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1. 发明授权

US08345458B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08345458B2
公开(公告)日：2013-01-01
申请号：US13293194
申请日：2011-11-10
申请人： Masaki Shiraishi , Noboru Akiyama , Tomoaki Uno , Nobuyoshi Matsuura
发明人： Masaki Shiraishi , Noboru Akiyama , Tomoaki Uno , Nobuyoshi Matsuura
IPC分类号： H02M1/10 , H01L23/48 , H05K7/02
CPC分类号： G05F3/08 , H01L23/3107 , H01L23/4824 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/06 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/16 , H01L29/1095 , H01L29/4175 , H01L29/41758 , H01L29/41766 , H01L29/4238 , H01L29/7811 , H01L29/7813 , H01L29/7835 , H01L2224/05554 , H01L2224/05644 , H01L2224/05647 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48644 , H01L2224/48647 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2224/73221 , H01L2224/84801 , H01L2224/8485 , H01L2224/85375 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/07802 , H01L2924/12032 , H01L2924/12036 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H02M7/003 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In order to reduce parasitic inductance of a main circuit in a power supply circuit, a non-insulated DC-DC converter is provided having a circuit in which a power MOS•FET for a high-side switch and a power MOS•FET for a low-side switch are connected in series. In the non-insulated DC-DC converter, the power MOS•FET for the high-side switch is formed by a p channel vertical MOS•FET, and the power MOS•FET for the low-side switch is formed by an n channel vertical MOS•FET. Thus, a semiconductor chip formed with the power MOS•FET for the high-side switch and a semiconductor chip formed with the power MOS•FET for the low-side switch are mounted over the same die pad and electrically connected to each other through the die pad.
摘要翻译：为了减少电源电路中的主电路的寄生电感，提供了一种非绝缘DC-DC转换器，其具有电路，其中用于高侧开关的功率MOS•FET和功率MOS•FET用于低侧开关串联连接。在非绝缘DC-DC转换器中，高侧开关的功率MOS•FET由ap沟道垂直MOS•FET形成，低边开关功率MOS•FET由n沟道垂直 MOS•FET。因此，形成有用于高侧开关的功率MOS·FET的半导体芯片和形成有用于低侧开关的功率MOS·FET的半导体芯片安装在相同的芯片焊盘上，并且通过芯片垫

2. 发明授权

US08064235B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08064235B2
公开(公告)日：2011-11-22
申请号：US12912796
申请日：2010-10-27
申请人： Masaki Shiraishi , Noboru Akiyama , Tomoaki Uno , Nobuyoshi Matsuura
发明人： Masaki Shiraishi , Noboru Akiyama , Tomoaki Uno , Nobuyoshi Matsuura
IPC分类号： H02M1/00 , H01L23/48 , H05K7/02
CPC分类号： G05F3/08 , H01L23/3107 , H01L23/4824 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/06 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/16 , H01L29/1095 , H01L29/4175 , H01L29/41758 , H01L29/41766 , H01L29/4238 , H01L29/7811 , H01L29/7813 , H01L29/7835 , H01L2224/05554 , H01L2224/05644 , H01L2224/05647 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48644 , H01L2224/48647 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2224/73221 , H01L2224/84801 , H01L2224/8485 , H01L2224/85375 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/07802 , H01L2924/12032 , H01L2924/12036 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H02M7/003 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In order to reduce parasitic inductance of a main circuit in a power supply circuit, a non-insulated DC-DC converter is provided including a circuit in which a power MOS•FET for a high-side switch and a power MOS•FET for a low-side switch are connected in series. In the non-insulated DC-DC converter, the power MOS•FET for the high-side switch is formed by a p-channel vertical MOS•FET, and the power MOS•FET for the low-side switch is formed by an n channel vertical MOS•FET. Thus, a semiconductor chip formed with the power MOS•FET for the high-side switch and a semiconductor chip formed with the power MOS•FET for the low-side switch are mounted over the same die pad and electrically connected to each other through the die pad.
摘要翻译：为了减少电源电路中的主电路的寄生电感，提供了一种非绝缘DC-DC转换器，其包括其中用于高侧开关的功率MOS•FET和功率MOS•FET用于低侧开关串联连接。在非绝缘DC-DC转换器中，高侧开关的功率MOS•FET由p沟道垂直MOS•FET形成，而低边开关的功率MOS•FET由n形成通道垂直MOS•FET。因此，形成有用于高侧开关的功率MOS·FET的半导体芯片和形成有用于低侧开关的功率MOS·FET的半导体芯片安装在相同的芯片焊盘上，并且通过芯片垫

3. 发明授权

US08044520B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08044520B2
公开(公告)日：2011-10-25
申请号：US11624767
申请日：2007-01-19
申请人： Noboru Akiyama , Takayuki Hashimoto , Masaki Shiraishi , Tetsuya Kawashima , Koji Tateno , Nobuyoshi Matsuura
发明人： Noboru Akiyama , Takayuki Hashimoto , Masaki Shiraishi , Tetsuya Kawashima , Koji Tateno , Nobuyoshi Matsuura
IPC分类号： H01L23/52 , H01L29/40
CPC分类号： H01L25/16 , H01L24/37 , H01L24/40 , H01L2224/05554 , H01L2224/37124 , H01L2224/37147 , H01L2224/40245 , H01L2224/40247 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H02M3/1588 , H03K17/08142 , H03K17/162 , H03K17/6871 , H03K2217/0036 , Y02B70/1466 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A power supply capable of reducing loss of large current and high frequency. In an MCM for power supply in which a high-side power MOSFET chip, a low-side power MOSFET chip and a driver IC chip driving them are sealed in one sealing material (a capsulating insulation resin), a wiring length of a wiring DL connecting an output terminal of the driver IC chip to a gate terminal of the low-side power MOSFET chip or a source terminal is made shorter than a wiring length of a wiring DH connecting the output terminal of the driver IC chip to a gate terminal of the high-side power MOSFET chip or a source terminal. Further, the number of the wiring DL is made larger than the number of the wiring DH.
摘要翻译：一种能够减少大电流和高频损耗的电源。在用于电源的MCM中，高边功率MOSFET芯片，低边功率MOSFET芯片和驱动IC芯片驱动它们被密封在一个密封材料（封装绝缘树脂）中，布线DL的布线长度将驱动IC芯片的输出端子与低边功率MOSFET芯片的栅极端子或源极端子连接的时间短于连接驱动器IC芯片的输出端子与栅极端子的布线DH的布线长度高端功率MOSFET芯片或源极端子。此外，使布线数量DL大于布线数量DH。

4. 发明授权

US07863756B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07863756B2
公开(公告)日：2011-01-04
申请号：US12237082
申请日：2008-09-24
申请人： Tomoaki Uno , Masaki Shiraishi , Nobuyoshi Matsuura , Toshio Nagasawa
发明人： Tomoaki Uno , Masaki Shiraishi , Nobuyoshi Matsuura , Toshio Nagasawa
IPC分类号： H01L23/48 , H01L29/66
CPC分类号： H02M1/08 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： A non-insulated DC-DC converter has a power MOS•FET for a highside switch and a power MOS•FET for a lowside switch. In the non-insulated DC-DC converter, the power MOS•FET for the highside switch and the power MOS•FET for the lowside switch, driver circuits that control operations of these elements, respectively, and a Schottky barrier diode connected in parallel with the power MOS•FET for the lowside switch are respectively formed in four different semiconductor chips. These four semiconductor chips are housed in one package. The semiconductor chips are mounted over the same die pad. The semiconductor chips are disposed so as to approach each other.
摘要翻译：非绝缘DC-DC转换器具有用于高侧开关的功率MOS•FET和用于低端开关的功率MOS•FET。在非绝缘DC-DC转换器中，用于高边开关的功率MOS•FET和用于低端开关的功率MOS•FET分别控制这些元件的工作的驱动电路和与之并联连接的肖特基势垒二极管用于低端开关的功率MOS•FET分别形成在四个不同的半导体芯片中。这四个半导体芯片容纳在一个封装中。半导体芯片安装在相同的芯片焊盘上。半导体芯片被配置为彼此接近。

5. 发明授权

US07821243B2 DC/DC converter 有权
标题翻译： DC / DC转换器
公开(公告)号：US07821243B2
公开(公告)日：2010-10-26
申请号：US11624837
申请日：2007-01-19
申请人： Masaki Shiraishi , Takayuki Hashimoto , Noboru Akiyama
发明人： Masaki Shiraishi , Takayuki Hashimoto , Noboru Akiyama
IPC分类号： G05F1/595
CPC分类号： H02M1/08 , H01L24/48 , H01L24/49 , H01L2224/48137 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/12032 , H01L2924/12036 , H01L2924/13091 , H01L2924/14 , H01L2924/30107 , H03K17/0822 , H03K17/165 , H03K17/166 , H03K17/6871 , H01L2924/00 , H01L2224/45099
摘要： In a non-isolated DC/DC converter, a reference potential for a low-side pre-driver which drives a gate of a low-side MOSFET is applied from a portion except for a main circuit passing through a high-side MOSFET and the low-side MOSFET so that a parasitic inductance between a source of the low-side MOSFET and the pre-driver is increased without increasing the sum of parasitic inductances in the main circuit and negative potential driving of the gate of the low-side MOSFET can be performed and a self turn-on phenomenon can be prevented without adding any member and changing drive system.
摘要翻译：在非隔离型DC / DC转换器中，从通过高侧MOSFET的主电路以外的部分施加驱动低侧MOSFET的栅极的低侧预驱动器的基准电位，低侧MOSFET，使得低侧MOSFET的源极与预驱动器之间的寄生电感增加，而不增加主电路中的寄生电感的和，并且低侧MOSFET的栅极的负电位驱动并且可以防止在不添加任何构件和改变驱动系统的情况下自启闭现象。

6. 发明申请

US20100141229A1 Semiconductor Device 有权
标题翻译：半导体器件
公开(公告)号：US20100141229A1
公开(公告)日：2010-06-10
申请号：US12708044
申请日：2010-02-18
申请人： Yukihiro SATOU , Tomoaki Uno , Nobuyoshi Matsuura , Masaki Shiraishi
发明人： Yukihiro SATOU , Tomoaki Uno , Nobuyoshi Matsuura , Masaki Shiraishi
IPC分类号： G05F1/10
CPC分类号： H01L23/5386 , H01L23/49575 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/165 , H01L29/4175 , H01L2224/05554 , H01L2224/0603 , H01L2224/29339 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/4943 , H01L2224/83855 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/20753 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H02M3/1588 , H05K7/02 , Y02B70/1466 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/2075 , H01L2924/20754
摘要： The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS·FET for a high side switch and a power MOS·FET for a low side switch are connected in series. In the non-insulated type DC-DC converter, the power transistor for the high side switch, the power transistor for the low side switch, and driver circuits that drive these are respectively constituted by different semiconductor chips. The three semiconductor chips are accommodated in one package, and the semiconductor chip including the power transistor for the high side switch, and the semiconductor chip including the driver circuits are disposed so as to approach each other.
摘要翻译：本发明提供一种非绝缘型DC-DC转换器，其具有用于高侧开关的功率MOS·FET和低侧开关的功率MOS·FET串联连接的电路。在非绝缘型DC-DC转换器中，用于高侧开关的功率晶体管，低边开关的功率晶体管和驱动它们的驱动电路分别由不同的半导体芯片构成。三个半导体芯片被容纳在一个封装中，并且包括用于高侧开关的功率晶体管的半导体芯片和包括驱动电路的半导体芯片被布置成彼此接近。

7. 发明授权

US07687902B2 Semiconductor device and a manufacturing method of the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07687902B2
公开(公告)日：2010-03-30
申请号：US11192069
申请日：2005-07-29
申请人： Masaki Shiraishi , Tomoaki Uno , Nobuyoshi Matsuura
发明人： Masaki Shiraishi , Tomoaki Uno , Nobuyoshi Matsuura
IPC分类号： H01L23/24
CPC分类号： H01L27/0629 , H01L21/28035 , H01L21/823475 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/06 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L29/1095 , H01L29/41741 , H01L29/4232 , H01L29/4236 , H01L29/4238 , H01L29/45 , H01L29/456 , H01L29/4916 , H01L29/66143 , H01L29/66734 , H01L29/7806 , H01L29/7813 , H01L29/872 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48253 , H01L2224/48624 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/20753 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H02M3/155 , H02M7/003
摘要： In a non-insulated DC-DC converter having a circuit in which a power MOS•FET high-side switch and a power MOS•FET low-side switch are connected in series, the power MOS•FET low-side switch and a Schottky barrier diode to be connected in parallel with the power MOS•FET low-side switch are formed within one semiconductor chip. The formation region SDR of the Schottky barrier diode is disposed in the center in the shorter direction of the semiconductor chip, and on both sides thereof, the formation regions of the power MOS•FET low-side switch are disposed. From the gate finger in the vicinity of both long sides on the main surface of the semiconductor chip toward the formation region SDR of the Schottky barrier diode, a plurality of gate fingers are disposed so as to interpose the formation region SDR between them.
摘要翻译：在具有功率MOS·FET高侧开关和功率MOS·FET低侧开关串联的电路的非绝缘DC-DC转换器中，功率MOS·FET低侧开关和肖特基与功率MOS·FET低侧开关并联连接的二极管形成在一个半导体芯片内。肖特基势垒二极管的形成区域SDR设置在半导体芯片的较短方向的中央，并且在其两侧设置功率MOS·FET低侧开关的形成区域。从半导体芯片的主表面的两长边附近的栅极指向肖特基势垒二极管的形成区域SDR，设置多个栅极指，以便在它们之间插入形成区域SDR。

8. 发明授权

US07669623B2 Elastic wheel and method of manufacturing the same 失效
标题翻译：弹性轮及其制造方法
公开(公告)号：US07669623B2
公开(公告)日：2010-03-02
申请号：US10584190
申请日：2005-06-01
申请人： Masaki Shiraishi , Tadashi Imamura , Yoshiaki Kimura , Kenji Maki
发明人： Masaki Shiraishi , Tadashi Imamura , Yoshiaki Kimura , Kenji Maki
IPC分类号： B60B9/10
CPC分类号： B60B9/12 , Y10T29/49503
摘要： An elastic wheel comprises a rim for mounting a tire, a disk to be fixed to an axle, and a connecting apparatus for connecting elastically between the rim and disk, the apparatus comprising a pair of axially spaced internal flanges each provided on an inner circumference side of the rim and extending circumferentially, an external flange provided on a radially outer portion of the disk, the external flange disposed in a space between the internal flanges with an axial gap on its both sides and extending circumferentially, a pair of rubber dampers each disposed in the axial gap and connecting between the internal and external flanges, wherein each internal flange is provided on its axially inner side with a first groove, the external flange is provided on its both sides with a second groove so as to face each first groove, axial ends of each damper are inserted into the first and second grooves, and a radial gap is provided between the external flange and the inner circumference side of the rim in the space.
摘要翻译：弹性轮包括用于安装轮胎的轮辋，待固定到车轴的盘和用于弹性地连接在轮辋和盘之间的连接装置，该装置包括一对轴向隔开的内凸缘，每个内凸缘设置在内周侧所述外凸缘设置在所述盘的径向外部部分上，所述外凸缘设置在所述内凸缘之间的空间中，在其两侧具有轴向间隙并沿周向延伸;一对橡胶阻尼器，每个设置在所述外凸缘在轴向间隙和内外凸缘之间的连接处，其中每个内凸缘在其轴向内侧设置有第一凹槽，外凸缘在其两侧设置有第二凹槽，以面对每个第一凹槽，每个阻尼器的轴向端部插入到第一和第二槽中，并且在外部凸缘和内周侧之间设置径向间隙在空间里的边缘。

9. 发明申请

US20100030533A1 METHOD OF SIMULATING ROLLING TIRE 有权
标题翻译：模拟滚轮的方法
公开(公告)号：US20100030533A1
公开(公告)日：2010-02-04
申请号：US12483924
申请日：2009-06-12
申请人： Kenji UEDA , Masaki Shiraishi
发明人： Kenji UEDA , Masaki Shiraishi
IPC分类号： G06F17/10 , G06G7/48
CPC分类号： G01M17/02 , B60C99/006 , G06F17/5018 , G06F17/5095
摘要： A method of simulating a tire rolling on a road at a certain speed by using a computer apparatus 1 comprises the steps of: modeling a flexible tire model 2 for numerical calculation by using finite elements having at least one elastic element (step S1), changing at least one elastic element of the flexible tire model 2 to rigid elements so as to make a rigid tire model 5 (step S6), accelerating the rigid tire model 5 (step S7), returning the elasticity of each element of the rigid tire model into the original elasticity when the speed of the rigid tire model 5 has reached the certain speed (step S8), and obtaining at least one physical parameter related to the flexible tire model 2 (step S10).
摘要翻译：通过使用计算机装置1以一定速度模拟在道路上滚动的轮胎的方法包括以下步骤：通过使用具有至少一个弹性元件的有限元（步骤S1）对柔性轮胎模型2进行建模以进行数值计算，步骤S1 将柔性轮胎模型2的至少一个弹性元件连接到刚性元件以制成刚性轮胎模型5（步骤S6），加速刚性轮胎模型5（步骤S7），返回刚性轮胎模型的每个元件的弹性当刚性轮胎模型5的速度达到一定速度时（步骤S8），获得与柔性轮胎模型2相关的至少一个物理参数（步骤S10），成为原始弹性。

10. 发明申请

US20090207640A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20090207640A1
公开(公告)日：2009-08-20
申请号：US12430972
申请日：2009-04-28
申请人： Masaki Shiraishi , Noboru Akiyama , Tomoaki Uno , Nobuyoshi Matsuura
发明人： Masaki Shiraishi , Noboru Akiyama , Tomoaki Uno , Nobuyoshi Matsuura
IPC分类号： H02M1/00 , H01L23/48
CPC分类号： G05F3/08 , H01L23/3107 , H01L23/4824 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/06 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/16 , H01L29/1095 , H01L29/4175 , H01L29/41758 , H01L29/41766 , H01L29/4238 , H01L29/7811 , H01L29/7813 , H01L29/7835 , H01L2224/05554 , H01L2224/05644 , H01L2224/05647 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48644 , H01L2224/48647 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2224/73221 , H01L2224/84801 , H01L2224/8485 , H01L2224/85375 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/07802 , H01L2924/12032 , H01L2924/12036 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H02M7/003 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The object of the present invention is to reduce parasitic inductance of a main circuit in a power supply circuit. The present invention provides a non-insulated DC-DC converter having a circuit in which a power MOS*FET for a high-side switch and a power MOS*FET for a low-side switch are connected in series. In the non-insulated DC-DC converter, the power MOS*FET for the high-side switch is formed by a p channel vertical MOS*FET, and the power MOS*FET for the low-side switch is formed by an n channel vertical MOS*FET. Thus, a semiconductor chip formed with the power MOS*FET for the high-side switch and a semiconductor chip formed with the power MOS*FET for the low-side switch are mounted over the same die pad and electrically connected to each other through the die pad.
摘要翻译：本发明的目的是减少电源电路中的主电路的寄生电感。本发明提供了一种非绝缘DC-DC转换器，其具有用于高侧开关的功率MOS * FET和用于低侧开关的功率MOS * FET串联连接的电路。在非绝缘DC-DC转换器中，用于高侧开关的功率MOS * FET由ap沟道垂直MOS * FET形成，低边开关的功率MOS * FET由n沟道垂直 MOS * FET。因此，形成有用于高侧开关的功率MOS * FET和形成有用于低侧开关的功率MOS * FET的半导体芯片的半导体芯片安装在相同的芯片焊盘上，并通过芯片垫

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