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1. 发明授权

US09066432B2 Copper foil for printed wiring board 有权
标题翻译：铜箔印刷线路板
公开(公告)号：US09066432B2
公开(公告)日：2015-06-23
申请号：US13988183
申请日：2010-11-17
申请人： Koichiro Tanaka , Misato Chuganji
发明人： Koichiro Tanaka , Misato Chuganji
IPC分类号： B32B15/08 , H05K1/09 , C23C14/16 , C23C28/02 , H05K3/38 , C23C26/00 , H05K1/03 , H05K3/02
CPC分类号： H05K1/09 , C23C14/165 , C23C26/00 , C23C28/023 , H05K1/0393 , H05K3/022 , H05K3/384 , Y10T428/12438 , Y10T428/12569 , Y10T428/12819 , Y10T428/1291
摘要： Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 μg/dm2; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 μg/dm2; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.
摘要翻译：提供一种用于印刷线路板的铜箔，铜箔适合于实现更细的节距，在制造成本方面是有利的，并且在蚀刻能力和对绝缘基板的粘合性方面均优异。用于印刷电路板的铜箔包括铜箔基材和用于覆盖铜箔基材表面的至少一部分的覆盖层，其中覆盖层由含有镍的镍 - 钒合金层形成，钒和铬层，从铜箔基材的表面依次层叠; 铬层含有15〜210μg/ dm 2的铬; 镍钒合金层含有合并覆盖量为20-600μg/ dm2的镍和钒; 镍钒合金层含有3-70重量％的钒。

2. 发明申请

US20130240257A1 COPPER FOIL FOR PRINTED WIRING BOARD 有权
标题翻译：铜箔印刷线路板
公开(公告)号：US20130240257A1
公开(公告)日：2013-09-19
申请号：US13988183
申请日：2010-11-17
申请人： Koichiro Tanaka , Misato Chuganji
发明人： Koichiro Tanaka , Misato Chuganji
IPC分类号： H05K1/09
CPC分类号： H05K1/09 , C23C14/165 , C23C26/00 , C23C28/023 , H05K1/0393 , H05K3/022 , H05K3/384 , Y10T428/12438 , Y10T428/12569 , Y10T428/12819 , Y10T428/1291
摘要： Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 μg/dm2; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 μg/dm2; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.
摘要翻译：提供一种用于印刷线路板的铜箔，铜箔适合于实现更细的节距，在制造成本方面是有利的，并且在蚀刻能力和对绝缘基板的粘合性方面均优异。用于印刷电路板的铜箔包括铜箔基材和用于覆盖铜箔基材表面的至少一部分的覆盖层，其中覆盖层由含有镍的镍 - 钒合金层形成，钒和铬层，从铜箔基材的表面依次层叠; 铬层含有15〜210mug / dm 2的铬; 镍钒合金层含有合并覆盖量为20〜600mug / dm 2的镍和钒; 镍钒合金层含有3-70重量％的钒。

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