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    • 4. 发明授权
    • VTFT including overlapping electrodes
    • VTFT包括重叠电极
    • US09214560B2
    • 2015-12-15
    • US14198643
    • 2014-03-06
    • Eastman Kodak Company
    • Shelby Forrester NelsonCarolyn Rae EllingerLee William Tutt
    • H01L29/786H01L29/423H01L29/10
    • H01L29/78642H01L29/1037H01L29/42384H01L29/7869
    • A vertical transistor includes a substrate and an electrically conductive gate structure having a top surface and including a reentrant profile. A conformal electrically insulating layer that maintains the reentrant profile is in contact with the electrically conductive gate structure and at least a portion of the substrate. A conformal semiconductor layer that maintains the reentrant profile is in contact with the conformal electrically insulating layer. An electrode that extends into the reentrant profile is in contact with a first portion of the semiconductor layer. Another electrode is vertically spaced apart from the electrode, overlaps a portion of the electrode that extends into the reentrant profile, is in contact with a second portion of the semiconductor material layer over the top surface of the electrically conductive gate structure, and is within the reentrant profile.
    • 垂直晶体管包括基板和具有顶表面并且包括折入轮廓的导电栅极结构。 维持凹凸轮廓的保形电绝缘层与导电栅极结构和衬底的至少一部分接触。 保持凹凸轮廓的保形半导体层与保形电绝缘层接触。 延伸到凹陷轮廓中的电极与半导体层的第一部分接触。 另一个电极与电极垂直间隔开,与延伸到凹陷轮廓中的电极的一部分重叠,与导电栅极结构的顶表面上的半导体材料层的第二部分接触,并且位于 可重入的资料
    • 8. 发明申请
    • DUAL-GATE VTFT
    • 双门VTFT
    • US20160365370A1
    • 2016-12-15
    • US14737577
    • 2015-06-12
    • Eastman Kodak Company
    • Carolyn Rae EllingerShelby Forrester Nelson
    • H01L27/12H01L29/423H01L29/786
    • H01L27/1251H01L29/42384H01L29/78642H01L29/78645H01L29/7869H01L29/78696
    • An electronic device includes an electrically conductive gate structure extending away from a substrate to a top. The top extends beyond an edge to define a reentrant profile. A first conformal dielectric layer is in contact with the gate structure and the substrate. A conformal semiconductor layer is in contact with the conformal dielectric layer. A first electrode is located in contact with a first portion of the semiconductor layer over the top of the gate structure. A second electrode, adjacent to the edge, is located in contact with a second portion of the semiconductor layer, over the substrate and not over the top of the gate structure. A second conformal dielectric layer is on the semiconductor layer in the reentrant profile. A conformal conductive top-gate is on the conformal dielectric layer in the reentrant profile. The first and second electrodes define a semiconductor channel of a dual-gate transistor.
    • 电子器件包括从衬底延伸到顶部的导电栅极结构。 顶部延伸超过边缘以定义可重入的轮廓。 第一共形介电层与栅极结构和衬底接触。 保形半导体层与保形电介质层接触。 第一电极与栅极结构的顶部上的半导体层的第一部分接触。 邻近边缘的第二电极定位成与半导体层的第二部分接触,并且不超过栅极结构的顶部。 第二共形介电层位于半导体层中的折入轮廓中。 共形导电顶栅位于折入轮廓中的保形介质层上。 第一和第二电极限定双栅极晶体管的半导体沟道。
    • 9. 发明授权
    • VTFT with post, cap, and aligned gate
    • VTFT与柱,盖和对齐门
    • US09331205B2
    • 2016-05-03
    • US14198633
    • 2014-03-06
    • Eastman Kodak Company
    • Shelby Forrester NelsonCarolyn Rae Ellinger
    • H01L29/786H01L29/423H01L29/10
    • H01L29/78642H01L29/1037H01L29/42384H01L29/7869
    • A thin film transistor includes a post on a substrate. The post has a height dimension extending away from the substrate to a top, and an edge along the height dimension. A cap covers the top of the post and extends to a distance beyond the edge of the post to define a reentrant profile. A conformal conductive gate layer is located on the edge of the post in the reentrant profile and not over the cap, and includes a portion that extends along the substrate. A conformal insulating layer is on the gate layer in the reentrant profile. A conformal semiconductor layer is on the insulating layer in the reentrant profile. First and second electrodes are located in contact with a first portion of the semiconductor layer over the cap and a second portion of the semiconductor layer not over the post, respectively.
    • 薄膜晶体管包括在基板上的柱。 该柱具有从基板延伸到顶部的高度尺寸和沿着高度尺寸的边缘。 帽盖覆盖柱的顶部并且延伸到距离柱的边缘的距离以定义可重入的轮廓。 共形导电栅极层位于折返轮廓中的柱的边缘上并且不在盖上,并且包括沿着衬底延伸的部分。 保形绝缘层位于折返轮廓中的栅极层上。 保形半导体层位于凹凸轮廓中的绝缘层上。 第一和第二电极分别与帽上的半导体层的第一部分接触并且半导体层的第二部分分别不在柱上。