao-Min Chen , Chen-Wei Lu , Chih-Kung Chang
发明人： Hao-Min Chen , Chen-Wei Lu , Chih-Kung Chang
IPC分类号： H01L27/146
CPC分类号： H01L27/1464 , H01L27/14621 , H01L27/14623
摘要： The invention provides a color filter of an illumination image sensor and a method for fabricating the same. A color filter of an illumination image sensor includes a light shield portion constructed by a plurality of grid photoresist patterns, wherein the light shield portion covers a back side surface of the silicon wafer in a periphery region of an illumination image sensor chip.
摘要翻译：本发明提供一种照明图像传感器的滤色器及其制造方法。照明图像传感器的滤色器包括由多个栅格光致抗蚀剂图案构成的遮光部，其中，遮光部覆盖照明图像传感器芯片的周边区域中的硅晶片的背面。

2. 发明申请

US20120113304A1 COLOR FILTER OF BACK SIDE ILLUMINATION IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：背面照明图像传感器的彩色滤光片及其制作方法
公开(公告)号：US20120113304A1
公开(公告)日：2012-05-10
申请号：US12940756
申请日：2010-11-05
申请人： Hao-Min CHEN , Chen-Wei Lu , Chih-Kung Chang
发明人： Hao-Min CHEN , Chen-Wei Lu , Chih-Kung Chang
IPC分类号： H04N5/335
CPC分类号： H01L27/1464 , H01L27/14621 , H01L27/14623
摘要： The invention provides a color filter of an illumination image sensor and a method for fabricating the same. A color filter of an illumination image sensor includes a light shield portion constructed by a plurality of grid photoresist patterns, wherein the light shield portion covers a back side surface of the silicon wafer in a periphery region of an illumination image sensor chip.
摘要翻译：本发明提供一种照明图像传感器的滤色器及其制造方法。照明图像传感器的滤色器包括由多个栅格光致抗蚀剂图案构成的遮光部，其中，遮光部覆盖照明图像传感器芯片的周边区域中的硅晶片的背面。

3. 发明授权

US07505206B2 Microlens structure for improved CMOS image sensor sensitivity 有权
标题翻译：微透镜结构提高了CMOS图像传感器的灵敏度
公开(公告)号：US07505206B2
公开(公告)日：2009-03-17
申请号：US11456249
申请日：2006-07-10
申请人： Jack Deng , Chih-Kung Chang , Chin Chen Kuo , Ming-Chang Kao , Fu-Tien Weng , Bii-Junq Chang
发明人： Jack Deng , Chih-Kung Chang , Chin Chen Kuo , Ming-Chang Kao , Fu-Tien Weng , Bii-Junq Chang
IPC分类号： G02B27/10
CPC分类号： G02B3/0056 , G02B3/0018
摘要： A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
摘要翻译：一种通过在包括光电传感器的衬底上沉积微透镜材料层来制造微透镜器件的方法。然后将微透镜材料层曝光和显影以限定微透镜材料元件，包括第一微透镜材料元件和第二微透镜材料元件。每个第二微透镜材料元件相对于每个第一微透镜材料元件的厚度基本上更大。然后将微透镜材料元件加热以形成微透镜阵列，其包括每个对应于第一微透镜材料元件的第一微透镜阵列元件和分别对应于第二微透镜材料元件的第二微透镜阵列元件。每个第一微透镜阵列元件相对于每个第二微透镜阵列元件具有大得多的焦距。例如，每个第二微透镜阵列元件相对于每个第一微透镜阵列元件的厚度基本上更大。

4. 发明申请

US20080007839A1 NOVEL MICROLENS STRUCTURE FOR CIS SENSITIVITY IMPROVEMENT 有权
标题翻译：用于CIS敏感性改进的新型微结构结构
公开(公告)号：US20080007839A1
公开(公告)日：2008-01-10
申请号：US11456249
申请日：2006-07-10
申请人： Jack DENG , Chih-Kung CHANG , Chin Chen KUO , M. C. KAO , Fu-Tien WENG , Bii-Junq CHANG
发明人： Jack DENG , Chih-Kung CHANG , Chin Chen KUO , M. C. KAO , Fu-Tien WENG , Bii-Junq CHANG
IPC分类号： G02B25/00 , G02B3/00
CPC分类号： G02B3/0056 , G02B3/0018
摘要： A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
摘要翻译：一种通过在包括光电传感器的衬底上沉积微透镜材料层来制造微透镜器件的方法。然后将微透镜材料层曝光和显影以限定微透镜材料元件，包括第一微透镜材料元件和第二微透镜材料元件。每个第二微透镜材料元件相对于每个第一微透镜材料元件的厚度基本上更大。然后将微透镜材料元件加热以形成微透镜阵列，其包括每个对应于第一微透镜材料元件的第一微透镜阵列元件和分别对应于第二微透镜材料元件的第二微透镜阵列元件。每个第一微透镜阵列元件相对于每个第二微透镜阵列元件具有大得多的焦距。例如，每个第二微透镜阵列元件相对于每个第一微透镜阵列元件的厚度基本上更大。

5. 发明申请

US20070279520A1 IMAGE SENSING DEVICE AND PACKAGE METHOD THEREFOR 审中-公开
标题翻译：图像感测装置及其包装方法
公开(公告)号：US20070279520A1
公开(公告)日：2007-12-06
申请号：US11676813
申请日：2007-02-20
申请人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： H04N5/238
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L2224/13 , H04N5/2257
摘要： A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
摘要翻译：提供了一种用于图像感测装置的封装模块。封装模块包括其上具有光电元件阵列的基板，形成在光电元件阵列上的第一光学元件阵列，封装盖，其上具有与第一光学元件阵列相对的第二光学元件阵列，并且具有与第一光学元件阵列; 以及间隔件，设置在封装盖和基板之间的接合区域上，用于调节封装盖和基板之间的距离。

6. 发明授权

US07264976B2 Advance ridge structure for microlens gapless approach 有权
标题翻译：用于微透镜无间隙方法的前进脊结构
公开(公告)号：US07264976B2
公开(公告)日：2007-09-04
申请号：US11064452
申请日：2005-02-23
申请人： Jack Deng , Chin Chen Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
发明人： Jack Deng , Chin Chen Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： G02B3/0018 , B29D11/00278 , H01L27/14627 , H01L27/14685
摘要： A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
摘要翻译：在衬底上制造多个微透镜的方法包括在衬底上形成具有限定多个开口的凸脊的栅格，并且形成多个图案化的光刻胶特征，每个设置在多个开口中的一个开口内。然后，多个图案化的光致抗蚀剂特征可以在网格内回流。

7. 发明申请

US20060189024A1 Microlens structure for image sensors 有权
标题翻译：图像传感器的微透镜结构
公开(公告)号：US20060189024A1
公开(公告)日：2006-08-24
申请号：US11181508
申请日：2005-07-14
申请人： Ming-Chang Kao , Chih-Kung Chang , Fu-Tien Weng , Bii-Junq Chang
发明人： Ming-Chang Kao , Chih-Kung Chang , Fu-Tien Weng , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： H01L27/14685 , H01L27/14627
摘要： A microlens structure and a method of fabrication thereof are provided. The method comprises forming a layer of microlens material over a substrate, which has photo-sensitive elements formed therein. The microlens material, which comprises a photo-resist material, is exposed in accordance with a desired pattern a plurality of times. The energy used with each exposure process is less than the energy required if a single exposure is used. Furthermore, the masks used for each exposure may differ. In an embodiment, the masks are varied so as to create a notch in the upper corner of the microlens.
摘要翻译：提供微透镜结构及其制造方法。该方法包括在其上形成有光敏元件的衬底上形成微透镜材料层。包含光致抗蚀剂材料的微透镜材料根据期望的图案多次曝光。每次曝光过程中使用的能量小于使用单次曝光所需的能量。此外，用于每次曝光的掩模可能不同。在一个实施例中，改变掩模以便在微透镜的上角形成凹口。

8. 发明授权

US06660641B1 Method for forming crack resistant planarizing layer within microelectronic fabrication 有权
标题翻译：在微电子制造中形成抗裂平面化层的方法
公开(公告)号：US06660641B1
公开(公告)日：2003-12-09
申请号：US10190273
申请日：2002-07-05
申请人： Chin Chen Kuo , Sheng Liang Pan , Yu-Kung Hsiao , Chih-Kung Chang , Fu-Tien Wong , Chung Sheng Hsiung
发明人： Chin Chen Kuo , Sheng Liang Pan , Yu-Kung Hsiao , Chih-Kung Chang , Fu-Tien Wong , Chung Sheng Hsiung
IPC分类号： H01L21311
CPC分类号： H01L21/31053 , G03F7/094 , H01L27/14685
摘要： Within a method for forming a planarizing layer within a microelectronic fabrication, there is employed formed upon a partially photoexposed planarizing layer formed of a partially photoexposed negative photoresist material a sacrificial layer. Within the method, when sequentially: (1) stripping from the partially photoexposed planarizing layer the sacrificial layer; and (2) developing the partially photoexposed planarizing layer to form a developed planarizing layer, the developed planarizing layer is formed with enhanced planarity and diminished thickness.
摘要翻译：在用于在微电子制造中形成平坦化层的方法中，使用由部分光曝光的负光致抗蚀剂材料形成的部分光致曝光的平坦化层形成牺牲层。在该方法中，当顺序地：（1）从部分光刻的平坦化层剥离牺牲层; 和（2）显影部分光刻的平坦化层以形成显影的平坦化层，显影的平坦化层形成具有增强的平面性和减小的厚度。

9. 发明授权

US06590239B2 Color filter image array optoelectronic microelectronic fabrication with a planarizing layer formed upon a concave surfaced color filter region 有权
标题翻译：滤色器图像阵列光电子微电子制造，其具有形成在凹面的滤色器区域上的平坦化层
公开(公告)号：US06590239B2
公开(公告)日：2003-07-08
申请号：US09918043
申请日：2001-07-30
申请人： Chung-Sheng Hsiung , Kuo-Liang Lu , Yu-Kung Hsiao , Chih-Kung Chang , Fu-Tien Wong , Sung-Yung Yang , Chin-Chen Kuo
发明人： Chung-Sheng Hsiung , Kuo-Liang Lu , Yu-Kung Hsiao , Chih-Kung Chang , Fu-Tien Wong , Sung-Yung Yang , Chin-Chen Kuo
IPC分类号： H01L27148
CPC分类号： H01L31/02162 , H01L27/14627 , H01L27/14685 , H01L27/156
摘要： Within a method for forming a color filter image array optoelectronic microelectronic fabrication, and the color filter image array optoelectronic microelectronic fabrication formed employing the method, there is provided a substrate having formed therein a series of photo active regions. There is also formed over the substrate at least one color filter layer having formed therein a color filter region having a concave upper surface. There is also formed upon the at least one color filter layer and planarizing the at least one color filter region having the concave upper surface, a planarizing layer. The planarizing layer provides for enhanced resolution of the color filter image array optoelectronic microelectronic fabrication.
摘要翻译：在用于形成滤光器图像阵列光电微电子制造的方法和使用该方法形成的滤色器图像阵列光电微电子制造中，提供了在其中形成有一系列光活性区域的基板。还在衬底上形成至少一个滤色器层，其中形成有具有凹上表面的滤色器区域。还形成在至少一个滤色器层上，并平坦化具有凹面上表面的至少一个滤色器区域，平坦化层。平坦化层提供了彩色滤光片图像阵列光电子微电子制造的增强分辨率。

10. 发明授权

US07507598B2 Image sensor fabrication method and structure 有权
标题翻译：图像传感器制造方法和结构
公开(公告)号：US07507598B2
公开(公告)日：2009-03-24
申请号：US11156794
申请日：2005-06-20
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

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