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    • 2. 发明申请
    • DUAL MODE TEMPERATURE TRANSDUCER WITH OXYGEN SATURATION SENSOR
    • 双模温度传感器与氧气饱和传感器
    • US20120283534A1
    • 2012-11-08
    • US13459391
    • 2012-04-30
    • Kenneth L. CarrRobert C. Allison
    • Kenneth L. CarrRobert C. Allison
    • A61B5/01A61B5/1455
    • A61B5/02055A61B5/01A61B5/14553A61B5/6814A61B2562/0233A61F2007/0002A61F2007/0056A61F2007/0095
    • Apparatus for detecting intracranial temperature and blood oxygenation includes a transducer having a working surface for placement against a patient's cranium. The transducer forms a microwave antenna having walls defining an aperture having a pair of opposite broader boundaries and a pair of opposite narrower boundaries at the working surface. The antenna is tuned to a frequency which produces a first output signal indicative of heat emanating from the cranium. An oxygen saturation sensor sharing that aperture includes a radiation emitter located at one of narrower boundaries which directs electromagnetic radiation across the aperture to a radiation detector at the other of the narrower boundaries and which produces a corresponding second output signal. A control unit includes a display and a processor for processing the signals to calculate an intracranial temperature and an oxygen saturation value for display by the control unit.
    • 用于检测颅内温度和血氧的装置包括具有用于放置在患者头颅上的工作表面的换能器。 传感器形成微波天线,其具有限定具有一对较宽边界的孔径的壁和在工作表面处的一对相对较窄的边界。 将天线调谐到产生指示从颅骨发出的热量的第一输出信号的频率。 共享该孔的氧饱和度传感器包括位于较窄边界之一的辐射发射器,其将电磁辐射穿过孔径引导到较窄边界另一个处的辐射检测器,并产生对应的第二输出信号。 控制单元包括显示器和处理器,用于处理信号以计算颅内温度和氧饱和度值以供控制单元显示。
    • 3. 发明授权
    • Method and apparatus for measuring catheter contact force during a medical procedure
    • 用于在医疗过程中测量导管接触力的方法和装置
    • US08206380B2
    • 2012-06-26
    • US12483407
    • 2009-06-12
    • Timothy J. LenihanRobert C. AllisonKenneth L. CarrPeter Van der Sluis
    • Timothy J. LenihanRobert C. AllisonKenneth L. CarrPeter Van der Sluis
    • A61B18/14
    • A61B18/1492A61B18/10A61B18/18A61B90/06A61B2017/00084A61B2017/00243A61B2018/00023A61B2018/00642A61B2018/00791A61B2090/065
    • A method for measuring the contact force exerted on tissue by a probe for heating the tissue and containing an antenna which is connected to a radiometer whose output reading indicates the temperature at depth of the tissue contacted by the probe comprises displaying the output reading of the radiometer, applying sufficient power to the probe to heat the tissue to a selected first temperature that is not lethal to the tissue, moving the probe into contact with the tissue, observing the increase in the displayed temperature reading that occurs when the probe contacts the tissue, and advancing the probe toward the tissue until the displayed temperature reading reaches a value corresponding to a selected tissue contact force. After the probe position in the tissue has stabilized, the applied power to the probe may be increased to heat the tissue to a selected second temperature that is lethal to tissue for a sufficient time to ablate the tissue followed by lowering the tissue heating to a sub-lethal temperature. Apparatus for practicing the method is also disclosed.
    • 一种用于测量由用于加热组织的探针施加在组织上的接触力并包含连接到辐射计的天线的方法,该辐射计的输出读数表示与探头接触的组织的深度处的温度,包括显示辐射计的输出读数 向探头施加足够的功率以将组织加热到对组织不致死的选定的第一温度,使探针与组织接触,观察当探针接触组织时发生的显示温度读数的增加, 并且将探针推向组织直到显示的温度读数达到对应于所选择的组织接触力的值。 在组织中的探针位置已经稳定之后,可以增加对探针的施加的功率,以将组织加热到对组织致死的选定的第二温度足够的时间以消融组织,随后将组织加热降低到亚 致死温度。 还公开了用于实施该方法的装置。
    • 4. 发明授权
    • Micro-electrical-mechanical device and method of making same
    • 微机电装置及其制造方法
    • US07098576B2
    • 2006-08-29
    • US11031950
    • 2005-01-10
    • Robert C. AllisonRon K. NakahiraJoon ParkBrian H. Tran
    • Robert C. AllisonRon K. NakahiraJoon ParkBrian H. Tran
    • H01L41/08
    • H01G5/18H01P1/127H01P11/003
    • A micro-electro-mechanical device including a first substrate; a first contact disposed on a first surface of the substrate; a piezoelectric actuator disposed over the first surface of the substrate; a second contact coupled to the actuator and disposed in proximity to the first contact; a gap control mechanism disposed between the substrate and the actuator for limiting movement of the first contact relative to the second contact. In the exemplary embodiment, the gap control mechanism is a gap control stop constructed of dielectric material. In practice, plural stops are used. In the exemplary embodiment, plural thermosonic bonds are used to connect the actuator to the first substrate. A second substrate is disposed over the piezo-electric actuator. The second substrate has wells over the bonds to facilitate application of a bonding tool to the bonds. The gap control mechanism provides consistent height control between a flipped chip and its base substrate without exposing the assembly to high temperatures.
    • 一种微电子机械装置,包括第一基板; 设置在所述基板的第一表面上的第一触点; 设置在所述基板的所述第一表面上方的压电致动器; 耦合到所述致动器并且设置在所述第一触点附近的第二触点; 间隙控制机构,设置在所述基板和所述致动器之间,用于限制所述第一接触件相对于所述第二接触件的移动。 在示例性实施例中,间隙控制机构是由电介质材料构成的间隙控制止挡件。 实际上,使用多个停止点。 在示例性实施例中,使用多个热声键将致动器连接到第一基板。 第二基板设置在压电致动器的上方。 第二衬底具有超过键的孔,以便于将键合工具应用于键。 间隙控制机构在翻转芯片与其基底之间提供一致的高度控制,而不会使组件暴露于高温。
    • 5. 发明授权
    • Micro electro-mechanical system (MEMS) phase shifter
    • 微机电系统(MEMS)移相器
    • US06958665B2
    • 2005-10-25
    • US10405740
    • 2003-04-02
    • Robert C. AllisonBrian M. Pierce
    • Robert C. AllisonBrian M. Pierce
    • H01P1/12H01Q3/38H01P1/18
    • H01P1/127
    • A micro electro-mechanical system (MEMS) phase shifter for shifting the phase of a radio frequency (RF) signal. The phase shifter includes a quadrature coupler having an input port, an output port, a first load port and a second load port. A first variable reactance is coupled to the first load port and a second variable reactance is coupled the second load port. Each variable reactance has a plurality of reflecting phase shifting elements each having an associated micro electro-mechanical system (MEMS) switching element to individually and selectively couple the reflecting phase shifting element to the appropriate load port.
    • 一种用于移动射频(RF)信号的相位的微机电系统(MEMS)移相器。 移相器包括具有输入端口,输出端口,第一负载端口和第二负载端口的正交耦合器。 第一可变电抗耦合到第一负载端口,第二可变电抗耦合第二负载端口。 每个可变电抗具有多个反射相移元件,每个反射相移元件具有相关联的微机电系统(MEMS)开关元件,以单独地和选择性地将反射相移元件耦合到适当的负载端口。
    • 7. 发明授权
    • Solid state microwave integrated circuit RF insulator-encapsulated
contact installation and removal processes
    • 固态微波集成电路RF绝缘体封装接触安装和拆卸过程
    • US5575417A
    • 1996-11-19
    • US381043
    • 1995-01-31
    • Robert C. AllisonJonathan W. ChanGarrett I. KurogiBrian C. SemmelrothJames C. TonderKenneth S. Varon
    • Robert C. AllisonJonathan W. ChanGarrett I. KurogiBrian C. SemmelrothJames C. TonderKenneth S. Varon
    • B23K1/018B23K1/00
    • B23K1/018B23K2201/40
    • Apparatus and processes for desoldering and soldering an insulator-encapsulated contact using a focused heat source and thermal choke in the form of a soldering iron tip and a contact moat. The desoldering and removal process includes the following steps. Securing the housing to minimize movement thereof. Heating a soldering iron to approximately 825.degree. C. Tinning the tip of the soldering iron with solder and flux. Engaging the contact from the rear using an extraction tool. Disposing flux on the solder joint. Contacting the soldering iron with the contact. Disposing the soldering iron in the moat while outward pressure is exerted with an extraction tool. After a predetermined delay, using the extraction tool to vacuum out the contact, while simultaneously removing the soldering iron and pushing out the contact, whereafter the contact is desoldered and seated in the extraction tool. Removing the contact from the extraction tool and removing the tool from the housing. The soldering or installation process comprises the following steps. Preparing a tinned contact for installation by surrounding its contact pin with teflon sleeves. Disposing flux in a central through hole in the housing. Disposing flux on the solder of the contact. Inserting the contact into the central through hole until one teflon sleeve is engaged therein. Heating a soldering iron to approximately 825.degree. C. Tinning the tip of the soldering iron with solder and flux. Disposing the soldering iron on the contact and pressing the contact into the central through hole. Bottoming out the contact and leaving the soldering iron on the joint for a predetermined time period. Removing the soldering iron and examining the solder joint. Cleaning the solder joint and housing prior to removing the sleeves.
    • 使用聚焦热源和烙铁头和接触护城河形式的热扼流圈来拆焊和焊接绝缘体封装接触的装置和工艺。 拆焊和拆除过程包括以下步骤。 固定外壳以尽量减少其移动。 将烙铁加热至约825℃。用焊剂和助焊剂涂覆烙铁头。 使用提取工具从后面接触触点。 将焊剂置于焊点上。 将烙铁与触点接触。 将烙铁放在护城河中,同时用提取工具施加外力。 在预定的延迟之后,使用提取工具对触点进行抽真空,同时移除烙铁并推出触点,此后接触件脱模并放置在提取工具中。 从提取工具上取下触点并从外壳中取出工具。 焊接或安装过程包括以下步骤。 通过用特氟隆套管围绕其接触针来准备镀锡的触点以进行安装。 将焊剂置于外壳的中心通孔中。 将焊剂置于接触焊料上。 将接触件插入中央通孔,直到一个特氟龙套管接合在其中。 将烙铁加热至约825℃。用焊剂和助焊剂涂覆烙铁头。 将烙铁放在触点上并将触点按压到中央通孔中。 使接触处于底部并将烙铁留在接头上一段预定时间。 拆下烙铁并检查焊点。 在卸下套筒之前清洁焊点和外壳。