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    • 3. 发明申请
    • Magnetoresistive Memory Element having a Metal Oxide Tunnel Barrier
    • 具有金属氧化物隧道屏障的磁阻存储元件
    • US20160172582A1
    • 2016-06-16
    • US15043633
    • 2016-02-15
    • Everspin Technologies, Inc.
    • Renu WhigJason JaneskyNicholas RizzoJon SlaughterDimitri Houssameddine
    • H01L43/02H01L43/08H01L43/10H01L27/22
    • H01L43/02B82Y10/00H01L27/222H01L43/08H01L43/10H01L43/12Y10S977/935
    • A magnetoresistive memory array including a plurality of magnetoresistive memory elements wherein each magnetoresistive memory element comprises a free layer including at least one ferromagnetic layer having perpendicular magnetic anisotropy, a fixed layer, and a tunnel barrier, disposed between and in contact with the free and fixed layers. The tunnel barrier includes a first metal-oxide layer, having a thickness between 1 and 10 Angstroms, a second metal-oxide layer, having a thickness between 3 and 6 Angstroms, disposed on the first metal-oxide layer, and a third metal-oxide layer, having a thickness between 3 and 6 Angstroms, disposed over the second metal-oxide layer. In one embodiment, the third metal-oxide layer is in contact with the free layer or fixed layer. The tunnel barrier may also include a fourth metal-oxide layer, having a thickness between 1 and 10 Angstroms, disposed between the second and third metal-oxide layers.
    • 一种包括多个磁阻存储元件的磁阻存储器阵列,其中每个磁阻存储元件包括自由层,该自由层包括至少一个具有垂直磁各向异性的铁磁层,固定层和隧道势垒,该自由层设置在自由和固定 层。 隧道势垒包括设置在第一金属氧化物层上的第一金属氧化物层,其厚度为1至10埃,厚度为3埃至6埃的第二金属氧化物层,以及第三金属氧化物层, 氧化物层,其厚度为3埃至6埃,设置在第二金属氧化物层上。 在一个实施例中,第三金属氧化物层与自由层或固定层接触。 隧道势垒还可以包括设置在第二和第三金属氧化物层之间的厚度在1埃和10埃之间的第四金属氧化物层。