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1. 发明申请

US20120313230A1 SOLDER ALLOYS AND ARRANGEMENTS 有权
标题翻译：焊接合金和安排
公开(公告)号：US20120313230A1
公开(公告)日：2012-12-13
申请号：US13154523
申请日：2011-06-07
申请人： Manfred MENGEL , Alexander HEINRICH , Steffen ORSO , Thomas BEHRENS , Oliver EICHINGER , Lim FONG , Evelyn NAPETSCHNIG , Edmund RIEDL
发明人： Manfred MENGEL , Alexander HEINRICH , Steffen ORSO , Thomas BEHRENS , Oliver EICHINGER , Lim FONG , Evelyn NAPETSCHNIG , Edmund RIEDL
IPC分类号： H01L23/495 , C22C18/04 , C22C30/04 , C22C18/02 , C22C30/06 , C22C30/02
CPC分类号： H01L24/48 , B23K1/0016 , B23K35/262 , B23K35/282 , B23K35/3013 , C22C13/00 , C22C18/00 , C22C18/04 , C22C30/04 , C22C30/06 , H01L23/488 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/05599 , H01L2224/29111 , H01L2224/29118 , H01L2224/29139 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/45099 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2224/85455 , H01L2224/92247 , H01L2924/00 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01322 , H01L2924/10253 , H01L2924/15747 , H01L2924/207
摘要： A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.
摘要翻译：焊料合金提供包括锌，铝，镁和镓的焊料合金，其中铝占合金重量的8％至20％，镁占合金的0.5％至20％，镓构成的合金的0.5〜20％，剩余的合金包括锌。

2. 发明授权

US07875876B1 Scalable quantum computer 有权
标题翻译：可扩展量子计算机
公开(公告)号：US07875876B1
公开(公告)日：2011-01-25
申请号：US11453746
申请日：2006-06-15
申请人： Stephen Wandzura , Mark F. Gyure , Bryan Ho Lim Fong
发明人： Stephen Wandzura , Mark F. Gyure , Bryan Ho Lim Fong
IPC分类号： H01L31/00
CPC分类号： G06N99/002 , B82Y10/00 , H01L31/101
摘要： Described is a scalable quantum computer that includes at least two classical to quantum interface devices, with each being connected to a distinct quantum processing unit (QPU). An Einstein-Podolsky-Rosen pair generator (EPRPG) is included for generating an entangled Einstein-Podolsky-Rosen pair that is sent to the QPUs. Each QPU is quantumly connected with the EPRPG and is configured to receive a mobile qubit from the EPRPG and perform a sequence of operations such that the mobile qubit interacts with a source qubit when a teleportation algorithm is initiated, leaving a second mobile qubit in the original quantum state of the source qubit.
摘要翻译：描述的是可扩展的量子计算机，其包括至少两个经典到量子界面器件，每个量子计算机连接到不同的量子处理单元（QPU）。包括爱因斯坦 - 波多尔斯基 - 罗森对发生器（EPRPG），用于产生发送到QPU的纠缠的爱因斯坦 - 波多尔斯基 - 罗森对。每个QPU与EPRPG量子连接，并且被配置为从EPRPG接收移动量子位，并且执行一系列操作，使得当远端传送算法被启动时移动量子位与源量子位相互作用，在原始数据中留下第二移动量子位量子态的量子态。

3. 发明授权

US07598122B1 Die attach method and microarray leadframe structure 有权
标题翻译：贴片方法和微阵列引线框架结构
公开(公告)号：US07598122B1
公开(公告)日：2009-10-06
申请号：US11372481
申请日：2006-03-08
申请人： Jaime A. Bayan , Nghia Thuc Tu , Lim Fong , Chan Peng Yeen
发明人： Jaime A. Bayan , Nghia Thuc Tu , Lim Fong , Chan Peng Yeen
IPC分类号： H01L21/00
CPC分类号： H01L23/4951 , H01L21/4828 , H01L23/3107 , H01L23/49513 , H01L23/49541 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one aspect of the invention, a method of attaching a semiconductor die to a microarray leadframe is described. The method comprises stamping an adhesive onto discrete areas of the microarray leadframe using a multi-pronged stamp tool. The adhesive is applied to the leadframe as a series of dots, each dot corresponding to an associated prong of the stamping tool. In some embodiments the adhesive used to attach the semiconductor die to a leadframe is a black epoxy based adhesive material. In an apparatus aspect of the invention, lead traces in a microarray leadframe are arranged to have tails that extend beyond their associated contact posts on the side of the contact post that is opposite a wire bonding region such that such lead traces extends on two opposing sides of their associated contact posts. The tails do not attach to other structures within the lead frame (such as a die attach structure). The width of at least some of these tailed lead traces in a region that overlies their associated contact post is narrower than their associated contact post. Thus, these narrowed lead traces have extensions that extend beyond their associated contact posts. The extensions provide additional surface area that gives an adhesive applied to the narrowed lead trace (as for example by stamping) room to bleed (flow) along the top surface of the lead trace on both sides of the associated contact pad.
摘要翻译：在本发明的一个方面，描述了将半导体管芯附着到微阵列引线框架的方法。该方法包括使用多管齐下的印模工具将粘合剂冲压到微阵列引线框架的离散区域上。将粘合剂作为一系列点施加到引线框架，每个点对应于冲压工具的相关插脚。在一些实施例中，用于将半导体管芯附接到引线框架的粘合剂是黑色环氧基粘合剂材料。在本发明的装置方面，微阵列引线框架中的导线布置成具有延伸超出其在接触柱侧面的与引线接合区域相对的相关接触柱的尾部，使得这种引线迹线在两个相对侧上延伸的相关联系人员。尾部不附着到引线框架内的其他结构（如模具附接结构）。覆盖在其相关联的接触柱上的区域中的这些尾部引线的至少一些的宽度比其相关联的接触柱窄。因此，这些狭窄的引线迹线具有延伸超出其相关接触柱的延伸。这些延伸部分提供了额外的表面积，其给出了粘合剂施加到狭窄的引线迹线（例如通过冲压）沿着引线迹线的顶表面在相关接触焊盘的两侧上的流出（流动）。

4. 发明授权

US07911407B1 Method for designing artificial surface impedance structures characterized by an impedance tensor with complex components 有权
标题翻译：设计人造表面阻抗结构的方法，其特征在于具有复杂分量的阻抗张量
公开(公告)号：US07911407B1
公开(公告)日：2011-03-22
申请号：US12138083
申请日：2008-06-12
申请人： Bryan Ho Lim Fong , Joseph S. Colburn , Paul R. Herz , John J. Ottusch , Daniel F. Sievenpiper , John L. Visher
发明人： Bryan Ho Lim Fong , Joseph S. Colburn , Paul R. Herz , John J. Ottusch , Daniel F. Sievenpiper , John L. Visher
IPC分类号： H01Q15/02 , H01Q1/38
CPC分类号： H01Q15/148 , H01Q15/0046
摘要： A method for designing artificial impedance surfaces is disclosed. The method involves matching impedance component values required for a given far-field radiation pattern (determined, for example, by holographic means) with measured or simulated impedance component values for the units of a lattice of conductive structures used to create an artificial impedance surface, where the units of the lattice have varied geometry. For example, a unit could be a square conductive structure with a slice (removed or missing material) through it. The measured or simulated impedance components are determined by measuring wavevector values for test surfaces in three or more directions over any number of test surfaces, where each unit of a given test surface has the same geometric shape and proportions as all of the other units of that test surface, but each test surface has some form of variation in the unit geometry from the other test surfaces. These test measurements create a table of geometry vs. impedance components that are used to design the artificial impedance structure. Since polarization can be controlled, the structure can be an artificial impedance surface characterized by a tensor impedance having complex components.
摘要翻译：公开了一种用于设计人造阻抗表面的方法。该方法包括将给定远场辐射图（例如通过全息装置确定）所需的阻抗分量值与用于产生人造阻抗表面的导电结构的晶格单元的测量或模拟阻抗分量值进行匹配，其中格子的单位具有不同的几何形状。例如，单元可以是具有切片（去除或缺失材料）的正方形导电结构。测量或模拟的阻抗分量通过在任意数量的测试表面上测量三个或更多个方向上的测试表面的波矢值来确定，其中给定测试表面的每个单元具有与该测试表面的所有其它单元相同的几何形状和比例测试表面，但每个测试表面在其他测试表面的单位几何形状中具有某种形式的变化。这些测试测量创建了用于设计人造阻抗结构的几何对抗阻抗元件表。由于可以控制极化，所以该结构可以是以具有复杂分量的张量阻抗为特征的人造阻抗表面。

5. 发明授权

US07859090B2 Die attach method and leadframe structure 有权
标题翻译：贴片方法和引线框架结构
公开(公告)号：US07859090B2
公开(公告)日：2010-12-28
申请号：US12549324
申请日：2009-08-27
申请人： Jaime A. Bayan , Nghia Thuc Tu , Lim Fong , Chan Peng Yeen
发明人： Jaime A. Bayan , Nghia Thuc Tu , Lim Fong , Chan Peng Yeen
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L23/28
CPC分类号： H01L23/4951 , H01L21/4828 , H01L23/3107 , H01L23/49513 , H01L23/49541 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one aspect of the invention, a method of attaching a semiconductor die to a microarray leadframe is described. The method comprises stamping an adhesive onto discrete areas of the microarray leadframe using a multi-pronged stamp tool. The adhesive is applied to the leadframe as a series of dots, each dot corresponding to an associated prong of the stamping tool. In some embodiments the adhesive used to attach the semiconductor die to a leadframe is a black epoxy based adhesive material. In an apparatus aspect of the invention, lead traces in a microarray leadframe are arranged to have tails that extend beyond their associated contact posts on the side of the contact post that is opposite a wire bonding region such that such lead traces extends on two opposing sides of their associated contact posts. The tails do not attach to other structures within the lead frame (such as a die attach structure). The width of at least some of these tailed lead traces in a region that overlies their associated contact post is narrower than their associated contact post. Thus, these narrowed lead traces have extensions that extend beyond their associated contact posts. The extensions provide additional surface area that gives an adhesive applied to the narrowed lead trace (as for example by stamping) room to bleed (flow) along the top surface of the lead trace on both sides of the associated contact pad.
摘要翻译：在本发明的一个方面，描述了将半导体管芯附着到微阵列引线框架的方法。该方法包括使用多管齐下的印模工具将粘合剂冲压到微阵列引线框架的离散区域上。将粘合剂作为一系列点施加到引线框架，每个点对应于冲压工具的相关插脚。在一些实施例中，用于将半导体管芯附接到引线框架的粘合剂是黑色环氧基粘合剂材料。在本发明的装置方面，微阵列引线框架中的导线布置成具有延伸超出其在接触柱侧面的与引线接合区域相对的相关接触柱的尾部，使得这种引线迹线在两个相对侧上延伸的相关联系人员。尾部不附着到引线框架内的其他结构（如模具附接结构）。覆盖在其相关联的接触柱上的区域中的这些尾部引线的至少一些的宽度比其相关联的接触柱窄。因此，这些狭窄的引线迹线具有延伸超出其相关接触柱的延伸。这些延伸部分提供了额外的表面积，其给出了粘合剂施加到狭窄的引线迹线（例如通过冲压）沿着引线迹线的顶表面在相关接触焊盘的两侧上的流出（流动）。

6. 发明授权

US07830310B1 Artificial impedance structure 有权
标题翻译：人造阻抗结构
公开(公告)号：US07830310B1
公开(公告)日：2010-11-09
申请号：US11173182
申请日：2005-07-01
申请人： Daniel F. Sievenpiper , Joseph S. Colburn , Bryan Ho Lim Fong , Matthew W. Ganz , Mark F. Gyure , Jonathan J. Lynch , John Ottusch , John L. Visher
发明人： Daniel F. Sievenpiper , Joseph S. Colburn , Bryan Ho Lim Fong , Matthew W. Ganz , Mark F. Gyure , Jonathan J. Lynch , John Ottusch , John L. Visher
IPC分类号： H01Q1/38
CPC分类号： H01Q15/008 , H01Q1/38 , H01Q19/065
摘要： An artificial impedance structure and a method for manufacturing same. The structure contains a dielectric layer having generally opposed first and second surfaces, a conductive layer disposed on the first surface, and a plurality of conductive structures disposed on the second surface to provide a preselected impedance profile along the second surface.
摘要翻译：人造阻抗结构及其制造方法。该结构包括具有大致相对的第一和第二表面的介电层，设置在第一表面上的导电层，以及设置在第二表面上的多个导电结构，以沿第二表面提供预选阻抗曲线。

7. 发明授权

US07218281B2 Artificial impedance structure 有权
公开(公告)号：US07218281B2
公开(公告)日：2007-05-15
申请号：US11173187
申请日：2005-07-01
申请人： Daniel F. Sievenpiper , Joseph S. Colburn , Bryan Ho Lim Fong , Matthew W. Ganz , Mark F. Gyure , Jonathan J. Lynch , John Ottusch , John L. Visher
发明人： Daniel F. Sievenpiper , Joseph S. Colburn , Bryan Ho Lim Fong , Matthew W. Ganz , Mark F. Gyure , Jonathan J. Lynch , John Ottusch , John L. Visher
IPC分类号： H01Q1/38
CPC分类号： H01Q15/008
摘要： A method for guiding waves over objects, a method for improving a performance of an antenna, and a method for improving a performance of a radar are disclosed. The methods disclosed teach how an impedance structure can be used to guide waves over objects.

8. 发明授权

US09735126B2 Solder alloys and arrangements 有权
公开(公告)号：US09735126B2
公开(公告)日：2017-08-15
申请号：US13154523
申请日：2011-06-07
申请人： Manfred Mengel , Alexander Heinrich , Steffen Orso , Thomas Behrens , Oliver Eichinger , Lim Fong , Evelyn Napetschnig , Edmund Riedl
发明人： Manfred Mengel , Alexander Heinrich , Steffen Orso , Thomas Behrens , Oliver Eichinger , Lim Fong , Evelyn Napetschnig , Edmund Riedl
IPC分类号： H01L23/495 , H01L23/00 , B23K35/30 , B23K35/26 , B23K35/28 , C22C13/00 , C22C18/00 , C22C18/04 , C22C30/04 , C22C30/06 , H01L23/488 , B23K1/00
CPC分类号： H01L24/48 , B23K1/0016 , B23K35/262 , B23K35/282 , B23K35/3013 , C22C13/00 , C22C18/00 , C22C18/04 , C22C30/04 , C22C30/06 , H01L23/488 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/05599 , H01L2224/29111 , H01L2224/29118 , H01L2224/29139 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/45099 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2224/85455 , H01L2224/92247 , H01L2924/00 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01322 , H01L2924/10253 , H01L2924/15747 , H01L2924/207
摘要： A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

9. 发明申请

US20090315161A1 DIE ATTACH METHOD AND LEADFRAME STRUCTURE 有权
标题翻译： DIE连接方法和LEADFRAME结构
公开(公告)号：US20090315161A1
公开(公告)日：2009-12-24
申请号：US12549324
申请日：2009-08-27
申请人： Jaime A. BAYAN , Nghia Thuc TU , Lim FONG , Chan Peng YEEN
发明人： Jaime A. BAYAN , Nghia Thuc TU , Lim FONG , Chan Peng YEEN
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L21/4828 , H01L23/3107 , H01L23/49513 , H01L23/49541 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one aspect of the invention, a method of attaching a semiconductor die to a microarray leadframe is described. The method comprises stamping an adhesive onto discrete areas of the microarray leadframe using a multi-pronged stamp tool. The adhesive is applied to the leadframe as a series of dots, each dot corresponding to an associated prong of the stamping tool. In some embodiments the adhesive used to attach the semiconductor die to a leadframe is a black epoxy based adhesive material. In an apparatus aspect of the invention, lead traces in a microarray leadframe are arranged to have tails that extend beyond their associated contact posts on the side of the contact post that is opposite a wire bonding region such that such lead traces extends on two opposing sides of their associated contact posts. The tails do not attach to other structures within the lead frame (such as a die attach structure). The width of at least some of these tailed lead traces in a region that overlies their associated contact post is narrower than their associated contact post. Thus, these narrowed lead traces have extensions that extend beyond their associated contact posts. The extensions provide additional surface area that gives an adhesive applied to the narrowed lead trace (as for example by stamping) room to bleed (flow) along the top surface of the lead trace on both sides of the associated contact pad.
摘要翻译：在本发明的一个方面，描述了将半导体管芯附着到微阵列引线框架的方法。该方法包括使用多管齐下的印模工具将粘合剂冲压到微阵列引线框架的离散区域上。将粘合剂作为一系列点施加到引线框架，每个点对应于冲压工具的相关插脚。在一些实施例中，用于将半导体管芯附接到引线框架的粘合剂是黑色环氧基粘合剂材料。在本发明的装置方面，微阵列引线框架中的导线布置成具有延伸超出其在接触柱侧面的与引线接合区域相对的相关接触柱的尾部，使得这种引线迹线在两个相对侧上延伸的相关联系人员。尾部不附着到引线框架内的其他结构（如模具附接结构）。覆盖在其相关联的接触柱上的区域中的这些尾部引线的至少一些的宽度比其相关联的接触柱窄。因此，这些狭窄的引线迹线具有延伸超出其相关接触柱的延伸。这些延伸部分提供了额外的表面积，其给出了粘合剂施加到狭窄的引线迹线（例如通过冲压）沿着引线迹线的顶表面在相关接触焊盘的两侧上的流出（流动）。

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