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    • 1. 发明申请
    • Abutment structure of semiconductor cell
    • 半导体电池基台结构
    • US20120049948A1
    • 2012-03-01
    • US13064160
    • 2011-03-09
    • Yi-Fon ChenYu-Cheng YangJye-Yuan Lee
    • Yi-Fon ChenYu-Cheng YangJye-Yuan Lee
    • H01L25/00
    • H01L25/00H01L27/0207H01L27/11807H01L2924/0002H01L2924/00
    • An abutment structure comprises a power rail, a ground rail parallel to the power rail, first cells and second cells. An area is defined between the power and the ground rails. A portion of each first and second cell overlaps the power and the ground rails, and another portion thereof is within the area. The first cells are within the abutment structure with original patterns thereof. The second cells respectively has an original pattern and a base pattern being a flip pattern of the original pattern, and are within the area with alternate of the original and the base patterns. The first and the second cells are within the area alternately without overlapping. Alternatively, the first and the second cells may also be within different areas, and the second cells are within different areas respectively with the base pattern and a flip pattern of the base pattern thereof.
    • 邻接结构包括电力轨道,平行于电力轨道的接地轨道,第一单元和第二单元。 在电源和接地导轨之间定义一个区域。 每个第一和第二电池的一部分与功率和接地导轨重叠,并且其另一部分在该区域内。 第一个细胞位于具有其原始图案的邻接结构内。 第二单元分别具有原始图案和基本图案是原始图案的翻转图案,并且在原始图案和基本图案的交替的区域内。 第一和第二电池在该区域内交替地不重叠。 或者,第一和第二单元也可以在不同的区域内,并且第二单元分别在不同的区域内具有基本图案和其基本图案的翻转图案。
    • 4. 发明授权
    • Process for removing particles from reticle
    • 从掩模版去除颗粒的方法
    • US07396418B2
    • 2008-07-08
    • US11747231
    • 2007-05-11
    • Po-Ching LinYu-Cheng Yang
    • Po-Ching LinYu-Cheng Yang
    • B08B7/04
    • G03F1/82G03F1/66
    • A process for removing particles from a reticle is described, wherein the process is performed by using a pellicle particle detector (PPD) and a particle removing tool disposed in front of the PPD as well as fixed to the PPD. The particle removing tool includes at least one gas spray member directed toward a surface of the reticle for removing particles. The process includes steps as follows, step (a) loading the reticle into the PPD through the gas spray member to detect whether the reticle has particles thereon; step (b) ejecting the reticle from the PPD; step (c) turning on the particle removing tool as well as going back to step (a) when particles are detected on the reticle, and ending the particle removal process when no particle is detected on the reticle.
    • 描述了从掩模版中除去颗粒的方法,其中通过使用防护薄膜颗粒检测器(PPD)和设置在PPD前面以及固定到PPD的颗粒去除工具来进行该过程。 颗粒去除工具包括指向掩模版表面的至少一个气体喷射构件,用于去除颗粒。 该方法包括以下步骤,步骤(a)通过气体喷射构件将掩模版加载到PPD中,以检测掩模版是否具有颗粒; 步骤(b)从PPD喷射掩模版; 步骤(c)打开颗粒去除工具,以及当在掩模版上检测到颗粒时返回到步骤(a),并且当在掩模版上没有检测到颗粒时结束颗粒去除过程。
    • 7. 发明授权
    • Light emitting diode device and manufacturing method therof
    • 发光二极管器件及其制造方法
    • US07821026B2
    • 2010-10-26
    • US12230887
    • 2008-09-08
    • Kuo-Hui YuYu-Cheng YangCheng-Ta Kuo
    • Kuo-Hui YuYu-Cheng YangCheng-Ta Kuo
    • H01L33/00
    • H01L33/42H01L33/0079H01L33/32
    • A light-emitting diode (LED) device and manufacturing methods thereof are provided, wherein the LED device comprises a substrate, a first type conductivity semiconductor layer, an active layer, a second type conductivity semiconductor layer, a transparent conductive oxide stack structure, a first electrode, and a second electrode. The first semiconductor layer on the substrate has a first portion and a second portion. The active layer and the second semiconductor layer are subsequently set on the first portion. The transparent conductive oxide stack structure on the second semiconductor layer has at least two resistant interfaces. The first electrode is above the second portion, and the second electrode is above the transparent conductive oxide stack structure.
    • 提供了一种发光二极管(LED)器件及其制造方法,其中LED器件包括衬底,第一类型导电半导体层,有源层,第二类型导电半导体层,透明导电氧化物堆叠结构, 第一电极和第二电极。 衬底上的第一半导体层具有第一部分和第二部分。 有源层和第二半导体层随后设置在第一部分上。 第二半导体层上的透明导电氧化物堆叠结构具有至少两个电阻接口。 第一电极在第二部分之上,第二电极在透明导电氧化物堆叠结构之上。