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    • 4. 发明授权
    • Method for producing semiconductor crystal
    • 半导体晶体的制造方法
    • US07459023B2
    • 2008-12-02
    • US11590930
    • 2006-11-01
    • Shiro YamazakiKoji HirataKatsuhiro ImaiMakoto IwaiTakatomo SasakiYusuke MoriMasashi YoshimuraFumio KawamuraYuji Yamada
    • Shiro YamazakiKoji HirataKatsuhiro ImaiMakoto IwaiTakatomo SasakiYusuke MoriMasashi YoshimuraFumio KawamuraYuji Yamada
    • C30B25/12
    • C30B25/00C30B9/00C30B29/403C30B29/406
    • The present invention provides a method for producing a Group III nitride compound semiconductor crystal, the semiconductor crystal being grown through the flux method employing a flux. At least a portion of a substrate on which the semiconductor crystal is to be grown is formed of a flux-soluble material. While the semiconductor crystal is grown on a surface of the substrate, the flux-soluble material is dissolved in the flux from a surface of the substrate that is opposite the surface on which the semiconductor crystal is grown. Alternatively, after the semiconductor crystal has been grown on a surface of the substrate, the flux-soluble material is dissolved in the flux from a surface of the substrate that is opposite the surface on which the semiconductor crystal has been grown. The flux-soluble material is formed of silicon. Alternatively, the flux-soluble material or the substrate is formed of a Group III nitride compound semiconductor having a dislocation density higher than that of the semiconductor crystal to be grown.
    • 本发明提供一种用于制造III族氮化物化合物半导体晶体的方法,该半导体晶体通过使用焊剂的焊剂法生长。 待生长半导体晶体的基板的至少一部分由助熔剂材料形成。 半导体晶体在衬底的表面上生长时,该助熔剂材料从衬底的与生长半导体晶体的表面相反的表面溶解在焊剂中。 或者,在半导体晶体已经在基板的表面上生长之后,从基板的与半导体晶体已经生长的表面相对的表面的助熔剂中溶解助熔剂。 助熔剂材料由硅形成。 或者,助熔剂材料或衬底由位错密度高于要生长的半导体晶体的位错密度的III族氮化物化合物半导体形成。
    • 8. 发明授权
    • Method for producing group III nitride-based compound semiconductor
    • 制备III族氮化物基化合物半导体的方法
    • US08361222B2
    • 2013-01-29
    • US12081943
    • 2008-04-23
    • Shiro YamazakiSeiji NagaiTakayuki SatoKatsuhiro ImaiMakoto IwaiTakatomo SasakiYusuke MoriFumio Kawamura
    • Shiro YamazakiSeiji NagaiTakayuki SatoKatsuhiro ImaiMakoto IwaiTakatomo SasakiYusuke MoriFumio Kawamura
    • C30B15/14C30B15/00C30B21/06C30B27/02C30B28/10C30B30/04
    • C30B29/403C30B9/00C30B9/12C30B29/406
    • In the production of GaN through the flux method, deposition of miscellaneous crystals on the nitrogen-face of a GaN self-standing substrate and waste of raw materials are prevented. Four arrangements of crucibles and a GaN self-standing substrate are exemplified. In FIG. 1A, a nitrogen-face of a self-standing substrate comes into close contact with a sloped flat inner wall of a crucible. In FIG. 1B, a nitrogen-face of a self-standing substrate comes into close contact with a horizontally facing flat inner wall of a crucible, and the substrate is fixed by means of a jig. In FIG. 1C, a jig is provided on a flat bottom of a crucible, and two GaN self-standing substrates are fixed by means of the jig so that the nitrogen-faces of the substrates come into close contact with each other. In FIG. 1D, a jig is provided on a flat bottom of a crucible, and a GaN self-standing substrate is fixed on the jig so that the nitrogen-face of the substrate is covered with the jig. A flux mixture of molten gallium and sodium is charged into each crucible, and a GaN single crystal is grown on a gallium-face under pressurized nitrogen.
    • 在通过助熔剂制造GaN的情况下,可以防止在GaN自立基板的氮面上沉积杂晶,原料的浪费。 例示了四个坩埚和GaN自立衬底的布置。 在图 如图1A所示,自立基板的氮面与坩埚的倾斜的平坦的内壁紧密接触。 在图 如图1B所示,自立基板的氮面与坩埚的水平方向的平坦的内壁紧密接触,通过夹具固定基板。 在图 如图1C所示,在坩埚的平坦底部设置夹具,通过夹具固定两个GaN自立基板,使得基板的氮面彼此紧密接触。 在图 如图1D所示,在坩埚的平坦底部设置夹具,并且将GaN自立基板固定在夹具上,使得基板的氮面被夹具覆盖。 将熔融的镓和钠的助熔剂混合物装入每个坩埚中,并且在加压氮气下在镓面上生长GaN单晶。