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1. 发明授权

US09335226B2 Force transducer forming a capacitive load cell 有权
标题翻译：强制传感器形成电容式称重传感器
公开(公告)号：US09335226B2
公开(公告)日：2016-05-10
申请号：US14118114
申请日：2012-05-11
申请人： Karlheinz Amtmann , Dominik Braun , Jörg Hassel , Harry Hedler , Hans-Peter Lindner , Delphine Meunier , Daniel Reznik , Klaus Röther , Dirk Scheibner , Arno Steckenborn , Oliver Theile
发明人： Karlheinz Amtmann , Dominik Braun , Jörg Hassel , Harry Hedler , Hans-Peter Lindner , Delphine Meunier , Daniel Reznik , Klaus Röther , Dirk Scheibner , Arno Steckenborn , Oliver Theile
IPC分类号： G01L13/02 , G01L1/04 , G01G3/12 , G01G7/06 , G01L1/14
CPC分类号： G01L1/04 , G01G3/12 , G01G7/06 , G01L1/142
摘要： A force transducer, in particular a load cell, includes a spring body that deforms when loaded with a force or load to be measured. Two support parts, which are separated by a gap, are moved out of a position of rest. A capacitive displacement detector is used to detect the relative movement of the support parts, where the capacitor includes two electrode combs that are each held on one of the support parts and includes a multiplicity of electrode fingers. The electrode combs are configured designed and mounted on the two support parts such that the electrode fingers of the one electrode comb pass into the finger interspaces of the other electrode comb when the spring body is loaded so that the force transducer is resistant to overloading.
摘要翻译：力传感器，特别是称重传感器，包括弹簧体，当加载有要测量的力或载荷时，弹簧体变形。由间隙分开的两个支撑部件移出静止位置。电容位移检测器用于检测支撑部分的相对运动，其中电容器包括两个电极梳，每个电极梳被保持在一个支撑部分上并且包括多个电极指。电极梳配置设计并安装在两个支撑部分上，使得当弹簧体被装载时，一个电极梳的电极指进入另一个电极梳的指状空隙中，使得力传感器抵抗过载。

2. 发明授权

US09151850B2 Radiation detector and imaging system 有权
标题翻译：辐射检测器和成像系统
公开(公告)号：US09151850B2
公开(公告)日：2015-10-06
申请号：US14124712
申请日：2012-05-21
申请人： Harry Hedler , Timothy Hughes , Martin Spahn , Stefan Wirth
发明人： Harry Hedler , Timothy Hughes , Martin Spahn , Stefan Wirth
IPC分类号： G01T1/20 , G01T1/28
CPC分类号： G01T1/2006 , G01T1/20 , G01T1/28
摘要： The invention relates to a radiation detector (100; 101; 102; 103; 104; 105; 106), having a scintillator (120) for generating electromagnetic radiation (202) in response to the action of incident radiation (200). The scintillator (120) has two opposing end faces (121; 122) and a lateral wall (123) between the end faces (121; 122). The radiation detector has, in addition, a conversion system (160) located on the lateral wall (123) of the scintillator (120), said system comprising a plurality of channels (165). Each channel (165) has a photocathode section (130; 131; 132) for generating electrons (204) in response to the action of electromagnetic radiation (202) that is generated by the scintillator (120), said electrons being multipliable by impact processes in the channels (165). A detection system (170) for detecting electrons (204) that have been multiplied in the channels (165) of the conversion system (160) is also provided. The invention also relates to an imaging system (110) comprising a radiation detector of this type (100; 101; 102; 103; 104; 105; 106).
摘要翻译：本发明涉及一种辐射检测器（100; 101; 102; 103; 104; 105; 106），其具有响应入射辐射（200）的作用产生电磁辐射（202）的闪烁体（120）。闪烁体（120）在端面（121; 122）之间具有两个相对的端面（121; 122）和侧壁（123）。此外，辐射检测器还具有位于闪烁体（120）的侧壁（123）上的转换系统（160），所述系统包括多个通道（165）。每个通道（165）具有响应于由闪烁体（120）产生的电磁辐射（202）的作用产生电子（204）的光电阴极部分（130; 131; 132），所述电子可通过冲击过程在通道（165）中。还提供了用于检测已经在转换系统（160）的通道（165）中相乘的电子（204）的检测系统（170）。本发明还涉及一种包括这种类型的辐射探测器（100; 101; 102; 103; 104; 105; 106）的成像系统（110）。

3. 发明申请

US20140124676A1 RADIATION DETECTOR AND IMAGING SYSTEM 有权
标题翻译：辐射探测器和成像系统
公开(公告)号：US20140124676A1
公开(公告)日：2014-05-08
申请号：US14124712
申请日：2012-05-21
申请人： Harry Hedler , Timothy Hughes , Martin Spahn , Stefan Wirth
发明人： Harry Hedler , Timothy Hughes , Martin Spahn , Stefan Wirth
IPC分类号： G01T1/20
CPC分类号： G01T1/2006 , G01T1/20 , G01T1/28
摘要： The invention relates to a radiation detector (100; 101; 102; 103; 104; 105; 106), having a scintillator (120) for generating electromagnetic radiation (202) in response to the action of incident radiation (200). The scintillator (120) has two opposing end faces (121; 122) and a lateral wall (123) between the end faces (121; 122). The radiation detector has, in addition, a conversion system (160) located on the lateral wall (123) of the scintillator (120), said system comprising a plurality of channels (165). Each channel (165) has a photocathode section (130; 131; 132) for generating electrons (204) in response to the action of electromagnetic radiation (202) that is generated by the scintillator (120), said electrons being multipliable by impact processes in the channels (165). A detection system (170) for detecting electrons (204) that have been multiplied in the channels (165) of the conversion system (160) is also provided. The invention also relates to an imaging system (110) comprising a radiation detector of this type (100; 101; 102; 103; 104; 105; 106).
摘要翻译：本发明涉及一种辐射检测器（100; 101; 102; 103; 104; 105; 106），其具有响应于入射辐射（200）的作用产生电磁辐射（202）的闪烁体（120）。闪烁体（120）在端面（121; 122）之间具有两个相对的端面（121; 122）和侧壁（123）。此外，辐射检测器还具有位于闪烁体（120）的侧壁（123）上的转换系统（160），所述系统包括多个通道（165）。每个通道（165）具有响应于由闪烁体（120）产生的电磁辐射（202）的作用产生电子（204）的光电阴极部分（130; 131; 132），所述电子可通过冲击过程在通道（165）中。还提供了用于检测已经在转换系统（160）的通道（165）中相乘的电子（204）的检测系统（170）。本发明还涉及一种包括这种类型的辐射探测器（100; 101; 102; 103; 104; 105; 106）的成像系统（110）。

4. 发明授权

US08598716B2 Semiconductor apparatus having stacked semiconductor components 失效
标题翻译：半导体装置具有堆叠的半导体元件
公开(公告)号：US08598716B2
公开(公告)日：2013-12-03
申请号：US11210723
申请日：2005-08-24
申请人： Harry Hedler , Roland Irsigler , Thorsten Meyer
发明人： Harry Hedler , Roland Irsigler , Thorsten Meyer
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2225/06513 , H01L2225/06524 , H01L2225/06527 , H01L2225/06586 , H01L2924/01078 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides an apparatus having stacked semiconductor components. Two semiconductor components (21, 26) are arranged such that their contact regions (28, 22) are opposite one another. A contact-connection device (29) forms a short electrical connection between the two contact regions (28, 22). The contact regions (28, 22) are connected to external contact regions (36) of the apparatus via a rewiring (23).
摘要翻译：本发明提供一种具有层叠半导体元件的装置。两个半导体部件（21,26）被布置成使得它们的接触区域（28,22）彼此相对。接触连接装置（29）在两个接触区域（28,22）之间形成短路电连接。接触区域（28,22）经由重新布线（23）连接到设备的外部接触区域（36）。

5. 发明申请

US20130249035A1 SILICON PHOTOMULTIPLIER AND RADIATION DETECTOR 审中-公开
标题翻译：硅光电探测器和辐射探测器
公开(公告)号：US20130249035A1
公开(公告)日：2013-09-26
申请号：US13822835
申请日：2011-08-22
申请人： Harry Hedler , Debora Henseler
发明人： Harry Hedler , Debora Henseler
IPC分类号： H01L31/0232
CPC分类号： H01L31/0232 , G01T1/2018 , G01T1/208 , G01T1/248 , H01L27/14609 , H01L27/14678 , H01L31/02325
摘要： A silicon photomultiplier has a silicon chip with an array of microcells. The microcells form photon-sensitive active areas, each surrounded by photon-insensitive inactive areas. At least one elevated, three-dimensional light concentrating structure is located directly on top of the silicon chip within an inactive area and configured such that photons that would have hit an inactive area are redirected towards an active area. The light concentrating structure does lead to increased detection efficiency. The SiPM is usable in areas like medical imaging (e.g. PET, SPECT, CT and other X-ray detectors) as well as astrophysics, high-energy physics and other analytics applications.
摘要翻译：硅光电倍增管具有具有微电池阵列的硅芯片。微细胞形成光子敏感的有源区，每个被光子不敏感的无活性区域包围。至少一个升高的三维聚光结构直接位于无源区域内的硅芯片的顶部，并且被配置为使得将击中非活动区域的光子被重定向到有源区域。光聚集结构确实导致检测效率提高。 SiPM可用于诸如医学成像（例如PET，SPECT，CT和其他X射线检测器）以及天体物理学，高能物理学和其他分析应用的领域。

6. 发明申请

US20120183732A1 THREE-DIMENSIONAL MICRO-STRUCTURE, ARRANGEMENT WITH AT LEAST TWO THREE-DIMENSIONAL MICRO-STRUCTURES, METHOD FOR PRODUCING THE MICRO-STRUCTURE AND USE OF THE MICRO-STRUCTURE 有权
标题翻译：三维微结构，具有至少两个三维微结构的布置，微结构的生产方法和微结构的使用
公开(公告)号：US20120183732A1
公开(公告)日：2012-07-19
申请号：US13499083
申请日：2010-09-20
申请人： Harry Hedler , Jörg Zapf
发明人： Harry Hedler , Jörg Zapf
IPC分类号： B32B3/00 , B23P11/00 , B29C39/10
CPC分类号： B81C99/0085 , B81B2203/0361 , B81B2207/056 , Y10T29/49826 , Y10T428/24355
摘要： A three-dimensional micro-structure has a plurality of adjacent micro-columns which are arranged at a distance from each other and essentially parallel in relation to the respective longitudinal extension. The micro-columns are made of at least one micro-column material having respectively an aspect ratio in the region of 20-1000 and respectively a micro-column diameter in the region of 0.1 μm-200 μm. A micro-column intermediate chamber is arranged between adjacent micro-columns having a micro-column distance selected from between the adjacent micro-columns in the region of 1 μm-100 μm. According to a method for producing the three-dimensional micro-structures: a) a template is provided with template material, b) the micro-column material is arranged in the column-like cavities, and c) the template is at least partially removed.
摘要翻译：三维微结构具有多个相邻的微型柱，它们彼此间隔一定距离并且相对于各个纵向延伸部基本平行。微柱由至少一个微柱材料制成，分别具有在20-1000的范围内的纵横比和分别为0.1μm-200μm的微柱直径。在相邻的微柱之间布置有微柱中间室，其具有从1μm至100μm的区域中的相邻微柱之间的微柱距离。根据生产三维微结构的方法：a）模板提供模板材料，b）微柱材料布置在柱状空腔中，c）模板至少部分去除。

7. 发明授权

US07820482B2 Method of producing an electronic component with flexible bonding 有权
标题翻译：制造具有柔性接合的电子部件的方法
公开(公告)号：US07820482B2
公开(公告)日：2010-10-26
申请号：US11124515
申请日：2005-05-06
申请人： Harry Hedler , Alfred Haimerl
发明人： Harry Hedler , Alfred Haimerl
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/31 , H01L21/469
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/13 , H01L2224/13099 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H01L2224/29099 , H01L2924/00
摘要： A method for producing an electronic component with an electronic circuit and electrical contacts, disposed at least on a first surface of the electronic component, for the electrical bonding of the electronic circuit includes at least one flexible elevation of an insulating material disposed on the first surface, at least one electrical contact disposed on the flexible elevation, and a conduction path disposed on the surface or in the interior of the flexible elevation between the electrical contact and the electronic circuit.
摘要翻译：一种用于制造具有电子电路的电子部件和至少设置在电子部件的第一表面上的用于电子电路的电气接合的电触头的方法，包括设置在第一表面上的绝缘材料的至少一个柔性高度，设置在柔性高度上的至少一个电触头，以及设置在电触点和电子电路之间的柔性高度的表面或内部的导电路径。

8. 发明申请

US20100065949A1 Stacked Semiconductor Chips with Through Substrate Vias 审中-公开
标题翻译：堆叠的半导体芯片通过基板通孔
公开(公告)号：US20100065949A1
公开(公告)日：2010-03-18
申请号：US12212498
申请日：2008-09-17
申请人： Andreas Thies , Harry Hedler , Roland Irsigler
发明人： Andreas Thies , Harry Hedler , Roland Irsigler
IPC分类号： H01L23/538 , H01L21/60
CPC分类号： H01L24/16 , H01L21/76898 , H01L23/481 , H01L24/11 , H01L24/12 , H01L24/17 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/0401 , H01L2224/0557 , H01L2224/13009 , H01L2224/13099 , H01L2224/16145 , H01L2224/81136 , H01L2224/81801 , H01L2224/83194 , H01L2224/838 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/01007 , H01L2224/05552
摘要： Structures and methods of forming stacked chips are disclosed. In one embodiment, a first chip is disposed over a second chip, a top surface of the first and the second chip includes active circuitry. A first through substrate via is disposed within the first chip, the first through substrate via includes a protruding tip projecting below a bottom surface of the first chip, the bottom surface being opposite the top surface. A second through substrate via is disposed on the second chip, the second through substrate via including an opening, wherein the first protruding tip of the first chip is disposed within the opening of the second chip.
摘要翻译：公开了形成堆叠芯片的结构和方法。在一个实施例中，第一芯片设置在第二芯片上，第一芯片和第二芯片的顶表面包括有源电路。第一穿通基板通孔设置在第一芯片内，第一通孔基板通孔包括在第一芯片的底表面下方突出的突出尖端，底表面与顶表面相对。第二穿通基板通孔设置在第二芯片上，第二通孔基板通孔包括开口，其中第一芯片的第一突出末端设置在第二芯片的开口内。

9. 发明授权

US07545048B2 Stacked die package 失效
标题翻译：堆叠模包
公开(公告)号：US07545048B2
公开(公告)日：2009-06-09
申请号：US12014632
申请日：2008-01-15
申请人： Torsten Meyer , Harry Hedler
发明人： Torsten Meyer , Harry Hedler
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3128 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/96 , H01L24/97 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/05644 , H01L2224/20 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/73265 , H01L2224/83192 , H01L2224/8385 , H01L2224/85001 , H01L2224/97 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06593 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , H01L2224/82 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked die package includes a substrate or interposer board that includes a contact area on a top surface and landing pads surrounding the contact area. Solder pads are disposed on an opposite side of the substrate. The solder pads are electrically connected with the landing pads by inner board wiring. A reconstituted die, which includes a die surrounded by a frame, is mounted over the substrate. A top die is mounted over the reconstituted die. Both the reconstituted die and the top die are electrically connected to the substrate, e.g., by wire bonds.
摘要翻译：堆叠的管芯封装包括衬底或插入板，其包括顶表面上的接触区域和围绕接触区域的接合焊盘。焊盘设置在基板的相对侧上。焊盘通过内板布线与着陆焊盘电连接。包括由框架包围的模具的重构模具安装在基板上。顶部模具安装在重构的模具上。重构的管芯和顶部管芯都通过例如引线接合而与衬底电连接。

10. 发明申请

US20080203575A1 Integrated Circuit with Re-Route Layer and Stacked Die Assembly 有权
标题翻译：集成电路与重新布线层和堆叠模组装
公开(公告)号：US20080203575A1
公开(公告)日：2008-08-28
申请号：US12116079
申请日：2008-05-06
申请人： Jochen Thomas , Peter Weitz , Jurgen Grafe , Harry Hedler , Jens Pohl
发明人： Jochen Thomas , Peter Weitz , Jurgen Grafe , Harry Hedler , Jens Pohl
IPC分类号： H01L23/482
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06575 , H01L2924/01019 , H01L2924/01057 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2924/00012
摘要： An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is coupled to the substrate, preferably by an adhesive. Wire leads electrically couple the bond pads of the first die to contacts on the substrate. A second die is placed on the first die, and wire leads electrically couple the bond pads of the second die to contacts on the substrate. Preferably, a spacer is placed between the first die and the second die. Additional dies may be stacked on the second die.
摘要翻译：堆叠式模具组件的装置和制造方法。第一管芯被放置在衬底上，使得管芯的背面，即与接合焊盘的侧面相反的一侧，优选地通过粘合剂耦合到衬底。引线将第一管芯的接合焊盘电耦合到衬底上的接触点。第二管芯被放置在第一管芯上，引线将第二管芯的接合焊盘电耦合到衬底上的接触点。优选地，间隔件被放置在第一管芯和第二管芯之间。另外的模具可以堆叠在第二模具上。

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