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1. 发明申请

US20070279520A1 IMAGE SENSING DEVICE AND PACKAGE METHOD THEREFOR 审中-公开
标题翻译：图像感测装置及其包装方法
公开(公告)号：US20070279520A1
公开(公告)日：2007-12-06
申请号：US11676813
申请日：2007-02-20
申请人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： H04N5/238
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L2224/13 , H04N5/2257
摘要： A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
摘要翻译：提供了一种用于图像感测装置的封装模块。封装模块包括其上具有光电元件阵列的基板，形成在光电元件阵列上的第一光学元件阵列，封装盖，其上具有与第一光学元件阵列相对的第二光学元件阵列，并且具有与第一光学元件阵列; 以及间隔件，设置在封装盖和基板之间的接合区域上，用于调节封装盖和基板之间的距离。

2. 发明授权

US07507598B2 Image sensor fabrication method and structure 有权
标题翻译：图像传感器制造方法和结构
公开(公告)号：US07507598B2
公开(公告)日：2009-03-24
申请号：US11156794
申请日：2005-06-20
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

3. 发明申请

US20060189062A1 Advance ridge structure for microlens gapless approach 有权
标题翻译：用于微透镜无间隙方法的前进脊结构
公开(公告)号：US20060189062A1
公开(公告)日：2006-08-24
申请号：US11064452
申请日：2005-02-23
申请人： Jack Deng , Chin Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
发明人： Jack Deng , Chin Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
IPC分类号： H01L21/00 , H01L21/8238 , H01L27/14
CPC分类号： G02B3/0018 , B29D11/00278 , H01L27/14627 , H01L27/14685
摘要： A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
摘要翻译：在衬底上制造多个微透镜的方法包括在衬底上形成具有限定多个开口的凸脊的栅格，并且形成多个图案化的光刻胶特征，每个设置在多个开口中的一个开口内。然后，多个图案化的光致抗蚀剂特征可以在网格内回流。

4. 发明授权

US08129762B2 Image sensor 有权
标题翻译：图像传感器
公开(公告)号：US08129762B2
公开(公告)日：2012-03-06
申请号：US12347427
申请日：2008-12-31
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L27/148
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

5. 发明授权

US07071032B2 Material to improve image sensor yield during wafer sawing 失效
标题翻译：材料可以提高晶圆锯切时的图像传感器产量
公开(公告)号：US07071032B2
公开(公告)日：2006-07-04
申请号：US10431275
申请日：2003-05-07
申请人： Hung-Jen Hsu , Yu-Kung Hsiao , Chih-Kung Chang , Sheng-Liang Pan , Fu-Tien Weng
发明人： Hung-Jen Hsu , Yu-Kung Hsiao , Chih-Kung Chang , Sheng-Liang Pan , Fu-Tien Weng
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/6836 , H01L21/78 , H01L27/14683 , H01L2221/68327
摘要： A new method is provided of treating the wafer prior to the process of singulating the wafer into individual die. A first surface of the wafer over which CMOS image sensor devices have been created is coated with a layer of material that is non-soluble in water. The wafer is attached to a tape by bringing a second surface of the wafer in contact with the tape. The wafer is singulated by approaching the first surface of the wafer and by sawing first through the layer of material that has been coated over the first surface of the wafer and by then sawing through the wafer, stopping at the surface of the tape. A thorough water rinse is applied to the surface of the singulated wafer, followed by a wafer clean applying specific chemicals for this purpose. The singulated die is now removed from the tape and further processed by applying steps of die mount, wire bonding, surrounding the die in a mold compound and marking the package.
摘要翻译：提供了一种新的方法，在将晶片分离成单独的芯片的过程之前处理晶片。已经在其上形成CMOS图像传感器装置的晶片的第一表面涂覆有不溶于水的材料层。通过使晶片的第二表面与带接触而将晶片附接到带。通过接近晶片的第一表面并通过首先穿过已经涂覆在晶片的第一表面上的材料层，然后通过晶片锯切，停止在带的表面，将晶片分离。将彻底的水冲洗施加到单片晶片的表面，接着进行晶片清洁以应用特定的化学品用于此目的。单片模具现在从胶带中取出并通过将模具安装，引线接合，将模具包围在模具化合物中并标记包装件的步骤进一步处理。

6. 发明授权

US06964916B2 Image sensor fabrication method and structure 失效
标题翻译：图像传感器制造方法和结构
公开(公告)号：US06964916B2
公开(公告)日：2005-11-15
申请号：US10781217
申请日：2004-02-17
申请人： Chin Chen Kuo , Chih-Kung Chang , Hung-Jen Hsu , Fu-Tien Weng , Te-Fu Tseng
发明人： Chin Chen Kuo , Chih-Kung Chang , Hung-Jen Hsu , Fu-Tien Weng , Te-Fu Tseng
IPC分类号： H01L21/46 , H01L21/78 , H01L27/146 , H01L29/768
CPC分类号： H01L27/14621 , H01L27/14625 , H01L27/14685
摘要： A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.
摘要翻译：一种用于处理半导体衬底的方法包括提供具有至少一个过滤器区域的衬底，其中具有多个焊盘。金属沉积在接合焊盘上方，以减少焊盘台阶高度。形成平坦化层，使得沉积的金属具有接近平坦化层的高度的高度。在平坦化层上方形成至少一层耐光层。

7. 发明申请

US20090104547A1 IMAGE SENSOR 有权
标题翻译：图像传感器
公开(公告)号：US20090104547A1
公开(公告)日：2009-04-23
申请号：US12347427
申请日：2008-12-31
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： G03F3/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
摘要翻译：提供了一种处理衬底的方法。衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。在衬底上形成第一平坦化层。平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

8. 发明申请

US20070018073A1 CMOS image sensor device with beehive pattern color sensor cell array 审中-公开
标题翻译：具有蜂窝图案彩色传感器单元阵列的CMOS图像传感器装置
公开(公告)号：US20070018073A1
公开(公告)日：2007-01-25
申请号：US11213186
申请日：2005-08-25
申请人： Tzu-Hsuan Hsu , Dun-Nian Yaung , Chih-Kung Chang
发明人： Tzu-Hsuan Hsu , Dun-Nian Yaung , Chih-Kung Chang
IPC分类号： H01L27/00
CPC分类号： H01L27/14645 , H01L27/14641 , H04N5/37457 , H04N9/045
摘要： A CMOS image sensor cell includes a first pixel area in which at least one first photodiode is disposed for generating a first sense signal in response to a photo-signal of a first color; a second pixel area neighboring the first pixel area, in which at least one second photodiode is disposed for generating a second sense signal in response to a photo-signal of a second color; and a third pixel area neighboring the first and second pixel areas, in which at least one third photodiode is disposed for generating a third sense signal in response to a photo-signal of a third color. A sense amplifier is disposed substantially within the first, second and third pixel areas for amplifying the first, second and third sense signals. The first, second and third pixel areas that substantially occupy an entire area of the image sensor cell are substantially equal in size.
摘要翻译： CMOS图像传感器单元包括第一像素区域，其中至少一个第一光电二极管被设置用于响应于第一颜色的光信号产生第一感测信号; 与第一像素区域相邻的第二像素区域，其中设置至少一个第二光电二极管以响应于第二颜色的光信号产生第二感测信号; 以及与所述第一和第二像素区域相邻的第三像素区域，其中设置至少一个第三光电二极管以响应于第三颜色的光信号产生第三感测信号。读出放大器基本上设置在第一，第二和第三像素区域内，用于放大第一，第二和第三感测信号。基本上占据图像传感器单元的整个区域的第一，第二和第三像素区域的尺寸基本相等。

9. 发明申请

US20060019424A1 Image sensor fabrication method and structure 有权
公开(公告)号：US20060019424A1
公开(公告)日：2006-01-26
申请号：US11156794
申请日：2005-06-20
申请人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
发明人： Fu-Tien Weng , Yu-Kung Hsiao , Hung-Jen Hsu , Yi-Ming Dai , Chin Chen Kuo , Te-Fu Tseng , Chih-Kung Chang , Jack Deng , Chung-Sheng Hsiung , Bii-Junq Chang
IPC分类号： H01L21/00
CPC分类号： H01L27/14625 , H01L23/544 , H01L27/14621 , H01L27/14627 , H01L27/14685 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

10. 发明授权

US06671396B1 Method to monitor stepper lens quality in color filter process 有权
标题翻译：监控滤色镜过程中步进镜头质量的方法
公开(公告)号：US06671396B1
公开(公告)日：2003-12-30
申请号：US09664421
申请日：2000-09-18
申请人： Chih-Kung Chang , Bii-Jung Chang , Sheng-Liang Pang , Kuo-Liang Lu
发明人： Chih-Kung Chang , Bii-Jung Chang , Sheng-Liang Pang , Kuo-Liang Lu
IPC分类号： G06K900
CPC分类号： G03F7/70591 , G03F1/44 , G03F7/70916
摘要： Pigment-based resists tend to give off a certain amount of organic vapor during exposure. This brings about contamination of the projection lens surface as well as other parts of the system. A method to monitor this accumulation of solvent vapor on the lens surface is disclosed, based on a test matrix (in which exposure time and focal distance are systematically varied) through which a series of images are formed in the resist and then evaluated for quality. A key feature is the test patterns that are used for forming the images. Said patterns are designed so as to maximize the total amount of diffraction that occurs during image formation, thereby maximizing sensitivity to changes in lens quality. Several examples of the test patterns are provided.
摘要翻译：颜料基抗蚀剂倾向于在曝光期间发出一定量的有机蒸气。这导致投影透镜表面以及系统的其它部分的污染。基于通过其在抗蚀剂中形成一系列图像然后对质量进行评估的测试矩阵（其中曝光时间和焦距被系统地改变）来监测溶剂蒸汽在透镜表面上的累积的方法。关键特征是用于形成图像的测试图案。所述图案被设计成使得在图像形成期间发生的总的衍射量最大化，从而使对透镜质量变化的灵敏度最大化。提供了几个测试模式的例子。

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