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    • 6. 发明授权
    • Scatterometry method and measurement system for lithography
    • 散光方法和光刻测量系统
    • US08520212B2
    • 2013-08-27
    • US13000212
    • 2009-07-10
    • Willem Marie Julia Marcel CoeneHugo Augustinus Joseph CramerIrwan Dani Setija
    • Willem Marie Julia Marcel CoeneHugo Augustinus Joseph CramerIrwan Dani Setija
    • G01N21/55
    • G01N21/55G03F7/70625
    • Scatterometry method and apparatus are useful in a lithographic apparatus and device manufacturing. A back focal plane diffraction intensity image of a measurement projection system configured to project a radiation beam onto a target portion of a substrate is measured. A beam of radiation having a first wavelength is directed to the substrate. A diffraction image of a zeroth diffraction order and higher order diffraction from a diffraction structure in the substrate is provided. A first layer (4) of the diffractionstructure provides a diffraction image having only a zeroth diffraction order. A second layer (5) has a periodic structure (6a, 6b) configured such that a lowest spatial frequency of the periodic structure is lower than spatial frequencies of interest of the first structure. From the diffraction image originating from diffraction of the radiation beam in both the first and second layer a critical dimension metrology parameter is determined.
    • 散射测定方法和装置在光刻设备和器件制造中是有用的。 测量被配置为将辐射束投影到基板的目标部分上的测量投影系统的后焦平面衍射强度图像。 具有第一波长的辐射束被引导到基板。 提供了衍射图像的零衍射级和衍射结构的基底中的高阶衍射。 衍射结构的第一层(4)提供仅具有零级衍射级的衍射图像。 第二层(5)具有周期性结构(6a,6b),其被配置为使得周期性结构的最低空间频率低于第一结构的感兴趣的空间频率。 从第一和第二层中的辐射束的衍射衍射图像,确定临界尺寸计量参数。
    • 7. 发明申请
    • Scatterometry Method and Measurement System for Lithography
    • 散光方法和光刻测量系统
    • US20110304851A1
    • 2011-12-15
    • US13000212
    • 2009-07-10
    • Willem Marie Julia Marcel CoeneHugo Augustinus Joseph CramerIrwan Dani Setija
    • Willem Marie Julia Marcel CoeneHugo Augustinus Joseph CramerIrwan Dani Setija
    • G01N21/55G03F7/20
    • G01N21/55G03F7/70625
    • Scatterometry method and apparatus are useful in a lithographic apparatus and device manufacturing. A back focal plane diffraction intensity image of a measurement projection system configured to project a radiation beam onto a target portion of a substrate is measured. A beam of radiation having a first wavelength is directed to the substrate. A diffraction image of a zeroth diffraction order and higher order diffraction from a diffraction structure in the substrate is provided. A first layer (4) of the diffractionstructure provides a diffraction image having only a zeroth diffraction order. A second layer (5) has a periodic structure (6a, 6b) configured such that a lowest spatial frequency of the periodic structure is lower than spatial frequencies of interest of the first structure. From the diffraction image originating from diffraction of the radiation beam in both the first and second layer a critical dimension metrology parameter is determined.
    • 散射测定方法和装置在光刻设备和器件制造中是有用的。 测量被配置为将辐射束投影到基板的目标部分上的测量投影系统的后焦平面衍射强度图像。 具有第一波长的辐射束被引导到基板。 提供了衍射图像的零衍射级和衍射结构的基底中的高阶衍射。 衍射结构的第一层(4)提供仅具有零级衍射级的衍射图像。 第二层(5)具有周期性结构(6a,6b),其被配置为使得周期性结构的最低空间频率低于第一结构的感兴趣的空间频率。 从第一和第二层中的辐射束的衍射衍射图像,确定临界尺寸计量参数。