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    • 1. 发明授权
    • Metrology method and apparatus, and device manufacturing method
    • 计量方法和装置以及装置制造方法
    • US08867020B2
    • 2014-10-21
    • US13235902
    • 2011-09-19
    • Hendrik Jan Hidde SmildePatrick Warnaar
    • Hendrik Jan Hidde SmildePatrick Warnaar
    • G03B27/54G03B27/42G03F7/20
    • G03F9/00G03F7/70483G03F7/70633
    • Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating or other structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The position of an image of the component structure varies between measurements, and a first type of correction is applied to reduce the influence on the measured intensities, caused by differences in the optical path to and from different positions. A plurality of structures may be imaged simultaneously within the field of view of the optical system, and each corrected for its respective position. The measurements may comprise first and second images of the same target under different modes of illumination and/or imaging, for example in a dark field metrology application. A second type of correction may be applied to reduce the influence of asymmetry between the first and second modes of illumination or imaging, for example to permit a more accurate overly measurement in a semiconductor device manufacturing process.
    • 公开了用于测量由基板上的光刻工艺形成的目标结构的方法。 目标内的光栅或其他结构小于测量光学系统的照明点和视场。 组件结构的图像的位置在测量之间变化,并且应用第一类型的校正以减少由与来自不同位置的光路的差异引起的对测量的强度的影响。 可以在光学系统的视野内同时成像多个结构,并且每个结构被校正为其各自的位置。 测量可以包括在不同照明和/或成像模式下的相同目标的第一和第二图像,例如在暗场测量应用中。 可以应用第二类型的校正来减少第一和第二照明模式或成像之间的不对称性的影响,例如以允许在半导体器件制造过程中更准确地过度测量。
    • 2. 发明申请
    • Metrology Method and Apparatus, and Device Manufacturing Method
    • 计量方法与装置及装置制造方法
    • US20120242970A1
    • 2012-09-27
    • US13235902
    • 2011-09-19
    • Hendrik Jan Hidde SMILDEPatrick WARNAAR
    • Hendrik Jan Hidde SMILDEPatrick WARNAAR
    • G03B27/32G01N21/95
    • G03F9/00G03F7/70483G03F7/70633
    • Methods are disclosed for measuring target structures formed by a lithographic process on a substrate. A grating or other structure within the target is smaller than an illumination spot and field of view of a measurement optical system. The position of an image of the component structure varies between measurements, and a first type of correction is applied to reduce the influence on the measured intensities, caused by differences in the optical path to and from different positions. A plurality of structures may be imaged simultaneously within the field of view of the optical system, and each corrected for its respective position. The measurements may comprise first and second images of the same target under different modes of illumination and/or imaging, for example in a dark field metrology application. A second type of correction may be applied to reduce the influence of asymmetry between the first and second modes of illumination or imaging, for example to permit a more accurate overly measurement in a semiconductor device manufacturing process.
    • 公开了用于测量由基板上的光刻工艺形成的目标结构的方法。 目标内的光栅或其他结构小于测量光学系统的照明点和视场。 组件结构的图像的位置在测量之间变化,并且应用第一类型的校正以减少由与来自不同位置的光路的差异引起的对测量的强度的影响。 可以在光学系统的视野内同时成像多个结构,并且每个结构被校正为其各自的位置。 测量可以包括在不同照明和/或成像模式下的相同目标的第一和第二图像,例如在暗场测量应用中。 可以应用第二类型的校正来减少第一和第二照明模式或成像之间的不对称性的影响,例如以允许在半导体器件制造过程中更准确地过度测量。
    • 9. 发明授权
    • Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
    • 检测方法和装置,光刻设备,光刻处理单元和器件制造方法
    • US08223347B2
    • 2012-07-17
    • US12822422
    • 2010-06-24
    • Hendrik Jan Hidde SmildeWillem Marie Julia Marcel Coene
    • Hendrik Jan Hidde SmildeWillem Marie Julia Marcel Coene
    • G01N21/47G01B11/00
    • G03F7/70633G03F7/705G03F7/70516
    • A method of determining an overlay error between two successive layers produced by a lithographic process on a substrate, including using the lithographic process to form a calibration structure including a periodic structure of the same pitch on each of the layers, such that an overlaid pair of periodic structures is formed, the structures being parallel, but offset relative to each other by an overlay amount. A spectrum produced by directing a beam of radiation onto the calibration structure is measured and compared with one or more modeled spectra so as to determine values of the grating parameters for the calibration structure from the measured spectrum. The lithographic process is used to form further overlaid periodic structures on the same or one or more subsequent substrates, the determined grating parameter values for the calibration structure being used to determine overlay amounts for the further overlaid periodic structures.
    • 一种确定由光刻工艺在衬底上产生的两个连续层之间的重叠误差的方法,包括使用光刻工艺形成包括在每个层上相同间距的周期性结构的校准结构,使得重叠的一对 形成周期性结构,结构是平行的,但是相对于彼此偏移了重叠量。 测量通过将辐射束引导到校准结构上产生的光谱,并将其与一个或多个建模光谱进行比较,以便根据测量的光谱确定校准结构的光栅参数的值。 光刻工艺用于在相同或一个或多个后续衬底上形成进一步覆盖的周期性结构,所确定的校准结构的光栅参数值用于确定进一步覆盖的周期性结构的重叠量。