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1. 发明授权

US06388211B1 Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch substrate, and a switch substrate 失效
标题翻译：在具有开口的基板上成型模制树脂的方法，具有模制树脂的开关基板，在开关基板上形成开关图案的方法以及开关基板
公开(公告)号：US06388211B1
公开(公告)日：2002-05-14
申请号：US09471376
申请日：1999-12-23
申请人： Osamu Nomura , Nobuyuki Yagi , Kozo Morita
发明人： Osamu Nomura , Nobuyuki Yagi , Kozo Morita
IPC分类号： H01H158
CPC分类号： H01H1/40 , B29C45/14344 , B29C45/14639 , H01H1/403 , H01H11/0056 , H01H2019/006 , H05K3/0014 , H05K3/202 , H05K3/22 , Y10T29/49105
摘要： A substrate (10), a first mold (200) and a second mold (250) are prepared, and a plurality of switch patterns (14), (18) are provided by providing openings (pattern-removal portions) (A) in such a manner that a pattern (11), which has been formed on the surface of the substrate (10), is divided into a plurality of patterns to form A switch substrate. Next, the switch substrate (1) is clamped between the first mold (200) and the second mold (250). At such time, the side of the switch substrate (1) provided with the switch patterns (14), (18) is brought into surface contact with an abutting surface (201) of the first mold (200) and, at the same time, a cavity (253) provided in the second mold (250) opposes the other side of the switch substrate. Next, a molten molding resin is charged into the cavity (253) provided in the second mold (250) to thereby fill the cavity (253) and the openings (A) of the substrate with the molding resin. After the molding resin hardens, the first mold (200) and the second mold (250) are separated and the switch substrate (1), which will have the molding resin case 40 attached thereto, is extracted.
摘要翻译：制备基板（10），第一模具（200）和第二模具（250），并且通过提供多个开关图案（图案去除部分）（A）已经形成在基板（10）的表面上的图案（11）被分成多个图案以形成A开关基板的方式。接下来，将开关基板（1）夹在第一模具（200）和第二模具（250）之间。此时，具有开关图案（14），（18）的开关基板（1）的一侧与第一模具（200）的抵接面（201）表面接触，并且同时设置在第二模具（250）中的空腔（253）与开关基板的另一侧相对。接下来，将熔融成型树脂装入设置在第二模具（250）中的空腔（253）中，从而用模塑树脂填充基板的空腔（253）和开口（A）。在模制树脂硬化之后，分离第一模具（200）和第二模具（250），并且将具有附着于其上的模制树脂壳体40的开关基板（1）被提取。

2. 发明授权

US5479443A Hybrid digital radio-relay system 失效
标题翻译：混合数字无线电中继系统
公开(公告)号：US5479443A
公开(公告)日：1995-12-26
申请号：US133337
申请日：1993-10-08
申请人： Osamu Kagami , Kazuji Watanabe , Kozo Morita
发明人： Osamu Kagami , Kazuji Watanabe , Kozo Morita
IPC分类号： H04B7/155 , H04B7/165 , H04B7/17 , H04J1/10
CPC分类号： H04B7/15528
摘要： A digital radio-relay system has a transmitting terminal station, at least one repeater station a receiving terminal station, a non-regenerative repeater station which does not regenerate a digital signal in order to simplify and reduce cost of the system, while keeping excellent signal quality in transmission. Each repeater station has a plurality of sub-units relating to respective sub-system signals each having a plurality of carriers so that the frequency spectrum of each sub-system signal is allocated on a frequency axis based upon a frequency division multiplex system. A repeater station having a first frequency converter to convert a received radio frequency to IF frequency, bandpass filters for deriving one of the carriers in each sub-system signal, amplifiers to amplify the derived carrier on IF band stage, and a second frequency converter to convert the IF frequency to radio frequency, has a common reference oscillator which generates a reference frequency which is a common divisor of all the local frequencies for all the radio frequencies of all the sub-system signals. Only one of an upper and lower heterodyne signals is taken in all the frequency conversions, so that distortion in each relay section is added in-phase. Leaked noise caused by the bandpass filters is added to original carrier in-phase. All the distortion thus added in the relay sections can be compensated by a transversal equalizer in the receiving terminal station. Therefore, excellent signal quality is obtained although a simple non-regenerative repeater station is used.
摘要翻译：数字无线电中继系统具有发送终端站，至少一个中继站，接收终端站，不再生数字信号的非再生中继站，以便简化和降低系统的成本，同时保持优良的信号传输质量。每个中继站具有与分别具有多个载波的各个子系统信号相关的多个子单元，使得每个子系统信号的频谱基于频分多路复用系统被分配在频率轴上。一种具有第一频率转换器以将接收到的射频转换成IF频率的中继站，用于导出每个子系统信号中的一个载波的带通滤波器，用于在IF频带级上放大导出载波的放大器，以及第二频率转换器将IF频率转换为射频，具有公共参考振荡器，其产生作为所有子系统信号的所有无线电频率的所有本地频率的公约数的参考频率。在所有频率转换中仅采用上外差信号中的一种，因此每个继电器部分的失真同相加法。由带通滤波器引起的泄漏噪声被同时添加到原始载波。所以在继电器部分中增加的所有失真都可以由接收终端中的横向均衡器补偿。因此，虽然使用简单的非再生中继站，但是获得了良好的信号质量。

3. 发明授权

US5111363A Mount for electronic parts 失效
标题翻译：电子配件安装
公开(公告)号：US5111363A
公开(公告)日：1992-05-05
申请号：US365116
申请日：1989-06-12
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yosutoshi Kaku , Shinji Mizuno , Akiko Yamanaka
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yosutoshi Kaku , Shinji Mizuno , Akiko Yamanaka
IPC分类号： H05K1/09 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/28
CPC分类号： H05K3/284 , H05K1/189 , H05K1/09 , H05K1/118 , H05K2201/0129 , H05K2201/10689 , H05K2201/10924 , H05K2201/10946 , H05K2201/10977 , H05K2201/2009 , H05K2203/1316 , H05K2203/1327 , H05K3/0058 , H05K3/281
摘要： A mount for electronic parts includes a flexible board made of a thermoplastic resin film and having electrically conductive patterns formed thereon, and an electrically conductive bonding agent for bonding terminals of the electronic parts to the conductive patterns. Some or all of the electronic parts to be mounted are resin-molded to the flexible board so as to be integrated therewith.

4. 发明授权

US4978491A Molded resin casing of electronic part incorporating flexible board 失效
公开(公告)号：US4978491A
公开(公告)日：1990-12-18
申请号：US244165
申请日：1988-09-13
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.

5. 发明申请

US20060040094A1 Electronic parts board and method of producing the same 失效
标题翻译：电子零件板及其制造方法
公开(公告)号：US20060040094A1
公开(公告)日：2006-02-23
申请号：US10541459
申请日：2004-02-05
申请人： Shinji Mizuno , Koji Mitsui , Katsutoshi Yanoshita , Shinichi Suzuki , Takashi Shinoki , Kazutaka Nakagawa , Naoki Fukuda , Kozo Morita , Daisuke Makino
发明人： Shinji Mizuno , Koji Mitsui , Katsutoshi Yanoshita , Shinichi Suzuki , Takashi Shinoki , Kazutaka Nakagawa , Naoki Fukuda , Kozo Morita , Daisuke Makino
IPC分类号： B29C70/88 , B32B3/00 , B29C45/14 , H01G13/00
CPC分类号： B29C45/1418 , B29C45/14467 , B29C45/14639 , B29L2031/3406 , H01C10/32 , H01C10/48 , H05K1/0393 , H05K1/167 , H05K3/0014 , H05K3/0058 , Y10T29/49082 , Y10T428/24917
摘要： An electronic component substrate 1-1 includes an insulating base 10 and a flexible circuit board 20 mounted on the insulating base 10. The flexible circuit board 20 is a synthetic resin film provided thereon with terminal patterns 29 and a conductor pattern 25 whose surface is slidingly contacted with a slider. The insulating base 10 is a synthetic resin molded piece. The flexible circuit board 20 is insert-molded to the insulating base 10. The electronic component substrate 1-1 is produced by preparing the flexible circuit board 20 and first and second mold members 41 and 45 having a cavity C1 with a shape that corresponds to the external shape of the electronic component substrate 1-1. Then, the flexible circuit board 20 is accommodated in the cavity C1 between the first and second mold members 41 and 45, and a molten molding resin is filled into the cavity C1. After the filled molding resin has been solidified, the first and second mold members 41 and 45 are removed.
摘要翻译：电子元件基板1-1包括绝缘基座10和安装在绝缘基座10上的柔性电路板20.柔性电路板20是其上设置有端子图案29的合成树脂膜和表面滑动的导体图案25 与滑块联系。绝缘基座10是合成树脂模制件。柔性电路板20被插入模制到绝缘基座10.电子部件基板1通过制备柔性电路板20和具有空腔C 1的第一和第二模具构件41和45来制造，该腔体具有对应于然后，将柔性电路板20容纳在第一和第二模具构件41和45之间的空腔C 1中，并将熔融的模制树脂填充到空腔C 1中在填充模塑树脂已经固化之后，第一和第二模具构件41和45被去除。

6. 发明授权

US5794766A Rotary switch 失效
标题翻译：旋转开关
公开(公告)号：US5794766A
公开(公告)日：1998-08-18
申请号：US694325
申请日：1996-08-08
申请人： Kozo Morita , Shigeaki Kinoshita , Katsuyuki Tame , Osamu Nomura
发明人： Kozo Morita , Shigeaki Kinoshita , Katsuyuki Tame , Osamu Nomura
IPC分类号： H01H19/00 , H01H19/63 , H01H19/20
CPC分类号： H01H19/63 , H01H19/005 , H01H2019/006
摘要： A rotary switch includes a contact forming member including a switch contact and a land contact and an elastic plate including a base portion mounted on the land contact and an abutment portion disposed above the switch contact. A rotor is disposed above the elastic plate for pivotal movement and includes depresser portions provided in the lower surface of the rotor for depressing the elastic plate. When the rotor is rotated, the depresser portions of the rotor cause the elastic plate to be depressed, so that the abutment portion is engaged with the switch contact. The contact forming member may be constructed by forming the switch contact and the land contact on a circuit substrate. The contact forming member may be constructed by a metal plate on which the switch contact is formed, a metal plate on which the land contact is formed, and a stationary member on which the metal plates are secured.
摘要翻译：旋转开关包括：接触形成构件，其包括开关触点和平台接触;以及弹性板，包括安装在平台触点上的基部和设置在开关触点上方的抵接部。转子设置在弹性板上方用于枢转运动，并且包括设置在转子的下表面中的按压部，用于按压弹性板。当转子旋转时，转子的按压部分使得弹性板被压下，使得抵接部与开关接触接合。触点形成构件可以通过在电路基板上形成开关触点和平台接触而构成。接触形成部件可以由其上形成有开关触点的金属板，形成有焊盘触点的金属板以及金属板固定在其上的固定部件构成。

7. 发明授权

US4935718A Molded resin casing of electronic part incorporating flexible board 失效
标题翻译：带柔性板的电子部件的模制树脂外壳
公开(公告)号：US4935718A
公开(公告)日：1990-06-19
申请号：US234952
申请日：1988-08-22
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.

8. 发明授权

US4928082A Molded resin casing of electronic part with flexible flat cable 失效
标题翻译：带柔性扁平电缆的电子部件模制树脂外壳
公开(公告)号：US4928082A
公开(公告)日：1990-05-22
申请号：US234946
申请日：1988-08-22
申请人： Nobuyuki Yagi , Jiro Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiro Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： A molded resin casing of an electronic part equipped with a flexible flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, includes a flexible board having various electric conductor patterns formed on a synthetic resin film used as the board. The flexible board is formed integrally with a flexible flat cable comprising a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns. When the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flexible flat cable extending outwardly from a side portion of the synthetic resin casing.

9. 发明授权

US4251783A Variable resonance type amplitude equalizing circuit 失效
标题翻译：可变谐振型振幅均衡电路
公开(公告)号：US4251783A
公开(公告)日：1981-02-17
申请号：US26988
申请日：1979-04-04
申请人： Takahiko Yamada , Kozo Morita
发明人： Takahiko Yamada , Kozo Morita
IPC分类号： H03H7/01 , H04B3/14 , H04B7/005 , H03H7/03
CPC分类号： H04B3/145 , H04B7/005
摘要： A variable resistance device in the form of a PIN diode is connected between one of a pair of input terminals and one of a pair of output terminals, and the other input and output terminals are connected to a common terminal.A distributed constant line is connected between the output terminal of the PIN diode and the common terminal, and variable capacitance diodes are connected between the opposite ends of the distributed constant line and the common terminal. By applying a control voltage applied to the PIN diode and the variable capacitance diodes, the steepness and the center frequency of the variable resistance device are varied.
摘要翻译： PIN二极管形式的可变电阻器件连接在一对输入端子和一对输出端子中的一个之间，另一个输入和输出端子连接到公共端子。分布常数线连接在PIN二极管的输出端子和公共端子之间，可变电容二极管连接在分布常数线和公共端子的相对端之间。通过施加施加到PIN二极管和可变电容二极管的控制电压，可变电阻装置的陡度和中心频率变化。

10. 发明授权

US07728710B2 Electronic parts board and method of producing the same 失效
标题翻译：电子零件板及其制造方法
公开(公告)号：US07728710B2
公开(公告)日：2010-06-01
申请号：US10541459
申请日：2004-02-05
申请人： Shinji Mizuno , Koji Mitsui , Katsutoshi Yanoshita , Shinichi Suzuki , Takashi Shinoki , Kazutaka Nakagome , Naoki Fukuda , Kozo Morita , Daisuke Makino
发明人： Shinji Mizuno , Koji Mitsui , Katsutoshi Yanoshita , Shinichi Suzuki , Takashi Shinoki , Kazutaka Nakagome , Naoki Fukuda , Kozo Morita , Daisuke Makino
IPC分类号： H01C10/32
CPC分类号： B29C45/1418 , B29C45/14467 , B29C45/14639 , B29L2031/3406 , H01C10/32 , H01C10/48 , H05K1/0393 , H05K1/167 , H05K3/0014 , H05K3/0058 , Y10T29/49082 , Y10T428/24917
摘要： An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is slidingly contacted with a slider. The insulating base (10) is a synthetic resin molded piece. The flexible circuit board (20) is insert-molded to the insulating base (10). The electronic component substrate (1-1) is produced by preparing the flexible circuit board (20) and first and second mold members (41, 45) having a cavity (C1) with a shape that corresponds to the external shape of the electronic component substrate (1-1). Then, the flexible circuit board (20) is accommodated in the cavity (C1) between the first and second mold members (41,45), and the cavity (C1) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members (41, 45) are removed.
摘要翻译：电子部件基板（1-1）具有安装在绝缘基体（10）上的绝缘基体（10）和柔性电路基板（20）。柔性电路板（20）是其上设置有端子图案（29）的合成树脂膜和表面与滑块滑动接触的导体图案（25）。绝缘基座（10）是合成树脂模制件。柔性电路板（20）被嵌入成型到绝缘基座（10）。电子部件基板（1-1）通过制备柔性电路板（20）和具有空腔（C1）的第一和第二模具部件（41,45）制成，其形状对应于电子部件的外部形状基板（1-1）。然后，柔性电路板（20）容纳在第一和第二模具构件（41,45）之间的空腔（C1）中，并且空腔（C1）填充有熔融模制树脂。在模制树脂固化之后，移除第一和第二模具构件（41,45）。

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