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    • 1. 发明授权
    • Image capturing device and image capturing method
    • 图像捕获装置和图像捕获方法
    • US08670654B2
    • 2014-03-11
    • US13879823
    • 2011-10-13
    • Kouji TanakaTakashi KiyofujiNorio Kurashige
    • Kouji TanakaTakashi KiyofujiNorio Kurashige
    • H04N5/917
    • H04N19/00012H04N19/149H04N19/197H04N19/198H04N19/593
    • An image capturing device (100) is provided with: an image capturing unit (102) which generates, by continuous image capturing, a plurality of pieces of image data which are continuous in the time direction; an image processing unit which corrects a compression rate of the image data on the basis of a correction factor for correcting the image data, and performs compression coding by use of an intra-frame predictive coding system; a data control unit (124) which stores the image data, which has been subjected to the compression coding, in an image storage unit; a current compression rate derivation unit (130) which derives a current compression rate which is an actual compression rate of the image data which has been subjected to the compression coding; a current compression rate holding unit (132) which holds a plurality of current compression rates continuous in the time direction; a subsequent compression rate prediction unit (134) which predicts a subject compression rate, which is a compression rate of image data to be subjected to the subsequent compression coding next time, from the plurality of current compression rates which are held, or from the plurality of current compression rates which are held and the compression rate of the image data to be subjected to the current compression coding this time; and a correction factor derivation unit which derives the correction factor on the basis of the subsequent compression rate.
    • 一种图像拍摄装置(100)具有:图像拍摄单元,通过连续图像捕获生成在时间方向上连续的多个图像数据; 图像处理单元,其基于用于校正图像数据的校正因子校正图像数据的压缩率,并且使用帧内预测编码系统进行压缩编码; 数据控制单元,其将经过压缩编码的图像数据存储在图像存储单元中; 当前压缩率导出单元(130),其导出作为已进行了压缩编码的图像数据的实际压缩率的当前压缩率; 当前压缩率保持单元(132),其保持在时间方向上连续的多个当前压缩率; 一个后续的压缩率预测单元(134),其从所保持的多个当前压缩率或从多个预定压缩率预测作为下一次压缩编码的图像数据的压缩率的对象压缩率 保持当前的压缩率以及本次要进行当前压缩编码的图像数据的压缩率; 以及校正因子导出单元,其基于随后的压缩率导出校正因子。
    • 2. 发明申请
    • FILM FORMING METHOD
    • 电影制作方法
    • US20140051263A1
    • 2014-02-20
    • US14113134
    • 2012-04-23
    • Kouji TanakaHirokazu Ueda
    • Kouji TanakaHirokazu Ueda
    • H01L21/316H01L21/318
    • H01L21/316C23C16/345C23C16/4554C23C16/511H01L21/02164H01L21/0217H01L21/02211H01L21/02274H01L21/0228H01L21/318
    • This film forming method comprises: a first material gas supply step (A) wherein a first raw material gas is supplied over the substrate to be processed so that a first chemical adsorption layer, which is adsorbed on the substrate by means of the first raw material gas is formed on the substrate to be processed, a second material gas supply step (C) wherein a second raw material that is different from the first raw material gas is supplied over the substrate, on which the first chemical adsorption layer has been formed, so that a second chemical adsorption layer, which is adsorbed by means of the second raw material gas, is formed on the first chemical adsorption layer; and a plasma processing step (E) wherein a plasma processing is carried on at least the first and second chemical adsorption layers using microwave plasma.
    • 该成膜方法包括:第一原料气体供给工序(A),其中第一原料气体供给到被处理基板上,使得通过第一原料吸附在基板上的第一化学吸附层 在被处理基板上形成气体,在其上形成有第一化学吸附层的基板上供给与第一原料气体不同的第二原料的第二原料气体供给工序(C) 使得通过第二原料气体吸附的第二化学吸附层形成在第一化学吸附层上; 和等离子体处理步骤(E),其中至少使用微波等离子体对第一和第二化学吸附层进行等离子体处理。
    • 5. 发明申请
    • APPARATUS AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION ELEMENTS, AND PHOTOELECTRIC CONVERSION ELEMENT
    • 光电转换元件制造装置及其制造方法,光电转换元件
    • US20100275981A1
    • 2010-11-04
    • US12809447
    • 2008-12-12
    • Tadahiro OhmiAkinobu TeramotoTetsuya GotoKouji Tanaka
    • Tadahiro OhmiAkinobu TeramotoTetsuya GotoKouji Tanaka
    • H01L31/04H01L31/18
    • H01L31/18C23C16/24C23C16/511H01L31/028H01L31/04H01L31/0745H01L31/1804H01L31/1812H01L31/1816Y02E10/547Y02P70/521
    • An apparatus and method for manufacturing photoelectric conversion elements, and a photoelectric conversion element, the apparatus and method being capable of highly efficiently forming a film at a high speed with microwave plasma, preventing oxygen from mixing, and reducing the number of defects. The invention provides a photoelectric conversion element manufacturing apparatus 100 that forms a semiconductor stack film on a substrate by using microwave plasma CVD. The apparatus includes a chamber 10 which is a enclosed space containing a base, on which the a subject substrate for thin-film formation is mounted, a first gas supply unit 40 which supplies plasma excitation gas to a plasma excitation region in the chamber 10, a pressure regulation unit 70 which regulates pressure in the chamber 10, a second gas supply unit 50 which supplies raw gas to a plasma diffusion region in the chamber 10, a microwave application unit 20 which applies microwaves into the chamber 10, and a bias voltage application unit 60 which selects and applies a substrate bias voltage to the substrate W according to the type of gas.
    • 一种用于制造光电转换元件的装置和方法以及光电转换元件,该装置和方法能够高效地用微波等离子体形成膜,防止氧气混合,并减少缺陷数量。 本发明提供一种通过使用微波等离子体CVD在基板上形成半导体叠层膜的光电转换元件制造装置100。 该装置包括:腔室10,其是容纳基底的封闭空间,其上安装有用于薄膜形成的被检体基底;第一气体供给单元40,其向等离子体激发区域提供等离子体激发气体; 调节室10内的压力的压力调节单元70,向室10中的等离子体扩散区域供给原料气体的第二气体供给单元50,将微波施加到室10中的微波施加单元20以及偏置电压 应用单元60,其根据气体的类型选择并施加衬底偏置电压到衬底W.
    • 9. 发明授权
    • Semiconductor integrated circuit having internal power supply voltage down conversion circuit
    • 具有内部电源电压降压转换电路的半导体集成电路
    • US06809577B2
    • 2004-10-26
    • US10340614
    • 2003-01-13
    • Yasuhiro MatsumotoKouji Tanaka
    • Yasuhiro MatsumotoKouji Tanaka
    • G05F110
    • H03K5/19G06F1/26H03K5/153
    • In an oscillation detection circuit an internal voltage is compared with an oscillation detection level corresponding to a reference voltage plus a predetermined variation and when a voltage having a level higher than the oscillation detection level is observed a predetermined number of times within a predetermined period of time a decision is made that the internal voltage is in oscillation and an oscillation detection signal having the high level is output. In the internal power supply voltage down conversion circuit when a p-channel MOS transistor receives the oscillation detection signal of the high level the transistor turns off to interrupt a current supplied from a drive transistor to an internal power supply node.
    • 在振荡检测电路中,将内部电压与对应于参考电压加预定变化的振荡检测电平进行比较,并且当在预定时间段内观察到具有高于振荡检测电平的电平的预定次数时 确定内部电压处于振荡状态,并且输出具有高电平的振荡检测信号。 在内部电源电压降低转换电路中,当p沟道MOS晶体管接收到高电平的振荡检测信号时,晶体管截止,将从驱动晶体管提供的电流中断到内部电源节点。
    • 10. 发明授权
    • Magnetic head, and device and method for manufacturing the same
    • 磁头及其制造方法及其制造方法
    • US06751061B2
    • 2004-06-15
    • US10417168
    • 2003-04-17
    • Toru MizunoKouji TanakaSatoshi Yamaguchi
    • Toru MizunoKouji TanakaSatoshi Yamaguchi
    • G11B560
    • G11B5/4853G11B5/4826Y10T29/49027Y10T29/4903
    • The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.
    • 本发明提供一种磁头结构,连接方法和连接装置,通过该磁头结构,连接方法和连接装置,可以通过使用背负式系统的磁头中的挠性件上的芯电极和基板接合面之间进行优良的电连接。 为了达到感兴趣的目的,在本发明中,在芯部和挠曲部之间设置微调致动器, 在所述芯部设置有从所述挠曲部观察时从所述微调节致动器突出的突出部; 在所述弯曲部上对应于所述突出部设置孔, 只有芯部由通过孔部分提供的支撑部分和夹紧销固定,而不对微调致动器施加任何负载; 并且在保持该固定状态的同时,用导线将电极和基板焊盘彼此接合。