专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07758681B2 Cobalt-based alloy electroless plating solution and electroless plating method using the same 有权
标题翻译：钴基合金化学镀溶液及使用其的化学镀方法
公开(公告)号：US07758681B2
公开(公告)日：2010-07-20
申请号：US11647283
申请日：2006-12-29
申请人： Sang-chul Lee , Min-kyoun Kim , Min-jin Ko
发明人： Sang-chul Lee , Min-kyoun Kim , Min-jin Ko
IPC分类号： C23C18/34 , B05D1/18
CPC分类号： C23C18/1834 , C23C18/34 , C23C18/50 , Y10T428/31678
摘要： A cobalt-based alloy electroless plating solution according to the present invention comprises a cobalt precursor, a tungsten precursor, a phosphorus precursor, a reducing agent, a complexing agent, a pH regulator and a stabilizer, in which the reducing agent is dimethylamine borane (DMAB) or borohydride and the stabilizer is one or more compounds selected from a group consisting of imidazole, thiazole, triazole, disulfide and their derivatives; and which is stable enough for long-term reuse and prevents deterioration of metal thin-film quality by inhibiting the formation of a precipitate.
摘要翻译：根据本发明的钴基合金化学镀溶液包括钴前体，钨前体，磷前体，还原剂，络合剂，pH调节剂和稳定剂，其中还原剂是二甲胺硼烷（ DMAB）或硼氢化钠，稳定剂是一种或多种选自咪唑，噻唑，三唑，二硫化物及其衍生物的化合物; 其稳定性足以长期再利用，并通过抑制沉淀物的形成来防止金属薄膜质量的劣化。

2. 发明授权

US07682774B2 Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods 有权
标题翻译：包含用于化学镀以形成电磁波屏蔽层的催化剂前体的树脂组合物，使用该树脂组合物形成金属图案的方法和通过该方法形成的金属图案
公开(公告)号：US07682774B2
公开(公告)日：2010-03-23
申请号：US11785080
申请日：2007-04-13
申请人： Min Kyoun Kim , Min Jin Ko , Bum Gyu Choi , Sang Chul Lee , Jeong Im Roh
发明人： Min Kyoun Kim , Min Jin Ko , Bum Gyu Choi , Sang Chul Lee , Jeong Im Roh
IPC分类号： G03F7/00 , C25D5/54
CPC分类号： G03F7/0285 , G03F7/033 , G03F7/2024 , G03F7/40 , H05K3/185 , Y10T428/24802
摘要： Disclosed is a resin composition which comprises a catalyst precursor for electroless plating to form an electromagnetic wave shielding layer. The resin composition comprises an organic polymer resin, a polyfunctional monomer having an ethylenically unsaturated bond, a photoinitiator, a silver organic complex precursor as a catalyst precursor, and an organic solvent. Further disclosed are methods for forming metal patterns using the resin composition and metal patterns formed by the methods. The methods comprise forming a pattern, reducing the pattern, and electroless plating the reduced pattern. A patterned layer of the catalyst formed using the resin composition is highly adhesive, a loss of the catalyst during a wet process is substantially prevented, and an increase in plating rate leads to the formation of a uniform, fine metal pattern after electroless plating. Electromagnetic wave shielding materials comprising the metal pattern can be used in the formation of films for shielding electromagnetic waves.
摘要翻译：公开了一种树脂组合物，其包含用于化学镀以形成电磁波屏蔽层的催化剂前体。树脂组合物包含有机聚合物树脂，具有烯键式不饱和键的多官能单体，光引发剂，作为催化剂前体的银有机络合物前体和有机溶剂。进一步公开了使用树脂组合物形成金属图案的方法和通过该方法形成的金属图案。所述方法包括形成图案，减少图案，以及化学镀覆减薄图案。使用树脂组合物形成的催化剂的图案化层是高度粘合的，基本上防止了湿法处理过程中催化剂的损失，并且电镀速率的增加导致化学镀后形成均匀的精细金属图案。包含金属图案的电磁波屏蔽材料可用于形成用于屏蔽电磁波的膜。

3. 发明授权

US08729208B2 Curable composition 有权
标题翻译：可固化组合物
公开(公告)号：US08729208B2
公开(公告)日：2014-05-20
申请号：US13557916
申请日：2012-07-25
申请人： Min Jin Ko , Myung Sun Moon , Jae Ho Jung , Bum Gyu Choi , Dae Ho Kang , Min Kyoun Kim
发明人： Min Jin Ko , Myung Sun Moon , Jae Ho Jung , Bum Gyu Choi , Dae Ho Kang , Min Kyoun Kim
IPC分类号： C08G77/08
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , G02F2202/28 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well as showing excellent processability and workability is provided. Also, surface stickiness may be prevented in the cured product without causing turbidity etc.
摘要翻译：提供可固化组合物。提供了显示出优异的光提取效率，耐裂纹性，硬度，耐热冲击性和固化后的粘合强度以及显示出优异的加工性和可加工性的固化产物。此外，可以防止固化产物中的表面粘性而不引起混浊等

4. 发明授权

US08519017B2 Resin composition containing catalyst precursor for electroless plating in forming electro-magnetic shielding layer, method of forming metallic pattern using the same, and metallic pattern formed by the same method 有权
标题翻译：在形成电磁屏蔽层时含有用于无电镀的催化剂前体的树脂组合物，使用其形成金属图案的方法和通过相同方法形成的金属图案
公开(公告)号：US08519017B2
公开(公告)日：2013-08-27
申请号：US12600455
申请日：2008-05-15
申请人： Min Kyoun Kim , Min Jin Ko , Sang Chul Lee , Jeong Im Roh
发明人： Min Kyoun Kim , Min Jin Ko , Sang Chul Lee , Jeong Im Roh
IPC分类号： C08F2/50 , C08J3/28 , C05D9/02 , B01J31/02 , B01J31/22 , B01J31/26
CPC分类号： H05K9/0086 , C08F220/14 , C08F220/18 , C08F222/40 , C23C18/14 , C23C18/1608 , C23C18/1879 , C23C18/1882 , C23C18/206 , C23C18/2066 , C23C18/31 , C23C18/34 , H05K3/185 , H05K2203/121
摘要： A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.
摘要翻译：催化剂前体树脂组合物包括有机聚合物树脂; 银离子的氟化有机络合物; 具有多官能乙烯 - 不饱和键的单体; 光引发剂; 和有机溶剂。金属图案通过使用催化剂前体树脂组合物在基材上形成催化剂图案而形成，还原形成的催化剂图案，以及化学镀覆还原的催化剂图案。在使用催化剂前体树脂组合物形成金属图案的情况下，催化剂的相容性足够好，不会使形成的催化剂层的析出，耐化学性和粘合力良好，在湿法如显影或者电镀工艺，沉积速度提高，因此可以在化学镀后形成具有良好均匀和微图案特性的金属图案。

5. 发明申请

US20130187176A1 SILICONE RESIN 有权
标题翻译：硅树脂
公开(公告)号：US20130187176A1
公开(公告)日：2013-07-25
申请号：US13555574
申请日：2012-07-23
申请人： Min Jin KO , Myung Sun MOON , Jae Ho JUNG , Bum Gyu CHOI , Dae Ho KANG , Min Kyoun KIM
发明人： Min Jin KO , Myung Sun MOON , Jae Ho JUNG , Bum Gyu CHOI , Dae Ho KANG , Min Kyoun KIM
IPC分类号： C08G77/20 , H01L33/56 , H01L23/29
CPC分类号： C08G77/20 , C08G77/12 , C08G77/70 , C08K5/56 , C08L83/04 , H01L23/29 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.
摘要翻译：提供硅树脂。有机硅树脂可以有效地用于封装半导体元件，例如发光二极管的发光元件。

6. 发明申请

US20130009201A1 CURABLE COMPOSITION 有权
标题翻译：可固化组合物
公开(公告)号：US20130009201A1
公开(公告)日：2013-01-10
申请号：US13557916
申请日：2012-07-25
申请人： Min Jin KO , Myung Sun MOON , Jae Ho JUNG , Bum Gyu CHOI , Dae Ho KANG , Min Kyoun KIM
发明人： Min Jin KO , Myung Sun MOON , Jae Ho JUNG , Bum Gyu CHOI , Dae Ho KANG , Min Kyoun KIM
IPC分类号： C08G77/12 , H01L33/56
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , G02F2202/28 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well as showing excellent processability and workability is provided. Also, surface stickiness may be prevented in the cured product without causing turbidity etc.
摘要翻译：提供可固化组合物。提供了显示出优异的光提取效率，耐裂纹性，硬度，耐热冲击性和固化后的粘合强度以及显示出优异的加工性和可加工性的固化产物。此外，可以防止固化产物中的表面粘性而不引起混浊等

7. 发明申请

US20070243363A1 Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods 有权
标题翻译：包含用于化学镀以形成电磁波屏蔽层的催化剂前体的树脂组合物，使用该树脂组合物形成金属图案的方法和通过该方法形成的金属图案
公开(公告)号：US20070243363A1
公开(公告)日：2007-10-18
申请号：US11785080
申请日：2007-04-13
申请人： Min Kyoun Kim , Min Jin Ko , Bum Gyu Choi , Sang Chul Lee , Jeong Im Roh
发明人： Min Kyoun Kim , Min Jin Ko , Bum Gyu Choi , Sang Chul Lee , Jeong Im Roh
IPC分类号： B41M5/00
CPC分类号： G03F7/0285 , G03F7/033 , G03F7/2024 , G03F7/40 , H05K3/185 , Y10T428/24802
摘要： Disclosed is a resin composition which comprises a catalyst precursor for electroless plating to form an electromagnetic wave shielding layer. The resin composition comprises an organic polymer resin, a polyfunctional monomer having an ethylenically unsaturated bond, a photoinitiator, a silver organic complex precursor as a catalyst precursor, and an organic solvent. Further disclosed are methods for forming metal patterns using the resin composition and metal patterns formed by the methods. The methods comprise forming a pattern, reducing the pattern, and electroless plating the reduced pattern. A patterned layer of the catalyst formed using the resin composition is highly adhesive, a loss of the catalyst during a wet process is substantially prevented, and an increase in plating rate leads to the formation of a uniform, fine metal pattern after electroless plating. Electromagnetic wave shielding materials comprising the metal pattern can be used in the formation of films for shielding electromagnetic waves.
摘要翻译：公开了一种树脂组合物，其包含用于化学镀以形成电磁波屏蔽层的催化剂前体。树脂组合物包含有机聚合物树脂，具有烯键式不饱和键的多官能单体，光引发剂，作为催化剂前体的银有机络合物前体和有机溶剂。进一步公开了使用树脂组合物形成金属图案的方法和通过该方法形成的金属图案。所述方法包括形成图案，减少图案，以及化学镀覆减薄图案。使用树脂组合物形成的催化剂的图案层是高度粘合的，基本上防止了湿法处理过程中催化剂的损失，并且电镀速率的增加导致化学镀后形成均匀的精细金属图案。包含金属图案的电磁波屏蔽材料可用于形成用于屏蔽电磁波的膜。

8. 发明申请

US20130009200A1 CURABLE COMPOSITION 有权
标题翻译：可固化组合物
公开(公告)号：US20130009200A1
公开(公告)日：2013-01-10
申请号：US13554489
申请日：2012-07-20
申请人： Min Jin KO , Myung Sun MOON , Jae Ho JUNG , Bum Gyu CHOI , Dae Ho KANG , Min Kyoun KIM
发明人： Min Jin KO , Myung Sun MOON , Jae Ho JUNG , Bum Gyu CHOI , Dae Ho KANG , Min Kyoun KIM
IPC分类号： C09D183/04 , H01L33/56 , H01L23/29
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08K5/5419 , C08K5/5425 , C08L83/04 , H01L33/56 , H01L2924/0002 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： The present invention relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.
摘要翻译：本发明涉及可固化组合物。可以提供可固化组合物; 显示出优异的加工性和可加工性; 显示出优异的光提取效率，抗裂性，硬度，耐热冲击性和固化后的粘合强度; 并且在高温和/或高湿度条件下具有优异的可靠性和长期的可靠性。此外，可以防止在固化产物中的浊度和表面粘性。

9. 发明申请

US20100167081A1 RESIN COMPOSITION CONTAINING CATALYST PRECURSOR FOR ELECTROLESS PLATING IN FORMING ELECTRO-MAGNETIC SHIELDING LAYER, METHOD OF FORMING METALLIC PATTERN USING THE SAME, AND METALLIC PATTERN FORMED BY THE SAME METHOD 有权
标题翻译：包含用于形成电磁屏蔽层中的电镀的催化剂前体的树脂组合物，使用其形成金属图案的方法和由该方法形成的金属图案
公开(公告)号：US20100167081A1
公开(公告)日：2010-07-01
申请号：US12600455
申请日：2008-05-15
申请人： Min Kyoun Kim , Min Jin Ko , Sang Chul Lee , Jeong Im Roh
发明人： Min Kyoun Kim , Min Jin Ko , Sang Chul Lee , Jeong Im Roh
IPC分类号： B32B3/10 , B01J31/22 , B05D5/12 , G03F7/20
CPC分类号： H05K9/0086 , C08F220/14 , C08F220/18 , C08F222/40 , C23C18/14 , C23C18/1608 , C23C18/1879 , C23C18/1882 , C23C18/206 , C23C18/2066 , C23C18/31 , C23C18/34 , H05K3/185 , H05K2203/121
摘要： A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.
摘要翻译：催化剂前体树脂组合物包括有机聚合物树脂; 银离子的氟化有机络合物; 具有多官能乙烯 - 不饱和键的单体; 光引发剂; 和有机溶剂。金属图案通过使用催化剂前体树脂组合物在基材上形成催化剂图案而形成，还原形成的催化剂图案，以及化学镀覆还原的催化剂图案。在使用催化剂前体树脂组合物形成金属图案的情况下，催化剂的相容性足够好，不会使形成的催化剂层的沉淀，耐化学性和粘合力良好，在湿法如显影或者电镀工艺，沉积速度提高，因此可以在化学镀后形成具有良好均匀和微图案特性的金属图案。

10. 发明申请

US20070160857A1 Cobalt-based alloy electroless planting solution and electroless plating method using the same 有权
标题翻译：钴基合金无电解种植液及使用其的化学镀方法
公开(公告)号：US20070160857A1
公开(公告)日：2007-07-12
申请号：US11647283
申请日：2006-12-29
申请人： Sang-chul Lee , Min-kyoun Kim , Min-jin Ko
发明人： Sang-chul Lee , Min-kyoun Kim , Min-jin Ko
IPC分类号： B05D3/04 , C22C19/07 , B05D1/18 , B32B15/00
CPC分类号： C23C18/1834 , C23C18/34 , C23C18/50 , Y10T428/31678
摘要： The present invention provides a cobalt-based alloy electroless plating solution comprising a cobalt precursor, a tungsten precursor, a phosphorus precursor, a reducing agent, a complexing agent, a pH regulator and a stabilizer, in which the reducing agent is dimethylamine borane (DMAB) or borohydride and the stabilizer is one or more compounds selected from a group consisting of imidazole, thiazole, triazole, disulfide and their derivatives; and an electroless plating method using the cobalt-based alloy electroless plating solution, as well as a thin film prepared by the same. According to the present invention, the cobalt-based alloy electroless plating solution is stable enough for long-term reuse and prevents deterioration of metal thin-film quality by inhibiting the formation of a precipitate. The present invention further provides an electroless plating method using the cobalt-based alloy electroless plating solution, and a cobalt-based alloy thin film prepared by the same.
摘要翻译：本发明提供了一种钴基合金无电解镀液，其包含钴前体，钨前体，磷前体，还原剂，络合剂，pH调节剂和稳定剂，其中还原剂是二甲胺硼烷（DMAB ）或硼氢化物，稳定剂是一种或多种选自咪唑，噻唑，三唑，二硫化物及其衍生物的化合物; 以及使用该钴基合金化学镀溶液的无电镀方法，以及使用其制备的薄膜。根据本发明，钴基合金化学镀溶液的稳定性足以长期重复利用，并且通过抑制沉淀物的形成来防止金属薄膜质量的劣化。本发明还提供了一种使用钴基合金化学镀溶液的化学镀方法和由其制备的钴基合金薄膜。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式