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1. 发明授权

US08963052B2 Method for controlling spatial temperature distribution across a semiconductor wafer 有权
标题翻译：控制跨越半导体晶片的空间温度分布的方法
公开(公告)号：US08963052B2
公开(公告)日：2015-02-24
申请号：US12436443
申请日：2009-05-06
申请人： Neil Benjamin , Robert Steger
发明人： Neil Benjamin , Robert Steger
IPC分类号： H05B3/68 , H01L21/302 , C23C16/00 , H01L21/687 , H01L21/67 , H01L21/683
CPC分类号： H01L21/67248 , H01J37/32724 , H01J2237/2001 , H01J2237/334 , H01L21/67069 , H01L21/67103 , H01L21/6833 , H01L21/68714
摘要： A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base is controlled in operation a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over at least a portion of the temperature-controlled base. The flat support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or mounted to an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently. The heater and flat support have a combined temperature rate change of at least 1° C. per second.
摘要翻译：用于等离子体处理器的卡盘包括温度控制的基座，绝热体，平坦的支架和加热器。温度控制的基座在工作温度下控制在低于工件所需温度的温度。热绝缘体设置在温度受控基底的至少一部分上。平面支撑件保持工件并且设置在绝热体上方。加热器嵌入在平坦支撑件内和/或安装到平坦支撑件的下侧。加热器包括多个加热元件，其加热多个相应的加热区。每个加热元件的供电功率和/或温度都是独立控制的。加热器和平坦支架的组合温度变化率每秒至少1℃。

2. 发明授权

US08528498B2 Integrated steerability array arrangement for minimizing non-uniformity 有权
标题翻译：集成可控性阵列布置，用于最小化不均匀性
公开(公告)号：US08528498B2
公开(公告)日：2013-09-10
申请号：US12145378
申请日：2008-06-24
申请人： Neil Benjamin
发明人： Neil Benjamin
IPC分类号： C23C16/50 , C23C16/503 , C23C16/505 , C23C16/509 , C23C16/455 , C23F1/00 , H01L21/306 , C23C16/06 , C23C16/22
CPC分类号： H05H1/46 , C23C16/45563 , C23C16/505 , C23C16/509 , C23C16/52 , H01J37/32366 , H01J37/3244 , H01J37/32449 , H01J37/32834
摘要： An integrated steerability array arrangement for managing plasma uniformity within a plasma processing environment to facilitate processing of a substrate is provided. The arrangement includes an array of electrical elements. The arrangement also includes an array of gas injectors, wherein the array of electrical elements and the array of gas injectors are arranged to create a plurality of plasma regions, each plasma region of the plurality of plasma regions being substantially similar. The arrangement further includes an array of pumps, wherein individual one of the array of pumps being interspersed among the array of electrical elements and the array of gas injectors. The array of pumps is configured to facilitate local removal of gas exhaust to maintain a uniform plasma region within the plasma processing environment.
摘要翻译：提供了一种用于管理等离子体处理环境中的等离子体均匀性以便于衬底处理的集成可控性阵列布置。该装置包括一组电气元件。该布置还包括气体喷射器阵列，其中电气元件阵列和气体喷射器阵列被布置成产生多个等离子体区域，多个等离子体区域中的每个等离子体区域基本相似。该装置还包括一组泵，其中泵阵列中的单独一个泵散布在电气元件阵列和气体喷射器阵列之间。泵的阵列被配置为便于局部去除气体排气以在等离子体处理环境内保持均匀的等离子体区域。

3. 发明授权

US07254510B2 Smart component-based management techniques in a substrate processing system 有权
标题翻译：基于基于组件的管理技术在基板处理系统中的应用
公开(公告)号：US07254510B2
公开(公告)日：2007-08-07
申请号：US11498544
申请日：2006-08-02
申请人： Neil Benjamin , Richard Alan Gottscho , Nicolas Bright , Robert Steger
发明人： Neil Benjamin , Richard Alan Gottscho , Nicolas Bright , Robert Steger
IPC分类号： G06F19/00
CPC分类号： G01R31/3187 , G05B19/4184 , G05B2219/31362 , G05B2219/31463 , Y02P90/14 , Y02P90/86
摘要： A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.
摘要翻译：公开了一种基板处理系统中的部件管理方法。衬底处理系统具有一组组件，该组组件中的至少多个组件被指定为智能组件，多个组件的每个组件具有智能组件增强（ICE）。该方法包括查询多个组件以从它们各自的ICE请求它们各自的唯一标识数据。该方法还包括如果多个组件中的任何组件响应于查询，则从多个组件接收唯一的标识数据。该方法另外包括：如果在预期第一组件识别数据时多个组件的第一组件不能提供第一组件唯一标识数据，则标记第一组件以用于校正动作。

4. 发明申请

US20060271325A1 Smart component-based management techniques in a substrate processing system 有权
公开(公告)号：US20060271325A1
公开(公告)日：2006-11-30
申请号：US11498544
申请日：2006-08-02
申请人： Neil Benjamin , Richard Gottscho , Nicolas Bright , Robert Steger
发明人： Neil Benjamin , Richard Gottscho , Nicolas Bright , Robert Steger
IPC分类号： G01R31/14
CPC分类号： G01R31/3187 , G05B19/4184 , G05B2219/31362 , G05B2219/31463 , Y02P90/14 , Y02P90/86
摘要： A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components being designated to be smart components, each component of the plurality of components having an intelligent component enhancement (ICE). The method includes querying the plurality of components to request their respective unique identification data from their respective ICEs. The method further includes receiving unique identification data from the plurality of components if any of the plurality of components responds to the querying. The method additionally includes flagging the first component for corrective action if a first component of the plurality of components fails to provide first component unique identification data when the first component identification data is expected.

5. 发明授权

US06901808B1 Capacitive manometer having reduced process drift 有权
标题翻译：电容式压力计具有减少的工艺漂移
公开(公告)号：US06901808B1
公开(公告)日：2005-06-07
申请号：US10361860
申请日：2003-02-11
申请人： Leonard J. Sharpless , Neil Benjamin , Jeffrey W. Fish
发明人： Leonard J. Sharpless , Neil Benjamin , Jeffrey W. Fish
IPC分类号： G01L9/00 , G01L9/12 , G01L19/06
CPC分类号： G01L9/0072 , G01L19/0636
摘要： A capacitive manometer includes a flow passage through which gas can enter the manometer, a deflectable diaphragm, and a filter arranged in the flow passage. The filter is capable of removing condensable vapors from the gas so that the condensable vapors do not reach and deposit on the diaphragm. The capacitive manometer can include a cooling unit arranged to cool the filter so as to enhance removal of condensable vapors from the gas by the filter. The capacitive manometer can include a baffle having gas passages distributed to control distribution of condensable vapors, which pass through the baffle, on the diaphragm.
摘要翻译：电容式压力计包括气体可以进入压力计的流动通道，可偏转的隔膜和布置在流动通道中的过滤器。该过滤器能够从气体中除去可冷凝的蒸汽，使得可冷凝的蒸气不会到达并沉积在隔膜上。电容式压力计可以包括冷却单元，其被布置成冷却过滤器，以便通过过滤器增强从气体中除去可冷凝蒸气。电容式压力计可以包括具有分配用于控制通过隔板的可冷凝蒸气的分布在隔膜上的气体通道的挡板。

6. 发明申请

US20050030524A1 System and method for integrated multi-use optical alignment 有权
标题翻译：用于集成多用途光学对准的系统和方法
公开(公告)号：US20050030524A1
公开(公告)日：2005-02-10
申请号：US10636086
申请日：2003-08-06
申请人： Andrew Perry , Robert Steger , Neil Benjamin
发明人： Andrew Perry , Robert Steger , Neil Benjamin
IPC分类号： G01C1/00 , H01L21/68 , G01B11/26
CPC分类号： G01C1/00 , H01J2237/30438 , H01L21/681
摘要： An optical alignment system for use in a semiconductor processing system is provided. The optical alignment system includes a wafer chuck that has an alignment feature integrated into the top surface of the wafer chuck. In addition, a beam-forming system, which is capable of emitting an optical signal onto the alignment feature, is disposed above the wafer chuck. Also, a detector is included that can detect an amplitude of the optical signal emitted onto the alignment feature. In one aspect, the alignment feature can be a reflective alignment feature that reflects a portion of the optical signal back to the beam detector. In additional aspect, the alignment feature can be a transmittance alignment feature capable of allowing a portion of the optical signal to pass through the wafer chuck to the detector. In this aspect, the detector can be disposed below the wafer chuck.
摘要翻译：提供一种用于半导体处理系统的光学对准系统。光学对准系统包括具有集成到晶片卡盘的顶表面中的对准特征的晶片卡盘。此外，能够将光信号发射到对准特征上的波束形成系统设置在晶片卡盘上方。而且，包括可以检测发射到对准特征上的光信号的幅度的检测器。在一个方面，对准特征可以是将光信号的一部分反射回光束检测器的反射对准特征。在另外的方面，对准特征可以是能够允许光信号的一部分通过晶片卡盘到达检测器的透射率对准特征。在这方面，检测器可以设置在晶片卡盘的下方。

7. 发明授权

US08755204B2 RF isolation for power circuitry 有权
标题翻译：电源电路的射频隔离
公开(公告)号：US08755204B2
公开(公告)日：2014-06-17
申请号：US12603326
申请日：2009-10-21
申请人： Neil Benjamin
发明人： Neil Benjamin
IPC分类号： H02M5/45
CPC分类号： H02M3/335 , H02M7/44
摘要： System and method for providing isolated power to a component that is also subject a set of RF signals that includes at least a first RF signal having a first RF frequency is provided. There is included providing a DC voltage signal and modulating the DC voltage signal into an isolated power signal using an isolation transformer. The isolated power signal has an intermediate frequency that is higher than 60 Hz and lower than the first RF frequency. There is included supplying the DC voltage signal to the primary winding and obtaining the isolated power signal from the secondary winding; and delivering the isolated power to the component using the isolated power signal.
摘要翻译：提供了用于向组件提供隔离功率的系统和方法，所述组件还经受包括至少具有第一RF频率的第一RF信号的一组RF信号。包括提供直流电压信号，并使用隔离变压器将直流电压信号调制成隔离电源信号。隔离电源信号具有高于60Hz并低于第一RF频率的中频。包括向初级绕组提供直流电压信号，并从次级绕组获得隔离的功率信号; 并使用隔离电源信号将隔离电源提供给组件。

8. 发明授权

US08637794B2 Heating plate with planar heating zones for semiconductor processing 有权
标题翻译：加热板采用平面加热区进行半导体加工
公开(公告)号：US08637794B2
公开(公告)日：2014-01-28
申请号：US12582991
申请日：2009-10-21
申请人： Harmeet Singh , Keith Gaff , Neil Benjamin , Keith Comendant
发明人： Harmeet Singh , Keith Gaff , Neil Benjamin , Keith Comendant
IPC分类号： H05B3/10
CPC分类号： H01L21/67103 , C23C14/50 , C23C14/541 , C23C16/4586 , C23C16/46 , C23C16/509 , H01J37/32091 , H01J37/32724 , H01J2237/327 , H01J2237/332 , H01J2237/3321 , H01J2237/3323 , H01J2237/334 , H01J2237/3342 , H01J2237/3343 , H01L21/02274 , H01L21/0262 , H01L21/28556 , H01L21/3065 , H01L21/31116 , H01L21/31138 , H01L21/32136 , H01L21/67109 , H01L21/67248 , H01L21/6831 , H05B1/0233 , H05B3/00 , H05B3/26 , Y10T29/49083 , Y10T29/49099
摘要： A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic or polymer sheets having planar heater zones, power supply lines, power return lines and vias.
摘要翻译：一种用于半导体等离子体处理设备中的基板支撑组件的加热板，包括以可伸缩复用布局布置的多个可独立控制的平面加热器区域，以及用于独立地控制和供电平面加热器区域的电子装置。其中结合加热板的基板支撑组件包括静电夹持电极和温度控制的基板。制造加热板的方法包括将具有平面加热区，电源线，电源返回线和通孔的陶瓷或聚合物片接合在一起。

9. 发明申请

US20110092072A1 HEATING PLATE WITH PLANAR HEATING ZONES FOR SEMICONDUCTOR PROCESSING 有权
标题翻译：具有平面加热区域的加热板用于半导体加工
公开(公告)号：US20110092072A1
公开(公告)日：2011-04-21
申请号：US12582991
申请日：2009-10-21
申请人： Harmeet Singh , Keith Gaff , Neil Benjamin , Keith Comendant
发明人： Harmeet Singh , Keith Gaff , Neil Benjamin , Keith Comendant
IPC分类号： H01L21/3065 , H01C17/00 , H01C17/06 , B05C13/00 , H01L21/306 , C23C14/34
CPC分类号： H01L21/67103 , C23C14/50 , C23C14/541 , C23C16/4586 , C23C16/46 , C23C16/509 , H01J37/32091 , H01J37/32724 , H01J2237/327 , H01J2237/332 , H01J2237/3321 , H01J2237/3323 , H01J2237/334 , H01J2237/3342 , H01J2237/3343 , H01L21/02274 , H01L21/0262 , H01L21/28556 , H01L21/3065 , H01L21/31116 , H01L21/31138 , H01L21/32136 , H01L21/67109 , H01L21/67248 , H01L21/6831 , H05B1/0233 , H05B3/00 , H05B3/26 , Y10T29/49083 , Y10T29/49099
摘要： A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic or polymer sheets having planar heater zones, power supply lines, power return lines and vias.
摘要翻译：一种用于半导体等离子体处理设备中的基板支撑组件的加热板，包括以可伸缩复用布局布置的多个可独立控制的平面加热器区域，以及用于独立地控制和供电平面加热器区域的电子装置。其中结合加热板的基板支撑组件包括静电夹持电极和温度控制的基板。制造加热板的方法包括将具有平面加热区，电源线，电源返回线和通孔的陶瓷或聚合物片接合在一起。

10. 发明申请

US20090149028A1 METHODS AND APPARATUS FOR A HYBRID CAPACITIVELY-COUPLED AND AN INDUCTIVELY-COUPLED PLASMA PROCESSING SYSTEM 有权
标题翻译：混合电容耦合和电感耦合等离子体处理系统的方法和装置
公开(公告)号：US20090149028A1
公开(公告)日：2009-06-11
申请号：US12237179
申请日：2008-09-24
申请人： Alexei Marakhtanov , Eric Hudson , Rajinder Dhindsa , Neil Benjamin
发明人： Alexei Marakhtanov , Eric Hudson , Rajinder Dhindsa , Neil Benjamin
IPC分类号： H01L21/3065
CPC分类号： H01J37/32091 , H01J37/321 , H01J37/3211 , H01J37/32532 , H01J37/3266 , H01J37/32669 , H01J2237/332 , H01J2237/334
摘要： A capacitively-coupled plasma (CCP) processing system having a plasma processing chamber for processing a substrate is provided. The capacitively-coupled Plasma (CCP) processing system includes an upper electrode and a lower electrode for processing the substrate, which is disposed on the lower electrode during plasma processing. The capacitively-coupled Plasma (CCP) processing system also includes an array of inductor coils arrangement configured to inductively sustain plasma in a gap between the upper electrode and the lower electrode.
摘要翻译：提供具有用于处理衬底的等离子体处理室的电容耦合等离子体（CCP）处理系统。电容耦合等离子体（CCP）处理系统包括用于处理衬底的上电极和下电极，其在等离子体处理期间设置在下电极上。电容耦合等离子体（CCP）处理系统还包括电感线圈布置阵列，其被配置为在上电极和下电极之间的间隙中感应维持等离子体。

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