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1. 发明申请

US20140014936A1 ORGANIC THIN FILM AND ORGANIC ELECTROLUMINESCENT ELEMENT CONTAINING SAME IN LIGHT-EMITTING LAYER 有权
标题翻译：有机薄膜和有机电致发光元件在发光层中含有相同
公开(公告)号：US20140014936A1
公开(公告)日：2014-01-16
申请号：US14007368
申请日：2012-02-17
申请人： Takeyuki Yamaki , Hiroki Yabe , Masahiro Nakamura , Masahito Yamana
发明人： Takeyuki Yamaki , Hiroki Yabe , Masahiro Nakamura , Masahito Yamana
IPC分类号： H01L51/50
CPC分类号： H01L51/502 , H01L51/0039
摘要： In an organic thin film (a light emitting layer) of an organic EL element, an organic thin film having an emitting material which is made up of an organic polymer main backbone polymerized with a molecular chain, which emits light having a maximum value at a wavelength different from a wavelength at which an emission spectrum emitted by the main backbone itself has a maximum value, and nanosized particles which are mixed into the emitting material is used as the light emitting layer. According to the above configuration, the maximum values of the emission spectra of light emitted by the molecular chain and the main backbone of the emitting material can be increased. Moreover, the light which has the emission spectra having the plural maximum values can be generated without depending on the plural emitting materials, so that the light emitting layer can be manufactured easily.
摘要翻译：在有机EL元件的有机薄膜（发光层）中，具有由分子链聚合的有机聚合物主骨架构成的发光材料的有机薄膜，其发射具有最大值的光波长不同于由主骨架本身发射的发射光谱具有最大值的波长，并且将混入发光材料的纳米尺寸粒子用作发光层。根据上述结构，可以提高由分子链和发光材料的主骨架发射的光的发射光谱的最大值。此外，可以不依赖于多种发光材料而产生具有多个最大值的发射光谱的光，从而可以容易地制造发光层。

2. 发明申请

US20120192762A1 METHOD FOR PRODUCING FINE MESOPOROUS SILICA PARTICLES, FINE MESOPOROUS SILICA PARTICLES, LIQUID DISPERSION OF FINE MESOPOROUS SILICA PARTICLES, COMPOSITION CONTAINING FINE MESOPOROUS SILICA PARTICLES AND MOLDED ARTICLE CONTAINING FINE MESOPOROUS SILICA PARTICLES 有权
标题翻译：生产精细多孔二氧化硅颗粒的方法，微米二氧化硅颗粒，微米二氧化硅颗粒的液体分散体，含有微细二氧化硅颗粒的组合物和含有微细二氧化硅颗粒的成型品
公开(公告)号：US20120192762A1
公开(公告)日：2012-08-02
申请号：US13389095
申请日：2010-05-18
申请人： Hiroki Yabe , Takeyuki Yamaki , Yasuto Hoshikawa , Tatsuya Okubo , Atsushi Shimojima
发明人： Hiroki Yabe , Takeyuki Yamaki , Yasuto Hoshikawa , Tatsuya Okubo , Atsushi Shimojima
IPC分类号： C09D5/00 , C08L101/12 , C07F7/08 , C08K5/5419 , B82Y30/00
CPC分类号： C01B33/193 , C01P2002/72 , C01P2002/82 , C01P2004/64 , C01P2006/14 , C01P2006/16 , C03C17/007 , C03C2217/42 , C03C2217/425 , C03C2217/478 , C03C2217/732 , C09C1/30 , G02B2207/107 , Y10T428/2982
摘要： Fine mesoporous silica particles are provided by which not only the functions of low reflectance (Low-n), low dielectric constant (Low-k) and low thermal conductivity but also improved strength of a molded article are achieved. The fine mesoporous silica particles are manufactured by a process including a surfactant composite fine silica particle preparation step and a mesoporous particle formation step. In the silica fine particle preparation step, a surfactant, water, an alkali and a hydrophobic part-containing additive including a hydrophobic part for increasing the volume of micelles are mixed with a silica source to thereby prepare surfactant composite fine silica particles. In the mesoporous particle formation step, the mixture is mixed with an acid and an organosilicon compound to thereby remove the surfactant and hydrophobic part-containing additive from the surfactant composite fine silica particles and provide the surface of each silica fine particle with an organic functional group. The fine mesoporous silica particles have mesopores inside each particle, and are modified on the surface with organic functional groups.
摘要翻译：提供了精细的介孔二氧化硅颗粒，其不仅实现了低反射率（Low-n），低介电常数（Low-k）和低热导率的功能，而且实现了模制品的强度的提高。通过包括表面活性剂复合微细二氧化硅颗粒制备步骤和介孔颗粒形成步骤的方法制造细介孔二氧化硅颗粒。在二氧化硅微粒制备步骤中，将包含用于增加胶束体积的疏水部分的表面活性剂，水，碱和含疏水部分的添加剂与二氧化硅源混合，从而制备表面活性剂复合微细二氧化硅颗粒。在介孔颗粒形成步骤中，将混合物与酸和有机硅化合物混合，从表面活性剂复合微细二氧化硅颗粒中除去表面活性剂和疏水部分的添加剂，并将每个二氧化硅细颗粒的表面提供有机官能团。细介孔二氧化硅颗粒在每个颗粒内均具有介孔，并在表面上用有机官能团改性。

3. 发明授权

US07382628B2 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US07382628B2
公开(公告)日：2008-06-03
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/18
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes.A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

4. 发明申请

US20050051358A1 Circuit-component-containing module 有权
标题翻译：电路元件模块
公开(公告)号：US20050051358A1
公开(公告)日：2005-03-10
申请号：US10499036
申请日：2003-09-04
申请人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
发明人： Eiji Kawamoto , Masaaki Hayama , Masaaki Katsumata , Hiroki Yabe , Takeo Yasuho
IPC分类号： H05K1/02 , H05K1/14 , H05K3/28 , H05K3/34 , H05K3/46 , H05K9/00 , H05K7/06
CPC分类号： H05K3/284 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/10636 , Y02P70/611
摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).
摘要翻译：提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

5. 发明申请

US20130267629A1 MESOPOROUS SILICA PARTICLES, METHOD FOR PRODUCING MESOPOROUS SILICA PARTICLES, AND MESOPOROUS SILICA PARTICLE-CONTAINING MOLDED ARTICLE 审中-公开
标题翻译：多孔二氧化硅颗粒，生产多孔二氧化硅颗粒的方法和含有多孔二氧化硅颗粒的成型品
公开(公告)号：US20130267629A1
公开(公告)日：2013-10-10
申请号：US13995251
申请日：2011-12-22
申请人： Ayumu Fukuoka , Hiroki Yabe , Tatsuya Okubo , Atsushi Shimojima , Hirotaka Ishii
发明人： Ayumu Fukuoka , Hiroki Yabe , Tatsuya Okubo , Atsushi Shimojima , Hirotaka Ishii
IPC分类号： C08K9/10
CPC分类号： C08K9/10 , C01B37/00 , C08K3/36 , H01L51/5275 , Y10T428/2993
摘要： The mesoporous silica particles each comprise a core particle comprising first mesopores, wherein a periphery of the core particle is covered with silica. Preferably, second mesopores, smaller than the first mesopores, are provided in the silica-covered part formed by the silica covering. The mesoporous silica particles are produced by: a surfactant complex silica particle preparation step of mixing a surfactant, water, an alkali, a hydrophobic part-containing additive and a silica source to thereby prepare surfactant complex silica particles, said hydrophobic part-containing additive including a hydrophobic part for increasing a volume of micelles to be formed by the surfactant; and a silica covering step of adding the silica source to the surfactant complex silica particles to thereby cover a periphery of each core particle with silica.
摘要翻译：介孔二氧化硅颗粒各自包含包含第一介孔的核心颗粒，其中核心颗粒的周边被二氧化硅覆盖。优选地，在由二氧化硅覆盖物形成的二氧化硅覆盖部分中提供小于第一介孔的第二介孔。介孔二氧化硅粒子是通过以下方法制备的：表面活性剂复合二氧化硅颗粒制备步骤，混合表面活性剂，水，碱，疏水部分的添加剂和二氧化硅源，从而制备表面活性剂复合二氧化硅颗粒，所述含疏水部分的添加剂包括用于增加由表面活性剂形成的胶束体积的疏水部分; 以及将二氧化硅源添加到表面活性剂复合二氧化硅粒子中，由此用二氧化硅覆盖每个核心颗粒的周围的二氧化硅覆盖工序。

6. 发明授权

US07773386B2 Flexible substrate, multilayer flexible substrate 有权
标题翻译：柔性基板，多层柔性基板
公开(公告)号：US07773386B2
公开(公告)日：2010-08-10
申请号：US11976848
申请日：2007-10-29
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
IPC分类号： H05K1/00
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.
摘要翻译：柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层的膜的前表面和后表面比膜厚。

7. 发明授权

US07649267B2 Package equipped with semiconductor chip and method for producing same 有权
标题翻译：配有半导体芯片的封装及其制造方法
公开(公告)号：US07649267B2
公开(公告)日：2010-01-19
申请号：US11884613
申请日：2006-03-08
申请人： Tsukasa Shiraishi , Yukihiro Ishimaru , Seiji Karashima , Seiichi Natkatani , Hiroki Yabe
发明人： Tsukasa Shiraishi , Yukihiro Ishimaru , Seiji Karashima , Seiichi Natkatani , Hiroki Yabe
IPC分类号： H01L29/41 , H01L21/00
CPC分类号： H05K3/3436 , H01L21/563 , H01L23/49838 , H01L24/11 , H01L24/16 , H01L24/17 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/17132 , H01L2224/17136 , H01L2224/17151 , H01L2224/17155 , H01L2224/17177 , H01L2224/17515 , H01L2224/29111 , H01L2224/2919 , H01L2224/32052 , H01L2224/32225 , H01L2224/73204 , H01L2224/83007 , H01L2224/83097 , H01L2224/83192 , H01L2224/83801 , H01L2224/83887 , H01L2224/83888 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15747 , H01L2924/30105 , H01L2924/3025 , H05K3/323 , H05K3/3484 , H05K2201/09781 , H05K2201/10977 , H05K2203/046 , Y02P70/613 , H01L2224/1713 , H01L2224/1715 , H01L2924/00 , H01L2924/01083 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).
摘要翻译：具有半导体芯片的高可靠性，高生产率的封装及其制造方法。在包括半导体芯片（10）和安装基板（30）的封装（100）中，在与安装基板侧相对的半导体芯片（10）的表面（10a）上形成有多个电极端子（12）分别对应于多个电极端子（12）的连接端子（32）形成在安装基板（30）上，安装基板（30）上的连接端子（32）和电极端子（12）电连接集体地通过自组装形成的焊料凸点（17），在芯片表面（10a）或表面（35）上形成未与电极端子（12）和连接端子（32）连接的电极图案（20）对应于芯片表面（10a）的安装基板（30），并且焊料（19）积聚在电极图案（20）上。

8. 发明授权

US07205483B2 Flexible substrate having interlaminar junctions, and process for producing the same 有权
标题翻译：具有层间结合的柔性基板及其制造方法
公开(公告)号：US07205483B2
公开(公告)日：2007-04-17
申请号：US11079371
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
IPC分类号： H05K1/11
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.
摘要翻译：柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部嵌入在第二绝缘树脂层中的布线图案。前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。

9. 发明授权

US08835916B2 Organic thin film and organic electroluminescent element containing same in light-emitting layer 有权
标题翻译：有机薄膜和含有发光层的有机电致发光元件
公开(公告)号：US08835916B2
公开(公告)日：2014-09-16
申请号：US14007368
申请日：2012-02-17
申请人： Takeyuki Yamaki , Hiroki Yabe , Masahiro Nakamura , Masahito Yamana
发明人： Takeyuki Yamaki , Hiroki Yabe , Masahiro Nakamura , Masahito Yamana
IPC分类号： H01L29/08 , H01L35/24 , H01L51/00 , H01L51/50
CPC分类号： H01L51/502 , H01L51/0039
摘要： In an organic thin film (a light emitting layer) of an organic EL element, an organic thin film having an emitting material which is made up of an organic polymer main backbone polymerized with a molecular chain, which emits light having a maximum value at a wavelength different from a wavelength at which an emission spectrum emitted by the main backbone itself has a maximum value, and nanosized particles which are mixed into the emitting material is used as the light emitting layer. According to the above configuration, the maximum values of the emission spectra of light emitted by the molecular chain and the main backbone of the emitting material can be increased. Moreover, the light which has the emission spectra having the plural maximum values can be generated without depending on the plural emitting materials, so that the light emitting layer can be manufactured easily.
摘要翻译：在有机EL元件的有机薄膜（发光层）中，具有由分子链聚合的有机聚合物主骨架构成的发光材料的有机薄膜，其发射具有最大值的光波长不同于由主骨架本身发射的发射光谱具有最大值的波长，并且将混入发光材料的纳米尺寸粒子用作发光层。根据上述结构，可以提高由分子链和发光材料的主骨架发射的光的发射光谱的最大值。此外，可以不依赖于多种发光材料而产生具有多个最大值的发射光谱的光，从而可以容易地制造发光层。

10. 发明申请

US20140027753A1 ORGANIC ELECTROLUMINESCENCE ELEMENT 有权
标题翻译：有机电致发光元件
公开(公告)号：US20140027753A1
公开(公告)日：2014-01-30
申请号：US14110826
申请日：2012-04-11
申请人： Masahito Yamana , Hiroki Yabe , Takahiro Koyanagi
发明人： Masahito Yamana , Hiroki Yabe , Takahiro Koyanagi
IPC分类号： H01L51/52
CPC分类号： H01L51/5225 , H01L51/5209 , H01L51/5262 , H01L51/5271 , H01L2251/5369
摘要： Provided is a highly-reliable organic electroluminescence element in which loss of light due to surface plasmons generated on a metal surface is suppressed, the efficiency of light extraction to outside the element, and short circuits are unlikely to occur. The organic electroluminescence element includes a metal layer (1), on a surface of which a nanosize uneven structure is provided by a nanoparticle arrangement structure (6) in which nanoparticles (6a) are arranged in a planar fashion, and an organic layer (3) disposed on the uneven surface of the metal layer (1) and constituted by a plurality of layers including a light-emitting layer (31). Each interface between the plurality of layers of the organic layer (3) is flatter than the uneven surface of the metal layer (1).
摘要翻译：提供了一种高度可靠的有机电致发光元件，其中抑制了由于在金属表面产生的表面等离子体激发而导致的光损失，光提取到元件外部的效率以及短路不可能发生。有机电致发光元件包括金属层（1），其纳米尺寸不均匀结构由纳米颗粒排列结构（6）提供，其中纳米颗粒（6a）以平面方式排列，并且有机层（3））设置在金属层（1）的不平坦表面上并且由包括发光层（31）的多个层构成。有机层（3）的多个层之间的每个界面比金属层（1）的不平坦表面平坦。

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