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1. 发明授权

US07598122B1 Die attach method and microarray leadframe structure 有权
标题翻译：贴片方法和微阵列引线框架结构
公开(公告)号：US07598122B1
公开(公告)日：2009-10-06
申请号：US11372481
申请日：2006-03-08
申请人： Jaime A. Bayan , Nghia Thuc Tu , Lim Fong , Chan Peng Yeen
发明人： Jaime A. Bayan , Nghia Thuc Tu , Lim Fong , Chan Peng Yeen
IPC分类号： H01L21/00
CPC分类号： H01L23/4951 , H01L21/4828 , H01L23/3107 , H01L23/49513 , H01L23/49541 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one aspect of the invention, a method of attaching a semiconductor die to a microarray leadframe is described. The method comprises stamping an adhesive onto discrete areas of the microarray leadframe using a multi-pronged stamp tool. The adhesive is applied to the leadframe as a series of dots, each dot corresponding to an associated prong of the stamping tool. In some embodiments the adhesive used to attach the semiconductor die to a leadframe is a black epoxy based adhesive material. In an apparatus aspect of the invention, lead traces in a microarray leadframe are arranged to have tails that extend beyond their associated contact posts on the side of the contact post that is opposite a wire bonding region such that such lead traces extends on two opposing sides of their associated contact posts. The tails do not attach to other structures within the lead frame (such as a die attach structure). The width of at least some of these tailed lead traces in a region that overlies their associated contact post is narrower than their associated contact post. Thus, these narrowed lead traces have extensions that extend beyond their associated contact posts. The extensions provide additional surface area that gives an adhesive applied to the narrowed lead trace (as for example by stamping) room to bleed (flow) along the top surface of the lead trace on both sides of the associated contact pad.
摘要翻译：在本发明的一个方面，描述了将半导体管芯附着到微阵列引线框架的方法。该方法包括使用多管齐下的印模工具将粘合剂冲压到微阵列引线框架的离散区域上。将粘合剂作为一系列点施加到引线框架，每个点对应于冲压工具的相关插脚。在一些实施例中，用于将半导体管芯附接到引线框架的粘合剂是黑色环氧基粘合剂材料。在本发明的装置方面，微阵列引线框架中的导线布置成具有延伸超出其在接触柱侧面的与引线接合区域相对的相关接触柱的尾部，使得这种引线迹线在两个相对侧上延伸的相关联系人员。尾部不附着到引线框架内的其他结构（如模具附接结构）。覆盖在其相关联的接触柱上的区域中的这些尾部引线的至少一些的宽度比其相关联的接触柱窄。因此，这些狭窄的引线迹线具有延伸超出其相关接触柱的延伸。这些延伸部分提供了额外的表面积，其给出了粘合剂施加到狭窄的引线迹线（例如通过冲压）沿着引线迹线的顶表面在相关接触焊盘的两侧上的流出（流动）。

2. 发明授权

US07859090B2 Die attach method and leadframe structure 有权
标题翻译：贴片方法和引线框架结构
公开(公告)号：US07859090B2
公开(公告)日：2010-12-28
申请号：US12549324
申请日：2009-08-27
申请人： Jaime A. Bayan , Nghia Thuc Tu , Lim Fong , Chan Peng Yeen
发明人： Jaime A. Bayan , Nghia Thuc Tu , Lim Fong , Chan Peng Yeen
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L23/28
CPC分类号： H01L23/4951 , H01L21/4828 , H01L23/3107 , H01L23/49513 , H01L23/49541 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one aspect of the invention, a method of attaching a semiconductor die to a microarray leadframe is described. The method comprises stamping an adhesive onto discrete areas of the microarray leadframe using a multi-pronged stamp tool. The adhesive is applied to the leadframe as a series of dots, each dot corresponding to an associated prong of the stamping tool. In some embodiments the adhesive used to attach the semiconductor die to a leadframe is a black epoxy based adhesive material. In an apparatus aspect of the invention, lead traces in a microarray leadframe are arranged to have tails that extend beyond their associated contact posts on the side of the contact post that is opposite a wire bonding region such that such lead traces extends on two opposing sides of their associated contact posts. The tails do not attach to other structures within the lead frame (such as a die attach structure). The width of at least some of these tailed lead traces in a region that overlies their associated contact post is narrower than their associated contact post. Thus, these narrowed lead traces have extensions that extend beyond their associated contact posts. The extensions provide additional surface area that gives an adhesive applied to the narrowed lead trace (as for example by stamping) room to bleed (flow) along the top surface of the lead trace on both sides of the associated contact pad.
摘要翻译：在本发明的一个方面，描述了将半导体管芯附着到微阵列引线框架的方法。该方法包括使用多管齐下的印模工具将粘合剂冲压到微阵列引线框架的离散区域上。将粘合剂作为一系列点施加到引线框架，每个点对应于冲压工具的相关插脚。在一些实施例中，用于将半导体管芯附接到引线框架的粘合剂是黑色环氧基粘合剂材料。在本发明的装置方面，微阵列引线框架中的导线布置成具有延伸超出其在接触柱侧面的与引线接合区域相对的相关接触柱的尾部，使得这种引线迹线在两个相对侧上延伸的相关联系人员。尾部不附着到引线框架内的其他结构（如模具附接结构）。覆盖在其相关联的接触柱上的区域中的这些尾部引线的至少一些的宽度比其相关联的接触柱窄。因此，这些狭窄的引线迹线具有延伸超出其相关接触柱的延伸。这些延伸部分提供了额外的表面积，其给出了粘合剂施加到狭窄的引线迹线（例如通过冲压）沿着引线迹线的顶表面在相关接触焊盘的两侧上的流出（流动）。

3. 发明授权

US09735126B2 Solder alloys and arrangements 有权
公开(公告)号：US09735126B2
公开(公告)日：2017-08-15
申请号：US13154523
申请日：2011-06-07
申请人： Manfred Mengel , Alexander Heinrich , Steffen Orso , Thomas Behrens , Oliver Eichinger , Lim Fong , Evelyn Napetschnig , Edmund Riedl
发明人： Manfred Mengel , Alexander Heinrich , Steffen Orso , Thomas Behrens , Oliver Eichinger , Lim Fong , Evelyn Napetschnig , Edmund Riedl
IPC分类号： H01L23/495 , H01L23/00 , B23K35/30 , B23K35/26 , B23K35/28 , C22C13/00 , C22C18/00 , C22C18/04 , C22C30/04 , C22C30/06 , H01L23/488 , B23K1/00
CPC分类号： H01L24/48 , B23K1/0016 , B23K35/262 , B23K35/282 , B23K35/3013 , C22C13/00 , C22C18/00 , C22C18/04 , C22C30/04 , C22C30/06 , H01L23/488 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/05599 , H01L2224/29111 , H01L2224/29118 , H01L2224/29139 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/45099 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2224/85455 , H01L2224/92247 , H01L2924/00 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01322 , H01L2924/10253 , H01L2924/15747 , H01L2924/207
摘要： A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

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