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1. 发明授权

US09066432B2 Copper foil for printed wiring board 有权
标题翻译：铜箔印刷线路板
公开(公告)号：US09066432B2
公开(公告)日：2015-06-23
申请号：US13988183
申请日：2010-11-17
申请人： Koichiro Tanaka , Misato Chuganji
发明人： Koichiro Tanaka , Misato Chuganji
IPC分类号： B32B15/08 , H05K1/09 , C23C14/16 , C23C28/02 , H05K3/38 , C23C26/00 , H05K1/03 , H05K3/02
CPC分类号： H05K1/09 , C23C14/165 , C23C26/00 , C23C28/023 , H05K1/0393 , H05K3/022 , H05K3/384 , Y10T428/12438 , Y10T428/12569 , Y10T428/12819 , Y10T428/1291
摘要： Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 μg/dm2; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 μg/dm2; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.
摘要翻译：提供一种用于印刷线路板的铜箔，铜箔适合于实现更细的节距，在制造成本方面是有利的，并且在蚀刻能力和对绝缘基板的粘合性方面均优异。用于印刷电路板的铜箔包括铜箔基材和用于覆盖铜箔基材表面的至少一部分的覆盖层，其中覆盖层由含有镍的镍 - 钒合金层形成，钒和铬层，从铜箔基材的表面依次层叠; 铬层含有15〜210μg/ dm 2的铬; 镍钒合金层含有合并覆盖量为20-600μg/ dm2的镍和钒; 镍钒合金层含有3-70重量％的钒。

2. 发明申请

US20130240257A1 COPPER FOIL FOR PRINTED WIRING BOARD 有权
标题翻译：铜箔印刷线路板
公开(公告)号：US20130240257A1
公开(公告)日：2013-09-19
申请号：US13988183
申请日：2010-11-17
申请人： Koichiro Tanaka , Misato Chuganji
发明人： Koichiro Tanaka , Misato Chuganji
IPC分类号： H05K1/09
CPC分类号： H05K1/09 , C23C14/165 , C23C26/00 , C23C28/023 , H05K1/0393 , H05K3/022 , H05K3/384 , Y10T428/12438 , Y10T428/12569 , Y10T428/12819 , Y10T428/1291
摘要： Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 μg/dm2; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 μg/dm2; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.
摘要翻译：提供一种用于印刷线路板的铜箔，铜箔适合于实现更细的节距，在制造成本方面是有利的，并且在蚀刻能力和对绝缘基板的粘合性方面均优异。用于印刷电路板的铜箔包括铜箔基材和用于覆盖铜箔基材表面的至少一部分的覆盖层，其中覆盖层由含有镍的镍 - 钒合金层形成，钒和铬层，从铜箔基材的表面依次层叠; 铬层含有15〜210mug / dm 2的铬; 镍钒合金层含有合并覆盖量为20〜600mug / dm 2的镍和钒; 镍钒合金层含有3-70重量％的钒。

3. 发明申请

US20150064493A1 COPPER FOIL COMPOSITE, FORMED PRODUCT AND METHOD OF PRODUCING THE SAME 有权
标题翻译：铜箔复合材料，成型产品及其生产方法
公开(公告)号：US20150064493A1
公开(公告)日：2015-03-05
申请号：US14369909
申请日：2012-01-13
申请人： Koichiro Tanaka , Kazuki Kammuri
发明人： Koichiro Tanaka , Kazuki Kammuri
IPC分类号： H05K1/03 , B32B15/20 , B32B7/02 , H05K1/05 , H05K1/09
CPC分类号： H05K1/0393 , B32B7/02 , B32B15/08 , B32B15/20 , B32B2307/712 , B32B2457/08 , H05K1/053 , H05K1/056 , H05K1/09 , H05K3/022 , H05K2201/0145 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358 , H05K2201/05 , H05K2201/06 , Y10T29/302 , Y10T428/12438 , Y10T428/273
摘要： A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1
摘要翻译：包括铜箔和层压在其上的树脂层的铜箔复合体，满足等式1：（f3×t3）/（f2×t2）=> 1其中t2（mm）是铜箔的厚度，f2（MPa ）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，等式2： 1 <= 33f1 /（F×T）其中，f1（N / mm）是铜箔和树脂层之间的180°剥离强度，F（MPa）是拉伸应变下的铜箔复合材料的强度为30％， T（mm）是铜箔复合体的厚度，其中以5〜100μg/ dm 2的涂布量形成Cr氧化物层。形成在不层叠树脂层的铜箔的表面上。

4. 发明授权

US08950216B2 Method for manufacturing glass sealed body and method for manufacturing light-emitting device 有权
标题翻译：制造玻璃密封体的方法及其制造方法
公开(公告)号：US08950216B2
公开(公告)日：2015-02-10
申请号：US13468607
申请日：2012-05-10
申请人： Koichiro Tanaka
发明人： Koichiro Tanaka
IPC分类号： C03B23/207 , C03B23/24 , C03C27/06 , H01L51/52 , H01J9/24
CPC分类号： C03C27/06 , H01J9/248 , H01L51/5246
摘要： In a method for manufacturing a glass sealed body, a paste including powdered glass and a binder is discharged from an outlet whose shape is a closed curve to form a partition whose shape is a closed curve over a first glass substrate; the partition is heated so that the binder is volatilized and the powdered glass is fused to be a frit glass; and the frit glass and a second glass substrate are heated while disposing in close contact with each other, so that the frit glass and the second glass substrate are welded together to form a closed space by the frit glass, the first glass substrate, and the second glass substrate. A light-emitting element is sealed with the glass sealed body, so that the sealing is hardly broken even when impact or external force is applied.
摘要翻译：在玻璃密封体的制造方法中，由形状为闭合曲线的出口排出由玻璃粉末和粘合剂构成的糊状物，在第一玻璃基板上形成封闭曲线形状的隔壁; 将隔板加热，使粘合剂挥发，将粉末状玻璃熔融成熔融玻璃; 并且，将熔结玻璃和第二玻璃基板在彼此紧密接触的同时加热，从而将熔结玻璃和第二玻璃基板焊接在一起，以通过熔结玻璃，第一玻璃基板和第二玻璃基板。发光元件用玻璃密封体密封，使得即使施加冲击或外力也不会发生密封。

5. 发明授权

US08896014B2 Light-emitting element, manufacturing method thereof, and lighting device 有权
标题翻译：发光元件及其制造方法以及照明装置
公开(公告)号：US08896014B2
公开(公告)日：2014-11-25
申请号：US13303590
申请日：2011-11-23
申请人： Koichiro Tanaka , Hisao Ikeda , Shunpei Yamazaki
发明人： Koichiro Tanaka , Hisao Ikeda , Shunpei Yamazaki
IPC分类号： H01L33/08 , H01L51/50
CPC分类号： H01L51/50 , H01L2251/5361 , H01L2251/5392 , H01L2251/568
摘要： A light-emitting element includes a conductive layer functioning as a first electrode, an electroluminescent layer, and a conductive layer functioning as a second electrode, and further includes an insulating material filling a defect portion in the electroluminescent layer so that the defect portion is sealed. In the light-emitting element, the conductive layer functioning as a second electrode overlaps with the conductive layer functioning as a first electrode with the electroluminescent layer and the insulating material interposed therebetween and is in contact with a top surface of the electroluminescent layer.
摘要翻译：发光元件包括用作第一电极的导电层，电致发光层和用作第二电极的导电层，并且还包括填充电致发光层中的缺陷部分以使缺陷部分被密封的绝缘材料。在发光元件中，用作第二电极的导电层与用作第一电极的导电层重叠，其中电致发光层和绝缘材料介于其间并且与电致发光层的顶表面接触。

6. 发明授权

US08835800B2 Laser irradiation apparatus and method for manufacturing semiconductor device 有权
标题翻译：激光照射装置及半导体装置的制造方法
公开(公告)号：US08835800B2
公开(公告)日：2014-09-16
申请号：US11389508
申请日：2006-03-27
申请人： Koichiro Tanaka , Yoshiaki Yamamoto
发明人： Koichiro Tanaka , Yoshiaki Yamamoto
IPC分类号： B23K26/00 , H01L21/44 , H01L27/12 , B23K26/08 , B23K26/04 , G02B26/10 , B23K26/073 , G02B27/09
CPC分类号： H01L27/1266 , B23K26/04 , B23K26/0738 , B23K26/083 , B23K26/0869 , G02B26/10 , G02B27/0911 , H01L27/1214 , H01L27/1285
摘要： The present invention provides a laser irradiation apparatus which can accurately control positions of beam spots of laser beams emitted from laser oscillators and the distance between the adjacent beam spots. A laser irradiation apparatus of the present invention includes a first movable stage with an irradiation body provided, two or more laser oscillators emitting laser beams, a plurality of second movable stages with the laser oscillators and optical systems provided, and a means for detecting at least one alignment maker. The first stage and the second stages may move not only in one direction but also in a plurality of directions. Further, the optical systems are to shape the laser beams emitted from the laser oscillators into linear beams on the irradiation surface.
摘要翻译：本发明提供一种可以精确地控制从激光振荡器发射的激光束的光束位置和相邻光束点之间的距离的激光照射装置。本发明的激光照射装置包括具有照射体的第一可动台，发射激光的两个以上的激光振荡器，设有激光振荡器和光学系统的多个第二可动台，以及至少用于检测的装置一个对齐制造商。第一阶段和第二阶段可以不仅在一个方向上而且在多个方向上移动。此外，光学系统将从激光振荡器发射的激光束成形为在照射表面上的线性光束。

7. 发明授权

US08735213B2 Electrode, photoelectric conversion device using the electrode, and manufacturing method thereof 有权
标题翻译：电极，使用该电极的光电转换装置及其制造方法
公开(公告)号：US08735213B2
公开(公告)日：2014-05-27
申请号：US13325166
申请日：2011-12-14
申请人： Yuji Oda , Takashi Hirose , Koichiro Tanaka , Sho Kato , Emi Koezuka
发明人： Yuji Oda , Takashi Hirose , Koichiro Tanaka , Sho Kato , Emi Koezuka
IPC分类号： H01L21/28
CPC分类号： H01L31/022433 , H01L31/035281 , H01L31/18 , Y02E10/50
摘要： A minute electrode, a photoelectric conversion device including the minute electrode, and manufacturing methods thereof are provided. A plurality of parallel groove portions and a region sandwiched between the groove portions are formed in a substrate, and a conductive resin is supplied to the groove portions and the region and is fixed, whereby the groove portions are filled with the conductive resin and the region is covered with the conductive resin. The supplied conductive resin is not expanded outward, and the electrode with a designed width can be formed. Part of the electrode is formed over the region sandwiched between the groove portions, thus, the area of a cross section in the short axis direction can be large, and a low resistance in the long axis direction can be obtained.
摘要翻译：提供微电极，包括微电极的光电转换装置及其制造方法。在基板上形成多个平行的槽部和夹在槽部之间的区域，并且将导电树脂供给到槽部和该区域并被固定，由此槽部填充有导电树脂和区域被导电树脂覆盖。所提供的导电树脂不向外扩张，并且可以形成具有设计宽度的电极。电极的一部分形成在夹在槽部之间的区域上，因此，短轴方向的截面积可以大，并且可以获得长轴方向的低电阻。

8. 发明授权

US08734915B2 Film-formation method and manufacturing method of light-emitting device 有权
标题翻译：发光装置的成膜方法和制造方法
公开(公告)号：US08734915B2
公开(公告)日：2014-05-27
申请号：US12391840
申请日：2009-02-24
申请人： Shunpei Yamazaki , Takahiro Ibe , Takuya Tsurume , Koichiro Tanaka , Satoshi Seo
发明人： Shunpei Yamazaki , Takahiro Ibe , Takuya Tsurume , Koichiro Tanaka , Satoshi Seo
IPC分类号： B05D3/06 , B05D5/12 , C23C14/32 , C23C14/28
CPC分类号： C23C14/28 , C23C14/048 , H01L27/3211 , H01L51/0013 , H01L51/56
摘要： A film-formation method whereby a minute pattern thin film can be formed on a deposition substrate, without provision of a mask between a material and the deposition substrate. Moreover, a light-emitting element is formed by such a film-formation method, and a high-definition light-emitting device can be manufactured. Through a film-formation substrate in which a reflective layer, a light-absorbing layer and a material layer are formed, the light-absorbing layer is irradiated with light, so that a material contained in the material layer is deposited on a deposition substrate which is disposed to face the film-formation substrate. Since the reflective layer is selectively formed, a film to be deposited on the deposition substrate can be selectively formed with a minute pattern reflecting the pattern of the reflective layer. A wet process can be employed for formation of the material layer.
摘要翻译：可以在沉积基板上形成微图案薄膜而不在材料和沉积基板之间设置掩模的成膜方法。此外，通过这样的成膜方法形成发光元件，并且可以制造高清晰度发光器件。通过形成反射层，光吸收层和材料层的成膜基板，对光吸收层照射光，使得包含在材料层中的材料沉积在沉积基板上配置成面对成膜基板。由于选择性地形成反射层，所以可以以反射层的图案的微小图案选择性地形成沉积在沉积基板上的膜。可以采用湿法来形成材料层。

9. 发明授权

US08530788B2 Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device 有权
公开(公告)号：US08530788B2
公开(公告)日：2013-09-10
申请号：US10866802
申请日：2004-06-15
申请人： Koichiro Tanaka , Tomoaki Moriwaka
发明人： Koichiro Tanaka , Tomoaki Moriwaka
IPC分类号： B23K26/00
CPC分类号： H01L21/02592 , B23K26/0604 , B23K26/0608 , B23K26/067 , B23K26/0732 , B23K26/0736 , B23K26/0738 , H01L27/1285
摘要： In the present invention, each laser light emitted from a plurality of lasers is divided, and laser light including at least one laser light that is emitted from a different laser and that has different energy distribution is synthesized with another such laser light, or laser light including at least one laser light that has different energy distribution is synthesized with another such laser light through a convex lens that is set at an angle to the direction each laser light travels, to form laser light having excellent uniformity in energy distribution.

10. 发明授权

US08525075B2 Laser irradiation apparatus 有权
标题翻译：激光照射装置
公开(公告)号：US08525075B2
公开(公告)日：2013-09-03
申请号：US11121000
申请日：2005-05-04
申请人： Koichiro Tanaka
发明人： Koichiro Tanaka
IPC分类号： B23K26/00 , H01L21/324
CPC分类号： B23K26/0732 , B23K26/0622 , B23K26/066 , B23K26/0853 , B23K2101/40 , C30B1/023 , C30B11/005 , C30B11/04 , C30B13/22 , C30B28/08 , C30B29/06 , C30B29/52
摘要： The present invention is to provide a laser irradiation apparatus for forming a laser beam which has a shape required for the annealing and which has homogeneous energy distribution, by providing a slit at an image-formation position of a diffractive optical element, wherein the slit has a slit opening whose length is changeable.The laser irradiation apparatus comprises a laser oscillator, a diffractive optical element, and a slit, wherein the slit has a slit opening whose length in a major-axis direction thereof is changeable, wherein a laser beam is delivered obliquely to a substrate, and wherein the laser beam is a continuous wave solid-state, gas, or metal laser, or a pulsed laser with a repetition frequency of 10 MHz or more.
摘要翻译：本发明提供一种激光照射装置，其通过在衍射光学元件的成像位置设置狭缝，形成具有退火所需形状并具有均匀的能量分布的激光束，其中狭缝具有长度可变的狭缝开口。激光照射装置包括激光振荡器，衍射光学元件和狭缝，其中狭缝具有沿其长轴方向的长度可变的狭缝开口，其中激光束倾斜地被输送到基板，并且其中激光束是连续波固体，气体或金属激光，或重复频率为10MHz以上的脉冲激光。

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