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    • 5. 发明授权
    • Method to make a perpendicular magnetic recording head with a bottom side shield
    • 制造具有底侧屏蔽的垂直磁记录头的方法
    • US07978431B2
    • 2011-07-12
    • US11809346
    • 2007-05-31
    • Cherng-Chyi HanMin LiFenglin LiuLijie Guan
    • Cherng-Chyi HanMin LiFenglin LiuLijie Guan
    • G11B5/127
    • G11B5/3163G11B5/1278G11B5/3116G11B5/315Y10T29/49032Y10T29/49052
    • A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a separated pair of bottom side shields and shielded from above by an upper shield. The bottom side shields surround a lower portion of the pole tip while the upper portion of the pole tip is surrounded by non-magnetic layers. The bottom shields and the non-magnetic layer form wedge-shaped trench in which the pole tip is formed by a self-aligned plating process. The wedge shape is formed by a RIE process using specific gases applied through a masking layer formed of material that has a slower etch rate than the non-magnetic material or the shield material. A masking layer of Ta, Ru/Ta, TaN or Ti, formed on a non-magnetic layer of alumina that is formed on a shield layer of NiFe and using RIE gases of CH3OH, CO or NH3 or their combinations, produces the desired result. A write gap layer and an upper shield is then formed above the side shields and pole. The resulting structure substantially eliminates track overwrite while maintaining good track definition.
    • 垂直磁记录(PMR)头被制造成具有通过分离的一对底侧屏蔽横向屏蔽的极尖,并由上屏蔽从上面屏蔽。 底侧屏蔽围绕极尖的下部,而极尖的上部被非磁性层包围。 底部屏蔽层和非磁性层形成楔形沟槽,其中极尖通过自对准电镀工艺形成。 楔形形状通过RIE工艺形成,其使用通过由比非磁性材料或屏蔽材料具有较慢蚀刻速率的材料形成的掩模层施加的特定气体。 形成在NiFe的屏蔽层上并使用CH 3 OH,CO或NH 3的RIE气体或其组合的形成在氧化铝的非磁性层上的Ta,Ru / Ta,TaN或Ti的掩蔽层产生期望的结果 。 然后在侧屏和极上方形成写间隙层和上屏蔽。 所得到的结构基本上消除了轨道重写,同时保持良好的轨道定义。
    • 10. 发明申请
    • Method For Manufacturing Wraparound Shield Write Head Using Hard Masks
    • 使用硬掩模制造绕组屏蔽写头的方法
    • US20130026131A1
    • 2013-01-31
    • US13193520
    • 2011-07-28
    • Shiwen HuangFenglin LiuQiping ZhongKyusik ShinYingjian Chen
    • Shiwen HuangFenglin LiuQiping ZhongKyusik ShinYingjian Chen
    • G11B5/127
    • G11B5/3116G11B5/3163
    • The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.
    • 本公开描述了通过实施三层(三层)硬掩模制造全封装屏蔽镶嵌写头的方法。 根据本发明的实施例,在形成写入头期间,各种硬掩模层用于不同的目的。 本发明的环绕式屏蔽头表现出改进的物理特性,进一步导致改善的性能特征。 根据本发明的硬掩模层的使用允许使用可以比其它工艺中使用的那些方法更加严格地控制的制造工艺。 例如,可以使用较小尺寸的光刻技术。 此外,在使用CMP工艺不如使用本发明可能的沉积或光刻技术那样不受控制的情况下,对某些CMP工艺的依赖是不必要的。