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    • 3. 发明授权
    • Plane emission type semiconductor laser device and method of manufacturing the same
    • 平面发射型半导体激光器件及其制造方法
    • US07006544B2
    • 2006-02-28
    • US10835692
    • 2004-04-30
    • Yuichi KuromizuHironobu NaruiYoshinori YamauchiYoshiyuki TanakaYoshiaki Watanabe
    • Yuichi KuromizuHironobu NaruiYoshinori YamauchiYoshiyuki TanakaYoshiaki Watanabe
    • H01S5/00
    • B82Y20/00H01S5/0207H01S5/18311H01S5/305H01S5/343H01S2301/166
    • A plane emission type semiconductor laser device includes, on an n-type GaAs stepped substrate, a laminate structure of a lower reflector, a lower clad layer, an active layer, an upper clad layer, an upper reflector, and a p-type contact layer. The stepped substrate includes a circular (100) plane upper level portion, a step portion, and an annular (100) plane lower level portion surrounding the upper level portion with the step portion therebetween. When an AlAs layer is grown as a current confinement layer on the stepped substrate while implanting Si as an n-type impurity into the AlAs layer being grown, the impurity concentration in the AlAs layer on the upper side of the upper level portion is higher than that on the upper side of the step portion, and the oxidation rate of the AlAs layer on the upper side of the upper level portion is lower than that on the upper side of the step portion, so that the progress of oxidation of the AlAs layer on the upper side of the upper level portion is autonomously restrained. By time control of the oxidation reaction of the AlAs layer, it is possible to maintain the circular AlAs layer on the upper side of the upper level portion in an unoxidized state with an accurate shape and an accurate area.
    • 平面发射型半导体激光器件在n型GaAs阶梯式衬底上包括下反射器,下覆层,有源层,上覆层,上反射器和p型接触层的层叠结构 层。 台阶式基板包括圆形(100)平面上部分,台阶部分和围绕上部部分的环形(100)平面下部部分,其间具有台阶部分。 当AlAs层在阶梯状衬底上生长为电流限制层,同时将Si作为n型杂质注入到正在生长的AlAs层中时,上层部分上侧的AlAs层中的杂质浓度高于 在台阶部的上侧,上层部的上侧的AlAs层的氧化速度低于台阶部的上侧的氧化速度,使得AlAs层的氧化进程 在上层部分的上侧被自主地限制。 通过对AlAs层的氧化反应进行时间控制,可以将具有精确形状和准确面积的未上氧化状态的上层部分的上侧的圆形AlAs层维持在一起。
    • 6. 发明申请
    • SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体发光器件及其制造方法
    • US20080173885A1
    • 2008-07-24
    • US11676355
    • 2007-02-19
    • Yuichi Kuromizu
    • Yuichi Kuromizu
    • H01L33/00H01L21/00
    • H01L33/405H01L33/0079
    • A semiconductor light-emitting device includes: a semiconductor layer including a light-emitting region and having an emission surface on its surface; an insulating layer arranged on a surface of the semiconductor layer opposite to; a first metal layer deposited on a surface of the insulating layer opposite to a surface where the semiconductor layer is arranged; a contact portion buried in a part of the insulating layer, the contact portion electrically connecting the semiconductor layer and the first metal layer; and a second metal layer having higher reflectivity with respect to a light-emitting wavelength than the first metal layer, the second metal layer arranged on a surface of the first metal layer opposite to a surface where the insulating layer is arranged, wherein a metal of which the first metal layer is made has higher adhesion to the insulating layer than a metal of which the second layer is made.
    • 半导体发光器件包括:包括发光区域并在其表面上具有发射表面的半导体层; 绝缘层,布置在与所述半导体层相对的表面上; 沉积在绝缘层的与半导体层布置的表面相对的表面上的第一金属层; 埋置在所述绝缘层的一部分中的接触部,所述接触部电连接所述半导体层和所述第一金属层; 以及相对于发光波长具有比第一金属层更高的反射率的第二金属层,所述第二金属层布置在与布置绝缘层的表面相对的第一金属层的表面上,其中金属 与制造第二层的金属相比,制成第一金属层的绝缘层的粘合性更高。