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1. 发明申请

US20080190182A1 AFM PROBE WITH VARIABLE STIFFNESS 有权
标题翻译：具有可变刚度的AFM探头
公开(公告)号：US20080190182A1
公开(公告)日：2008-08-14
申请号：US11962037
申请日：2007-12-20
申请人： HAK-JOO LEE , SEUNG MIN HYUN , JAE HYUN KIM , JUNG YUP KIM , SEUNG WOO HAN , Jung Min Park , BYUNG IK CHOI
发明人： HAK-JOO LEE , SEUNG MIN HYUN , JAE HYUN KIM , JUNG YUP KIM , SEUNG WOO HAN , Jung Min Park , BYUNG IK CHOI
IPC分类号： G12B21/08
CPC分类号： G01Q60/38 , G01Q60/366 , G01Q70/10
摘要： Disclosed is an atomic force microscope (AFM) probe for use in an AFM, and more particularly, an AFM probe suitable for testing the topography and mechanical properties of a microstructure having a size on the order of micrometers or nanometers. To this end, an AFM probe according to the present invention comprises an elastically deformable frame having a fixed end and a movable end on one axis; an AFM tip supported by the movable end to be movable against a test sample in a direction of the axis; and a stopper provided on an inner surface of the frame to control a movement of the AFM tip within a predetermined range.
摘要翻译：公开了一种用于AFM的原子力显微镜（AFM）探针，更具体地说，涉及一种适用于测试尺寸在数量级或微米级的微结构的形貌和机械性能的AFM探针。为此，根据本发明的AFM探针包括一个可弹性变形的框架，其具有固定端和一个轴上的可动端; 由所述可动端支撑的AFM尖端能够沿着所述轴线的方向抵靠测试样品移动; 以及设置在所述框架的内表面上的止动件，以控制所述AFM尖端在预定范围内的移动。

2. 发明授权

US06626968B2 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same 失效
公开(公告)号：US06626968B2
公开(公告)日：2003-09-30
申请号：US09861697
申请日：2001-05-21
申请人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phil Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
发明人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phil Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
IPC分类号： C09G102
CPC分类号： H01L21/76224 , B24B37/044 , C09G1/02 , H01L21/31053
摘要： A slurry composition useful for chemical mechanical polishing of the surface of a material layer, e.g., a silicon oxide layer, is disclosed. A first material surface which is exposed to the slurry exhibits hydrophilicity, while a second material layer, e.g., a polysilicon layer, the surface of which is also exposed to the slurry, exhibits hydrophobicity, and accordingly acts as a polishing stopping layer. The slurry composition consists essentially of water, abrasive grains, and a polymer additive having both hydrophilic and hydrophobic functional groups.

3. 发明授权

US06248667B1 Chemical mechanical polishing method using double polishing stop layer 失效
标题翻译：化学机械抛光方法采用双抛光停止层
公开(公告)号：US06248667B1
公开(公告)日：2001-06-19
申请号：US09527458
申请日：2000-03-17
申请人： Jung-yup Kim , Chang-ki Hong
发明人： Jung-yup Kim , Chang-ki Hong
IPC分类号： H01L21302
CPC分类号： H01L21/31053 , H01L21/318 , H01L21/3185 , Y10S438/959
摘要： A chemical mechanical polishing (CMP) method using a double polishing stopper by which it is possible to prevent a dishing phenomenon and a variation in the thickness of a polishing stopper, including the steps of stacking polishing stoppers to form the double polishing stopper on a semiconductor substrate, forming a trench, stacking an isolation layer, performing a first CMP process using a second polishing stopper, removing the second polishing stopper, and performing a second CMP process using a first polishing stopper. It is possible to remove the second polishing stopper by additionally interposing an etching stopper between the polishing stoppers which form the double polishing stopper.
摘要翻译：一种使用双重抛光止动器的化学机械抛光（CMP）方法，其可以防止抛光停止的凹陷现象和厚度的变化，包括堆叠抛光阻挡件以在半导体上形成双重抛光阻挡件的步骤衬底，形成沟槽，堆叠隔离层，使用第二抛光止挡件执行第一CMP处理，去除第二抛光阻挡件，以及使用第一抛光停止件进行第二CMP处理。通过在形成双重抛光止动件的抛光止动器之间附加插入蚀刻止动件可以移除第二抛光止动件。

4. 发明授权

US09194889B2 Probe card and manufacturing method thereof 有权
标题翻译：探针卡及其制造方法
公开(公告)号：US09194889B2
公开(公告)日：2015-11-24
申请号：US13821045
申请日：2011-09-07
申请人： Hak Joo Lee , Jung Yup Kim , Jun-Hyub Park
发明人： Hak Joo Lee , Jung Yup Kim , Jun-Hyub Park
IPC分类号： G01R31/20 , G01R1/073 , G01R3/00
CPC分类号： G01R1/07307 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： Provided is a probe card including a plurality of unit plates including pad areas and contact probe areas, a plurality of electrode pads formed in the pad areas, a plurality of contact probes formed in the contact probe areas, and a plurality of interconnecting layers electrically connecting the electrode pads and the contact probes. The plurality of unit plates has different sizes and are arranged and laminated so as to expose all the pad areas of each unit plate.
摘要翻译：提供了一种探针卡，其包括多个单元板，包括焊盘区域和接触探针区域，形成在焊盘区域中的多个电极焊盘，形成在接触探针区域中的多个接触探针，以及多个互连层电极焊盘和接触探针。多个单元板具有不同的尺寸并且被布置和层叠以便暴露每个单元板的所有垫区域。

5. 发明授权

US08242797B2 Cantilever-type micro contact probe with hinge structure 有权
标题翻译：具有铰链结构的悬臂式微型接触探头
公开(公告)号：US08242797B2
公开(公告)日：2012-08-14
申请号：US12452730
申请日：2009-02-24
申请人： Jung-Yup Kim , Hak-Joo Lee , Kyung-Shik Kim
发明人： Jung-Yup Kim , Hak-Joo Lee , Kyung-Shik Kim
IPC分类号： G01R31/02
CPC分类号： G01R1/06727 , G01R1/06738
摘要： According to the present invention, allowable displacement can be increased from an excellent stress relaxation effect achieved by applying a hinge structure while adopting advantages of a dual beam cantilever-type probe that can reduce scrub. Since the hinge structure is a structure that does not receive a moment, an effect that is the same as eliminating a moment in a conventional prove can be achieved so that stress can be evenly applied and the allowable displacement of the probe can be increased.
摘要翻译：根据本发明，可以通过应用铰链结构实现的优异的应力松弛效应来增加允许的位移，同时还采用可以减少擦洗的双梁悬臂式探头的优点。由于铰链结构是不会受到力矩的结构，因此能够实现与现有技术中的消除力矩相同的效果，能够均匀地施加应力，能够提高探头的容许位移。

6. 发明申请

US20070155178A1 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same 审中-公开
标题翻译：用于化学机械抛光工艺的浆料及使用其制造半导体器件的方法
公开(公告)号：US20070155178A1
公开(公告)日：2007-07-05
申请号：US11712931
申请日：2007-03-01
申请人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phill Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
发明人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phill Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
IPC分类号： H01L21/306 , H01L21/461 , B44C1/22 , C23F1/00 , H01L21/302
CPC分类号： H01L21/76224 , B24B37/044 , C09G1/02 , H01L21/31053
摘要： A slurry composition useful for chemical mechanical polishing of the surface of a material layer, e.g., a silicon oxide layer, is disclosed. A first material surface which is exposed to the slurry exhibits hydrophilicity, while a second material layer, e.g., a polysilicon layer, the surface of which is also exposed to the slurry, exhibits hydrophobicity, and accordingly acts as a polishing stopping layer. The slurry composition consists essentially of water, abrasive grains, and a polymer additive having both hydrophilic and hydrophobic functional groups.
摘要翻译：公开了一种用于材料层表面例如氧化硅层的化学机械抛光的浆料组合物。暴露于浆料的第一材料表面显示出亲水性，而第二材料层，例如其表面也暴露于浆料的多晶硅层，表现出疏水性，因此用作抛光停止层。浆料组合物基本上由水，磨料颗粒和具有亲水和疏水官能团的聚合物添加剂组成。

7. 发明授权

US06585570B2 Method and apparatus for supplying chemical-mechanical polishing slurries 有权
标题翻译：用于提供化学机械抛光浆料的方法和设备
公开(公告)号：US06585570B2
公开(公告)日：2003-07-01
申请号：US09848371
申请日：2001-05-03
申请人： Jung-yup Kim , Young-rae Park , Sang-rok Hah
发明人： Jung-yup Kim , Young-rae Park , Sang-rok Hah
IPC分类号： B24B1900
CPC分类号： B24B37/04 , B24B1/04 , B24B57/02
摘要： In method and apparatus for supplying a slurry for a chemical mechanical polishing (CMP) process, a slurry pre-treatment is provided for minimizing the size of abrasive particles in the slurry. In the slurry supplying method, after applying acoustic energy to the slurry to de-agglomerate agglomerated abrasive particles within the slurry, any remaining oversized abrasive particles having a diameter greater than a reference size are filtered out from the slurry. The acoustic energy application step and the filtering step are repeatedly performed for a predetermined time period while circulating the slurry. The slurry supplying apparatus includes a tank for holding a slurry, acoustic energy sources for applying acoustic energy to the slurry held within the tank, a slurry circulating line for circulating the slurry drawn out of the tank, which is connected to the tank, a filter for filtering out abrasive particle clumps having a diameter greater than a reference size from the slurry, which is disposed in the slurry circulating line, and a slurry supplying line for supplying the slurry from the slurry circulating line to a CMP equipment.
摘要翻译：在用于供应用于化学机械抛光（CMP）工艺的浆料的方法和设备中，提供了浆料预处理以使浆料中磨料颗粒的尺寸最小化。在浆料供给方法中，在向浆料中施加声能以使浆料中的附聚磨料颗粒去聚集之前，将任何剩余的具有大于参考尺寸的直径的过大的磨料颗粒从浆料中过滤掉。声音能量施加步骤和过滤步骤在循环淤浆期间重复进行预定时间段。浆料供给装置包括用于保持浆料的罐，用于向保持在罐内的浆料提供声能的声能源，用于使从罐中抽出的浆料循环的浆料循环管线，其与罐连接，过滤器用于从布置在浆料循环管线中的浆料中过滤出具有大于参考尺寸的直径的磨料颗粒团，以及用于将浆料从淤浆循环管线供应到CMP设备的浆料供应管线。

8. 发明授权

US06498102B2 Method for planarizing a semiconductor device using ceria-based slurry 有权
标题翻译：使用二氧化铈基浆料平坦化半导体器件的方法
公开(公告)号：US06498102B2
公开(公告)日：2002-12-24
申请号：US09803741
申请日：2001-03-12
申请人： Jung-yup Kim , Young-rae Park , Sang-rok Hah
发明人： Jung-yup Kim , Young-rae Park , Sang-rok Hah
IPC分类号： H01L21302
CPC分类号： H01L21/31053
摘要： A chemical mechanical polishing (CMP) process employs a ceria-based slurry as an abrasive. In particular, a nitride pattern is formed over a semiconductor substrate, and an oxide layer is then formed over the semiconductor substrate and the nitride pattern. Next, a sacrificial insulation layer which is devoid of surface steps is formed over the oxide layer. The sacrificial insulation layer and the oxide layer are then polished by CMP using the ceria-based slurry and using the nitride pattern as a stopper.
摘要翻译：化学机械抛光（CMP）工艺采用二氧化铈基浆料作为研磨剂。特别地，在半导体衬底上形成氮化物图案，然后在半导体衬底和氮化物图案之上形成氧化物层。接下来，在氧化物层上形成没有表面台阶的牺牲绝缘层。然后通过CMP使用二氧化铈基浆料和使用氮化物图案作为塞子来抛光牺牲绝缘层和氧化物层。

9. 发明授权

US09205432B2 Apparatus for self-extracting cells using magnetic field and method for self-extracting cells using the same 有权
标题翻译：用于使用磁场自行提取细胞的装置和使用其自行提取细胞的方法
公开(公告)号：US09205432B2
公开(公告)日：2015-12-08
申请号：US13546187
申请日：2012-07-11
申请人： Sung Hwan Chang , Yeong-Eun Yoo , Jung Yup Kim , Seung Min Hyun , Kyung-Hyun Whang
发明人： Sung Hwan Chang , Yeong-Eun Yoo , Jung Yup Kim , Seung Min Hyun , Kyung-Hyun Whang
IPC分类号： B03C1/28
CPC分类号： B03C1/288 , B03C2201/26
摘要： Disclosed is an apparatus for self-extracting a cell using a magnetic field. The apparatus for self-extracting the cell using the magnetic field according to the present invention includes a flow path casing including an upper substrate and a lower substrate having a magnetic property combined with each other, and a fluid path formed to fluidize a cell solution therein; a separation portion disposed on the fluid path and provided with a separation channel selectively passing only an effective cell that is a separation target in the cell included in the cell solution therethrough; and a magnetic field control portion forming the magnetic field in the flow path portion to separate the cell blocking the separation channel from the separation channel.
摘要翻译：公开了一种使用磁场自动提取单元的装置。根据本发明的使用磁场自行提取电池的装置包括：流路壳体，包括具有彼此结合的磁性的上基板和下基板;以及形成为使细胞溶液流化的流体路径 ; 分离部，其设置在所述流体路径上并且具有选择性地仅通过包含在所述细胞溶液中的细胞中的作为分离对象的有效细胞通过的分离通道; 以及磁场控制部分，其形成流路部分中的磁场，以将阻挡分离通道的电池与分离通道分开。

10. 发明申请

US20130162276A1 PROBE CARD AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：探针卡及其制造方法
公开(公告)号：US20130162276A1
公开(公告)日：2013-06-27
申请号：US13821045
申请日：2011-09-07
申请人： Hak Joo Lee , Jung Yup Kim , Jun-Hyub Park
发明人： Hak Joo Lee , Jung Yup Kim , Jun-Hyub Park
IPC分类号： G01R3/00 , G01R1/073
CPC分类号： G01R1/07307 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： Provided is a probe card including a plurality of unit plates including pad areas and contact probe areas, a plurality of electrode pads formed in the pad areas, a plurality of contact probes formed in the contact probe areas, and a plurality of interconnecting layers electrically connecting the electrode pads and the contact probes. The plurality of unit plates has different sizes and are arranged and laminated so as to expose all the pad areas of each unit plate.
摘要翻译：提供了一种探针卡，其包括多个单元板，包括焊盘区域和接触探针区域，形成在焊盘区域中的多个电极焊盘，形成在接触探针区域中的多个接触探针，以及多个互连层电极焊盘和接触探针。多个单元板具有不同的尺寸并且被布置和层叠以便暴露每个单元板的所有垫区域。

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