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    • 3. 发明申请
    • Design method of semiconductor device and semiconductor device
    • 半导体器件和半导体器件的设计方法
    • US20060101367A1
    • 2006-05-11
    • US11262966
    • 2005-11-01
    • Kazuhisa FujitaFumihiro KimuraTakayuki Araki
    • Kazuhisa FujitaFumihiro KimuraTakayuki Araki
    • G06F17/50G06F9/45G06F9/455
    • G06F17/5081
    • In an error analysis step, analysis of an antenna effect error, a timing constraint violation and the like is performed for layout data in which redundant via conversion has been performed. Then, whether or not an error exists is judged and, among redundant vias located on a signal line in which a design constraint violation has occurred, how many vias have to be converted to single vias, respectively, to avoid the design constraint violation is calculated. In a via conversion step, a redundant via which has caused an error is converted to a single via, based on a result of the calculation. Thus, a design constraint violation regarding an error such as an antenna effect error and a timing constraint violation caused by a redundant via obtained by converting a single via for improving yield hardly occurs.
    • 在误差分析步骤中,对已执行冗余通过转换的布局数据执行天线效应误差,定时约束违规等的分析。 然后,判断是否存在错误,并且在发生设计约束违规的信号线上的冗余通孔中,分别需要将多少个通孔转换为单个过孔以避免设计约束违规 。 在通孔转换步骤中,基于计算结果将导致错误的冗余通道转换为单个通孔。 因此,几乎不发生关于由通过转换单个通路而获得的冗余通路引起的诸如天线效应误差和定时约束违规之类的错误的设计约束违规。
    • 4. 发明授权
    • Wiring resistance correcting method
    • 接线电阻校正方法
    • US06708318B2
    • 2004-03-16
    • US09963563
    • 2001-09-27
    • Kazuhiro SatohFumihiro Kimura
    • Kazuhiro SatohFumihiro Kimura
    • G06F1750
    • G06F17/5077H01L22/20H01L2924/0002H01L2924/00
    • Where there are wirings with different film thicknesses or a sheet resistance in a non-scraped state of a wiring layer cannot be obtained as a result of the CPM technique, a wiring resistance according to a film thickness when an LSI is manufactured is acquired by automatic processing to reduce its difference from a real resistance, and accurate voltage drop analysis is carried out to reduce malfunction in a real chip. In a semiconductor circuit device with a plurality of kinds of film thicknesses in the same wiring layer, with a variation occurring in the wiring film thickness when wirings are formed on a silicon wafer, or a warp occurring in an upper layer because the stacking of lower layers is not uniform in the manufacturing process of the wiring, an error of the wiring resistance due to the difference in the film thickness or warp of the wiring is corrected to produce a virtual layout data.
    • 在采用CPM技术的情况下,由于不能获得具有不同膜厚度的布线或布线层的无刮擦状态的薄层电阻,因此通过自动获取当制造LSI时根据膜厚度的布线电阻 处理以减少与实际电阻的差异,并进行精确的电压降分析以减少真实芯片中的故障。 在同一布线层中具有多种膜厚的半导体电路器件中,当在硅晶片上形成布线时发生在布线膜厚度上的变化,或由于下层叠层而产生的翘曲 在布线的制造过程中层数不均匀,校正了由于膜厚度的差异或布线翘曲引起的布线电阻的误差,从而产生虚拟布局数据。
    • 10. 发明授权
    • LSI wire length estimation and area estimation
    • LSI线长度估计和面积估计
    • US5978572A
    • 1999-11-02
    • US915723
    • 1997-08-21
    • Masahiko ToyonagaFumihiro KimuraMinako FukumotoNoriko Koshita
    • Masahiko ToyonagaFumihiro KimuraMinako FukumotoNoriko Koshita
    • G06F17/50
    • G06F17/5072
    • The wire length of an LSI is estimated from a netlist describing connection information of the LSI and a cell library storing information as to cells used in the LSI design, with performing no rough placement and rough wiring by a layout system. Information necessary for wire length estimation is extracted from the netlist and the cell library. A net basic wire length is determined for each fan-out. In a net wire length estimating step, a net wire length for each fan-out is estimated by making reference to the determined net basic wire length and taking into account net expansion due to the cell distribution in a cell placement. Additionally, taking into account a terminal distribution and the aspect ratio of an estimation-target block, a correction on the estimated net wire length is made. From the corrected net wire length, the total wire length of the estimation-target block is estimated.
    • 从描述LSI的连接信息的网表和存储关于LSI设计中使用的单元的信息的单元库来估计LSI的线长度,不进行布局系统的粗糙布置和粗糙布线。 从网表和单元库中提取线长估计所需的信息。 确定每个扇出的净基本线长度。 在网线长度估计步骤中,通过参考确定的净基线长度并考虑由于单元布置中的单元分布引起的净扩展来估计每个扇出的净线长度。 此外,考虑到估计目标块的终端分布和纵横比,对估计的网线长度进行校正。 根据校正的网线长度,估计估计对象块的总线长度。