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1. 发明申请

US20130003011A1 Lens Film and Manufacturing Method Thereof 审中-公开
标题翻译：镜片胶片及其制造方法
公开(公告)号：US20130003011A1
公开(公告)日：2013-01-03
申请号：US13400163
申请日：2012-02-20
申请人： Tsai-Fu Tsai , Shih-Ming Chen , Yen-Hei Chiang , Chih-Ho Chiu , Hsi-Chien Lin
发明人： Tsai-Fu Tsai , Shih-Ming Chen , Yen-Hei Chiang , Chih-Ho Chiu , Hsi-Chien Lin
IPC分类号： G02F1/13 , B29D11/00
CPC分类号： G02F1/133526 , G02B3/0031 , G02B5/3016 , G02B27/2214 , G02F1/133784 , G02F1/13471 , G02F1/29
摘要： A lens film and a manufacturing method thereof are disclosed. The lens film manufacturing method includes the steps of: forming an alignment film on a glass substrate; rubbing the alignment film along a rubbing direction; dispersing a liquid crystal polymer (LCP) material between the alignment film of the glass substrate and a lens mold; rolling the lens mold along a rolling direction to make the LCP material to form a lens film. A plurality of liquid crystal molecules of the lens film is affected by the alignment film to align along the rubbing direction. The lens film and a base panel having a polarization direction are operated in a LCD apparatus. The angle between the rubbing direction and the polarization direction is less than 15°.
摘要翻译：公开了透镜膜及其制造方法。透镜膜制造方法包括以下步骤：在玻璃基板上形成取向膜; 沿着摩擦方向摩擦取向膜; 将液晶聚合物（LCP）材料分散在玻璃基板的取向膜和透镜模具之间; 沿着滚动方向滚动镜片模具以使LCP材料形成透镜膜。透镜膜的多个液晶分子受到取向膜的影响，沿着摩擦方向排列。透镜膜和具有偏振方向的基板在LCD装置中操作。摩擦方向与偏振方向之间的角度小于15°。

2. 发明申请

US20120325430A1 FIN TYPE HEAT SINK FIXING ASSEMBLY 审中-公开
标题翻译： FIN型散热片固定装置
公开(公告)号：US20120325430A1
公开(公告)日：2012-12-27
申请号：US13164864
申请日：2011-06-21
申请人： Shih-Ming CHEN
发明人： Shih-Ming CHEN
IPC分类号： F28F9/007
CPC分类号： H01L23/3672 , H01L21/4882 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A fin type heat sink includes a heat conducting base, fins, pressing plates and positioning members. The fins are parallely installed with an interval apart from each other on the heat conducting base, and a fixing plate is perpendicularly extended from the bottom of each fin. The fixing plate includes through holes, and the pressing plate is installed corresponding to the fin. Each pressing plate is installed on the fixing plate and has combining holes corresponding to the through holes, and the positioning member is fixed onto the heat conducting base, and the positioning member is passed through the through hole and the combining hole and fixed onto the pressing plate, such that the pressing plate presses the fixing plate flatly onto the heat conducting base. Therefore, heat at the heat conducting base can be conducted to the fins quickly to enhance the thermal conduction effect.
摘要翻译：鳍式散热器包括导热基座，翅片，压板和定位构件。翅片在导热基座上彼此间隔开地平行地安装，并且固定板从每个翅片的底部垂直地延伸。固定板包括通孔，并且压板相对于翅片安装。每个压板安装在固定板上，并具有与通孔相对应的组合孔，定位构件固定在导热基座上，定位构件穿过通孔和组合孔并固定在压制使得压板平板地将固定板压在导热基座上。因此，导热基底处的热量可以快速传导到散热片，以提高导热效果。

3. 发明申请

US20120112329A1 CHIP PACKAGE 有权
标题翻译：芯片包装
公开(公告)号：US20120112329A1
公开(公告)日：2012-05-10
申请号：US13350690
申请日：2012-01-13
申请人： Yu-Lin YEN , Shih-Ming CHEN , Hsi-Chien LIN , Yu-Lung HUANG , Tsang-Yu LIU
发明人： Yu-Lin YEN , Shih-Ming CHEN , Hsi-Chien LIN , Yu-Lung HUANG , Tsang-Yu LIU
IPC分类号： H01L23/495
CPC分类号： H01L31/0203 , H01L23/3114 , H01L23/3171 , H01L23/481 , H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L27/14685 , H01L31/048 , H01L2224/16 , H01L2924/1461 , Y02E10/50 , H01L2924/00
摘要： An embodiment of the invention provides a chip package, which includes: a semiconductor substrate having a device region and a non-device region neighboring the device region; a package layer disposed on the semiconductor substrate; a spacing layer disposed between the semiconductor substrate and the package layer and surrounding the device region and the non-device region; a ring structure disposed between the semiconductor substrate and the package layer, and between the spacing layer and the device region, and surrounding a portion of the non-device region; and an auxiliary pattern including a hollow pattern formed in the spacing layer or the ring structure, a material pattern located between the spacing layer and the device region, or combinations thereof.
摘要翻译：本发明的一个实施例提供了一种芯片封装，其包括：半导体衬底，具有与器件区域相邻的器件区域和非器件区域; 封装层，设置在所述半导体衬底上; 间隔层，设置在所述半导体衬底和所述封装层之间并且围绕所述器件区域和所述非器件区域; 设置在所述半导体衬底和所述封装层之间以及所述间隔层和所述器件区域之间并围绕所述非器件区域的一部分的环形结构; 以及包括形成在间隔层或环结构中的中空图案的辅助图案，位于间隔层和器件区域之间的材料图案，或其组合。

4. 发明申请

US20120056295A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120056295A1
公开(公告)日：2012-03-08
申请号：US13294945
申请日：2011-11-11
申请人： CHIH-PING LIN , Pi-Kuang Chuang , Hung-Li Chang , Shih-Ming Chen , Hsiao-Ying Yang
发明人： CHIH-PING LIN , Pi-Kuang Chuang , Hung-Li Chang , Shih-Ming Chen , Hsiao-Ying Yang
IPC分类号： H01L27/06
CPC分类号： H01L21/823481 , H01L21/823412 , H01L21/823493 , H01L21/823807 , H01L21/823878 , H01L21/823892
摘要： A method for fabricating a semiconductor device is provided. A substrate comprising a P-well is provided. A low voltage device area and a high voltage device area are defined in the P-well. A photoresist layer is formed on the substrate. A photomask comprising a shielding region is provided. The shielding region is corresponded to the high voltage device area. A pattern of the photomask is transferred to the photoresist layer on the substrate by a photolithography process using the photomask. A P-type ion field is formed outside of the high-voltage device area by selectively doping P-type ions into the substrate using the photoresist layer as a mask.
摘要翻译：提供一种制造半导体器件的方法。提供了包括P阱的衬底。在P井中定义了低压装置区域和高压装置区域。在基板上形成光致抗蚀剂层。提供了包括屏蔽区域的光掩模。屏蔽区域对应于高电压设备区域。通过使用光掩模的光刻工艺将光掩模的图案转移到基板上的光致抗蚀剂层。通过使用光致抗蚀剂层作为掩模，通过将P型离子选择性地掺杂到衬底中，在高电压器件区域的外部形成P型离子场。

5. 发明授权

US07863835B2 Flat panel display having backlight module 有权
标题翻译：具有背光模块的平板显示器
公开(公告)号：US07863835B2
公开(公告)日：2011-01-04
申请号：US11747850
申请日：2007-05-11
申请人： Wen-Tsung Lin , Shih-Ming Chen , Ching-Liang Lin
发明人： Wen-Tsung Lin , Shih-Ming Chen , Ching-Liang Lin
IPC分类号： H05B37/00
CPC分类号： H05B41/2822 , H05B41/02
摘要： A display includes a backlight module having elongated lamps. At least a pair of the lamps has a first lamp and a second lamp that are electrically connected in series. The first lamp and the second lamp are spaced apart with at least a third lamp positioned between the first and second lamps.
摘要翻译：显示器包括具有细长灯的背光模块。至少一对灯具有串联电连接的第一灯和第二灯。第一灯和第二灯间隔开至少一个位于第一和第二灯之间的第三灯。

6. 发明申请

US20100022218A1 ADMINISTRATION AND SERVICE SYSTEM FOR WIRELESS TERMINAL DISPLAY DEVICES 审中-公开
标题翻译：无线终端显示设备的管理和服务系统
公开(公告)号：US20100022218A1
公开(公告)日：2010-01-28
申请号：US12201016
申请日：2008-08-29
申请人： Shih-Ming Chen
发明人： Shih-Ming Chen
IPC分类号： H04M1/66
CPC分类号： H04N1/00344 , H04N1/00129 , H04N1/4406 , H04N1/4426 , H04N2201/0055
摘要： An administration and service system for wireless terminal display devices comprises a digital supplier supplying digital images, digital video or digital music; an administration server including a user identity administration system, an authentication and authorization system and a digital content administration system, wherein the administration server exchanges digital data with the digital supplier and transmits the digital data; and a terminal display device, which is a digital electronic product communicating with the administration server via a wireless network and performing data transmission and identity administration. The wireless network is based on a Wi-Fi technology, and the terminal display device may be a digital photo frame. The primary objective of the present invention is to enable a user to administrate contents and transmit the contents to a wireless terminal display.
摘要翻译：无线终端显示设备的管理和服务系统包括提供数字图像，数字视频或数字音乐的数字供应商; 包括用户身份管理系统，认证授权系统和数字内容管理系统的管理服务器，其中管理服务器与数字供应商交换数字数据并发送数字数据; 以及终端显示装置，其是经由无线网络与管理服务器通信并进行数据传输和身份管理的数字电子产品。无线网络基于Wi-Fi技术，并且终端显示设备可以是数字相框。本发明的主要目的是使得用户能够管理内容并将内容发送到无线终端显示器。

7. 发明申请

US20090236665A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090236665A1
公开(公告)日：2009-09-24
申请号：US12177766
申请日：2008-07-22
申请人： Chih-Ping Lin , Pi-Kuang Chuang , Hung-Li Chang , Shih-Ming Chen , Hsiao-Ying Yang , Ya-Sheng Liu
发明人： Chih-Ping Lin , Pi-Kuang Chuang , Hung-Li Chang , Shih-Ming Chen , Hsiao-Ying Yang , Ya-Sheng Liu
IPC分类号： H01L21/336 , H01L29/78 , H01L21/027
CPC分类号： H01L29/7836 , H01L29/0653
摘要： A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor substrate which comprise a first type well and a second type well, and a plurality of junction regions therebetween, wherein each of the junction regions adjoins the first and the second type wells. A gate electrode disposed on the semiconductor substrate and overlies at least two of the junction regions. A source and a drain are in the semiconductor substrate oppositely adjacent to the gate electrode.
摘要翻译：提供半导体器件及其制造方法。半导体器件包括半导体衬底，其包括第一类型阱和第二类型阱以及它们之间的多个结区域，其中每个连接区域邻接第一和第二类型阱。栅电极，设置在半导体衬底上并覆盖至少两个接合区域。源极和漏极在与栅电极相对的半导体衬底中。

8. 发明授权

US07576551B2 Test socket and test board for wafer level semiconductor testing 有权
标题翻译：用于晶圆级半导体测试的测试插座和测试板
公开(公告)号：US07576551B2
公开(公告)日：2009-08-18
申请号：US11902309
申请日：2007-09-20
申请人： Sheng-Feng Lu , Shih-Ming Chen , Chien-Pang Lin , Ming-Hsun Sung
发明人： Sheng-Feng Lu , Shih-Ming Chen , Chien-Pang Lin , Ming-Hsun Sung
IPC分类号： G01R31/26
CPC分类号： G01R1/0408 , G01R1/0466 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2924/15311 , H01L2924/00
摘要： A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.
摘要翻译：公开了一种用于晶片级半导体测试的测试板。测试板包括多根导线和微电子器件; 以及在测试板的上表面上的多个测试插座。每个测试插座包括：基座构件，其构造成用第一组螺钉附接到测试板，其中所述基座构件具有暴露所述底层测试板的一部分的中心开口; 设置在所述基底构件的中心开口内的各向异性导电膜; 待测试的芯片，设置在基底构件的中心开口内的各向异性导电膜上; 以及覆盖所述芯片的盖构件，以第二组螺钉附接到所述基座构件。

9. 发明申请

US20090167993A1 METHOD FOR FORMING OPTICAL COMPENSATING FILMS, OPTICAL COMPENSATING FILMS FORMED THEREBY, STRUCTURE OF OPTICAL COMPENSATING FILMS, AND POLARIZING PLATES 有权
标题翻译：形成光学补偿膜的方法，形成的光学补偿膜，光学补偿膜的结构和极化板
公开(公告)号：US20090167993A1
公开(公告)日：2009-07-02
申请号：US12241324
申请日：2008-09-30
申请人： Chih-Kuang Chen , Shih-Ming Chen , Kun-Tsung Lu , Jia-Chi Huang , Li-Ching Wang
发明人： Chih-Kuang Chen , Shih-Ming Chen , Kun-Tsung Lu , Jia-Chi Huang , Li-Ching Wang
IPC分类号： G02F1/1335 , C08F2/48 , G02B1/08
CPC分类号： G02B5/3083 , G02F1/133634 , G02F2001/133635 , G02F2413/01 , G02F2413/11
摘要： The invention provides a method for forming optical compensating films, including: (a) providing a suspension containing clay; (b) adding a mono-functional acrylic oligomer of formula (I) in the suspension, wherein n1 is 2-25, R1 is C1-10 alkyl or H and R2 is H or CH3; (c) adding a water-soluble polymer in the suspension; (d) adding a bi-functional acrylic oligomer of formula (II) in the suspension, wherein n2 is 3-50, and R3 and R4 independently are H or CH3; (e) after the step (d), drying the suspension to form a film; (f) exposing the film under UV light to cure the film; and (g) stretching the film, wherein the film has only a negative C-plate property before the stretching and has both negative C-plate and positive A-plate properties after the stretching.
摘要翻译：本发明提供一种形成光学补偿膜的方法，包括：（a）提供含有粘土的悬浮液; （b）在悬浮液中加入式（I）的单官能丙烯酸低聚物，其中n1为2-25，R1为C1-10烷基或H，R2为H或CH3; （c）在悬浮液中加入水溶性聚合物; （d）在悬浮液中加入式（II）的双功能丙烯酸低聚物，其中n2为3-50，R3和R4独立地为H或CH3; （e）在步骤（d）之后，干燥悬浮液以形成膜; （f）在UV光下使膜曝光以固化该膜; 和（g）拉伸该膜，其中该膜在拉伸前仅具有负的C-板性质，并且在拉伸后具有负的C-板和正的A板性质。

10. 发明申请

US20090079461A1 Test socket and test board for wafer level semiconductor testing 有权
公开(公告)号：US20090079461A1
公开(公告)日：2009-03-26
申请号：US11902309
申请日：2007-09-20
申请人： Sheng-Feng Lu , Shih-Ming Chen , Chien-Pang Lin , Ming-Hsun Sung
发明人： Sheng-Feng Lu , Shih-Ming Chen , Chien-Pang Lin , Ming-Hsun Sung
IPC分类号： G01R1/04 , G01R31/26
CPC分类号： G01R1/0408 , G01R1/0466 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2924/15311 , H01L2924/00
摘要： A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.

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