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    • 10. 发明授权
    • Process for preparing organic silicate polymer
    • 有机硅酸盐聚合物的制备方法
    • US07358316B2
    • 2008-04-15
    • US10380812
    • 2001-09-18
    • Min-Jin KoMyung-Sun MoonDong-Seok ShinJung-Won KangHye-Yeong Nam
    • Min-Jin KoMyung-Sun MoonDong-Seok ShinJung-Won KangHye-Yeong Nam
    • C08G77/06
    • C08G77/50C08G77/06C09D183/04Y10T428/31663
    • The present invention relates to a low dielectric material essential for a next generation electric device such as a semiconductor device, with a high density and high performance. In detail, the present invention provides: a process for preparing an organic silicate polymer comprising a polymerization step in the absence of homogenizing organic solvents, of mixing and reacting organic silane compounds with water in the presence of a catalyst to hydrolyze and condense the silane compounds, that is thermally stable and has good mechanical and crack resistance properties; and a coating composition for forming a low dielectric insulating film; and a process for preparing a low dielectric insulating film using the organic silicate polymer prepared according to the process, and an electric device comprising the low dielectric insulating film prepared according to the process.
    • 本发明涉及具有高密度和高性能的诸如半导体器件的下一代电子器件所必需的低介电材料。 详细地说,本发明提供了一种制备有机硅酸盐聚合物的方法,其包括在没有均质化有机溶剂的情况下的聚合步骤,在催化剂存在下将有机硅烷化合物与水混合并反应以水解和缩合硅烷化合物 ,这是热稳定的,具有良好的机械和抗裂性能; 和用于形成低介电绝缘膜的涂料组合物; 以及使用根据该方法制备的有机硅酸盐聚合物制备低介电绝缘膜的方法,以及包括根据该方法制备的低介电绝缘膜的电子器件。