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1. 发明申请

US20120249148A1 MAGNETIC RESONANCE LOCAL COIL 有权
标题翻译：磁共振本地线圈
公开(公告)号：US20120249148A1
公开(公告)日：2012-10-04
申请号：US13436576
申请日：2012-03-30
申请人： Daniel Evers , Klaus Huber , Florian Poprawa , Christina Schindler , Markus Vester , Jörg Zapf
发明人： Daniel Evers , Klaus Huber , Florian Poprawa , Christina Schindler , Markus Vester , Jörg Zapf
IPC分类号： G01R33/34 , H01F41/04
CPC分类号： G01R33/422 , G01R33/3415 , G01R33/3621 , G01R33/3692
摘要： The present embodiments relate to a magnetic resonance local coil with a receive antenna for receiving magnetic resonance signals. The magnetic resonance local coil also includes a transmission unit for transmitting magnetic resonance signal data generated on the basis of the magnetic resonance signals via a data transmit antenna of the magnetic resonance local coil to a signal data receiving unit of a magnetic resonance tomography systems. The transmission unit is provided, at least in sections, with screening with a first metal coating and a first dielectric coating.
摘要翻译：本实施例涉及具有用于接收磁共振信号的接收天线的磁共振局部线圈。磁共振局部线圈还包括传输单元，用于将通过磁共振局部线圈的数据发射天线的磁共振信号产生的磁共振信号数据发送到磁共振断层摄影系统的信号数据接收单元。传动单元至少在分段上设置有第一金属涂层和第一介电涂层的筛选。

2. 发明授权

US07851978B2 Piezo actuator comprising a multilayer encapsulation, and method for the production thereof 有权
标题翻译：包括多层封装的压电致动器及其制造方法
公开(公告)号：US07851978B2
公开(公告)日：2010-12-14
申请号：US12298096
申请日：2007-04-24
申请人： Heiner Bayer , Hellmut Freudenberg , Axel Ganster , Christoph Hamann , Oliver Hennig , Jens Dahl Jensen , Günter Lugert , Randolf Mock , Carsten Schuh , Jörg Zapf
发明人： Heiner Bayer , Hellmut Freudenberg , Axel Ganster , Christoph Hamann , Oliver Hennig , Jens Dahl Jensen , Günter Lugert , Randolf Mock , Carsten Schuh , Jörg Zapf
IPC分类号： H01L41/083
CPC分类号： H01L41/23 , H01L41/0533 , H01L41/083 , Y10T29/42
摘要： In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.
摘要翻译：在制造压电致动器（5）的多层封装（1）的方法中，使得压电致动器（5）被保护以朝向外部而不必使用附加的包封外壳型结构，以便产生多层封装（1）中，首先将电绝缘弹性层（10）施加到压电致动器（5）的表面，由此将金属层施加到电绝缘弹性层（10）上以平面地覆盖该电绝缘弹性层。

3. 发明申请

US20090320255A1 PIEZOCERAMIC MULTILAYER ACTUATOR AND METHOD FOR THE PRODUCTION THEREOF 有权
标题翻译： PIEZOCERAMIC MULTILAYER执行器及其生产方法
公开(公告)号：US20090320255A1
公开(公告)日：2009-12-31
申请号：US12524549
申请日：2008-01-15
申请人： Axel Ganster , Susanne Kornely , Andreas Lenk , Andreas Mantovan , Carsten Schuh , Jörg Zapf
发明人： Axel Ganster , Susanne Kornely , Andreas Lenk , Andreas Mantovan , Carsten Schuh , Jörg Zapf
IPC分类号： H01L41/24 , H01L41/083
CPC分类号： H01L41/273 , H01L41/293 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49163
摘要： According to various production methods for producing a piezoceramic multilayer actuator, in the course of the production method, multilayer locks (10) are electrochemically or mechanically processed in such a way that a recess structure is obtained. The lateral surfaces (22; 24) of the electrodes (20) inside these recesses are electrically insulated using the slip casting method in order to be able to contact the remaining electrodes by imprinting an outer metallization.
摘要翻译：根据制造压电陶瓷多层致动器的各种制造方法，在制造方法的过程中，以获得凹部结构的方式对多层锁（10）进行电化学或机械加工。这些凹部内的电极（20）的侧面（22; 24）使用滑移浇铸法电绝缘，以便能够通过印刷外部金属化而接触剩余的电极。

4. 发明授权

US08487257B2 Device with a sandwich structure for detecting thermal radiation, and method for the production thereof 有权
标题翻译：具有用于检测热辐射的夹层结构的装置及其制造方法
公开(公告)号：US08487257B2
公开(公告)日：2013-07-16
申请号：US12601613
申请日：2008-05-28
申请人： Carsten Giebeler , Matthias Schreiter , Jörg Zapf
发明人： Carsten Giebeler , Matthias Schreiter , Jörg Zapf
IPC分类号： G01J5/00
CPC分类号： H01L27/16 , G01J5/04 , G01J5/045 , G01J5/10 , G01J5/34 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： In a device for the detection of thermal radiation and a method for production of such a device, a stack is formed with a detector support having a detector element for converting the thermal radiation into an electric signal, a circuit support with a read-out circuit for reading out the electrical signal and a cover to shield the detector element. The detector support and the cover are so arranged that a first stack cavity is formed between the detector element and the cover and a second stack cavity is formed between detector support and the circuit support. The first stack cavity and/or the second stack cavity is evacuated and hermetically sealed. In the manufacturing operation, functionalized silicon-substrates are stacked upon one another, firmly bonded together and subsequently sub-divided. Preferably, the detector elements are pyro-electric detector elements. The device finds application in motion detectors, presence reporters and thermal-image cameras.
摘要翻译：在用于检测热辐射的装置和用于生产这种装置的方法中，叠层形成有具有用于将热辐射转换成电信号的检测器元件的检测器支架，具有读出电路的电路支架用于读出电信号和盖以屏蔽检测器元件。检测器支架和盖被布置成使得在检测器元件和盖之间形成第一堆叠空腔，并且在检测器支架和电路支架之间形成第二堆叠腔。将第一堆叠空腔和/或第二堆叠空腔抽真空并密封。在制造操作中，将功能化的硅衬底彼此堆叠，牢固地结合在一起并随后进行细分。优选地，检测器元件是热电探测器元件。该设备在运动检测器，存在记录器和热像摄像机中找到应用。

5. 发明申请

US20120183732A1 THREE-DIMENSIONAL MICRO-STRUCTURE, ARRANGEMENT WITH AT LEAST TWO THREE-DIMENSIONAL MICRO-STRUCTURES, METHOD FOR PRODUCING THE MICRO-STRUCTURE AND USE OF THE MICRO-STRUCTURE 有权
标题翻译：三维微结构，具有至少两个三维微结构的布置，微结构的生产方法和微结构的使用
公开(公告)号：US20120183732A1
公开(公告)日：2012-07-19
申请号：US13499083
申请日：2010-09-20
申请人： Harry Hedler , Jörg Zapf
发明人： Harry Hedler , Jörg Zapf
IPC分类号： B32B3/00 , B23P11/00 , B29C39/10
CPC分类号： B81C99/0085 , B81B2203/0361 , B81B2207/056 , Y10T29/49826 , Y10T428/24355
摘要： A three-dimensional micro-structure has a plurality of adjacent micro-columns which are arranged at a distance from each other and essentially parallel in relation to the respective longitudinal extension. The micro-columns are made of at least one micro-column material having respectively an aspect ratio in the region of 20-1000 and respectively a micro-column diameter in the region of 0.1 μm-200 μm. A micro-column intermediate chamber is arranged between adjacent micro-columns having a micro-column distance selected from between the adjacent micro-columns in the region of 1 μm-100 μm. According to a method for producing the three-dimensional micro-structures: a) a template is provided with template material, b) the micro-column material is arranged in the column-like cavities, and c) the template is at least partially removed.
摘要翻译：三维微结构具有多个相邻的微型柱，它们彼此间隔一定距离并且相对于各个纵向延伸部基本平行。微柱由至少一个微柱材料制成，分别具有在20-1000的范围内的纵横比和分别为0.1μm-200μm的微柱直径。在相邻的微柱之间布置有微柱中间室，其具有从1μm至100μm的区域中的相邻微柱之间的微柱距离。根据生产三维微结构的方法：a）模板提供模板材料，b）微柱材料布置在柱状空腔中，c）模板至少部分去除。

6. 发明授权

US07427532B2 Method of manufacturing a device having a contacting structure 有权
标题翻译：制造具有接触结构的装置的方法
公开(公告)号：US07427532B2
公开(公告)日：2008-09-23
申请号：US10547119
申请日：2004-01-23
申请人： Norbert Seliger , Karl Weidner , Jörg Zapf
发明人： Norbert Seliger , Karl Weidner , Jörg Zapf
IPC分类号： H01L21/50 , H01L21/48
CPC分类号： H01L23/3735 , H01L24/24 , H01L24/82 , H01L2224/24011 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/157 , H01L2924/15787 , H01L2924/15798 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/48
摘要： According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.
摘要翻译：根据本发明，将由电绝缘材料制成的层施加到基板和其上配置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

7. 发明授权

US07208347B2 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours 有权
标题翻译：功率半导体的连接技术包括一层遵循表面轮廓的电绝缘材料
公开(公告)号：US07208347B2
公开(公告)日：2007-04-24
申请号：US10547173
申请日：2004-01-26
申请人： Norbert Seliger , Karl Weidner , Jörg Zapf
发明人： Norbert Seliger , Karl Weidner , Jörg Zapf
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45015 , H01L2224/45124 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/2076 , H01L2924/01004 , H01L2924/00015
摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.
摘要翻译：将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

8. 发明申请

US20060252253A1 Internal connection system for power semiconductors comprising large-area terminals 有权
标题翻译：包括大面积终端的功率半导体内部连接系统
公开(公告)号：US20060252253A1
公开(公告)日：2006-11-09
申请号：US10547119
申请日：2004-01-23
申请人： Norbert Seliger , Karl Weidner , Jörg Zapf
发明人： Norbert Seliger , Karl Weidner , Jörg Zapf
IPC分类号： H01L21/4763
CPC分类号： H01L23/3735 , H01L24/24 , H01L24/82 , H01L2224/24011 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/157 , H01L2924/15787 , H01L2924/15798 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/48
摘要： According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.
摘要翻译：根据本发明，将由电绝缘材料制成的层施加到基板和其上布置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

9. 发明申请

US20060248716A1 Self-supporting contacting structures that are directly produced on components without housings 有权
标题翻译：直接在没有外壳的部件上生产的自支撑接触结构
公开(公告)号：US20060248716A1
公开(公告)日：2006-11-09
申请号：US10547174
申请日：2004-01-15
申请人： Karl Weidner , Prof. Eckhard Wolfgang , Jörg Zapf
发明人： Karl Weidner , Prof. Eckhard Wolfgang , Jörg Zapf
IPC分类号： H01L21/84
CPC分类号： H01L23/4822 , H01L21/568 , H01L21/6835 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/2402 , H01L2224/24051 , H01L2224/24226 , H01L2224/24227 , H01L2224/82001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01061 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149
摘要： A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.
摘要翻译：通过将由非导电材料制成的层和由导电材料制成的层施加到组件和支撑件上并随后从其中除去这些层而直接在不具有外壳的部件上产生自支撑接触结构说支持。

10. 发明授权

US06852931B2 Configuration having an electronic device electrically connected to a printed circuit board 有权
公开(公告)号：US06852931B2
公开(公告)日：2005-02-08
申请号：US10105467
申请日：2002-03-26
申请人： Harry Hedler , Jörg Zapf
发明人： Harry Hedler , Jörg Zapf
IPC分类号： H01L21/60 , H01L23/31 , H01L23/485 , H01L23/498 , H05K3/28 , H05K1/16
CPC分类号： B23P19/00 , H01L23/3185 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/02333 , H01L2224/0401 , H01L2224/13008 , H01L2224/131 , H01L2224/13566 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/81355 , H01L2224/81395 , H01L2224/81815 , H01L2224/8192 , H01L2224/83907 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19043 , H05K1/16 , H05K3/284 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49155 , Y10T29/53178 , H01L2224/29099 , H01L2924/00014
摘要： A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board with external contacts. The printed circuit board is electrically coupled to the electronic device. At least the metallic surfaces of the configuration are covered by a plasma-polymerized polymer layer.

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