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    • 3. 发明授权
    • Semiconductor manufacturing process modules
    • 半导体制造工艺模块
    • US08267632B2
    • 2012-09-18
    • US11876876
    • 2007-10-23
    • Peter van der MeulenChristopher C KileyPatrick D. Pannese
    • Peter van der MeulenChristopher C KileyPatrick D. Pannese
    • H01L21/677
    • H01L21/67184H01L21/67161H01L21/6719
    • A system for processing semiconductor wafers including a plurality of robotic facilities serially joined to each other to form a substantially linear transport chamber through which wafers can be transferred from each facility, wherein the substantially linear transport chamber is sealed to hold a controlled atmosphere and each of the plurality of robotic facilities includes at least one scara robot having three arm links serially coupled to one another and having a substrate holder rotatably coupled at a distal end of the three arm links, the plurality of robot facilities being configured to effect the transfer of wafers through the substantially linear transport chamber via handoff a wafer between neighboring scara robots, and a multi-entry process module coupled to at least one of the plurality of robotic facilities, where each entry of the multi-entry process module is accessed by the at least one of the at least one scara robot.
    • 一种用于处理半导体晶片的系统,其包括彼此串联连接的多个机器人设备,以形成基本上线性的输送室,通过该输送室可以从每个设备转移晶片,其中基本上线性的输送室被密封以保持受控气氛, 所述多个机器人设备包括至少一个scara机器人,其具有彼此串联连接的三个臂链节,并且具有可旋转地联接在所述三个臂链节的远端处的衬底保持架,所述多个机器人设备被配置为实现晶片的转移 通过在相邻的scara机器人之间切换晶片并且耦合到多个机器人设施中的至少一个的多入口处理模块,其中多进入处理模块的每个条目至少被访问至少 至少一个scara机器人之一。