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    • 4. 发明授权
    • Process for making capacitors
    • 制造电容器的工艺
    • US4914547A
    • 1990-04-03
    • US190966
    • 1988-05-06
    • Joseph A. ToroThomas G. JohnsonFred W. Olmsted
    • Joseph A. ToroThomas G. JohnsonFred W. Olmsted
    • H01G2/06H01G4/32H01G13/00
    • H01G2/065H01G13/003H01G4/32Y10T29/435
    • An epoxy-encased wound capacitor suitable for being surface mounted and wave soldered to electronic circuitry, e.g. circuit boards and process for making the epoxy-encased wound capacitor. The wound capacitor is formed from winding together lengths of two bilaminar ribbons. The capacitor is then cured by exposing it to ultrasonic energy according to a predefined ultrasonic profile while at substantially the same time, mechanically pressing the capacitor. Contacts are formed on the capacitor and wire leads attached. Subsequently, the capacitor is placed in a flexible, reusable plastic mold featuring lead guides for precisely spacing the leads of the capacitor. Bubble-free epoxy is poured in the molds and heat cured. The epoxy-encased capacitor, suitable for surface mounting and wave soldering, is then removed from the mold.
    • 适用于表面安装和波焊焊接到电子电路的环氧树脂封装绕组电容器,例如。 电路板和制造环氧树脂包绕电容器的工艺。 卷绕电容器是通过将两个双层带的长度缠绕而形成的。 然后根据预定义的超声波轮廓将电容器暴露于超声波能量,同时在电机上机械地按压电容器来固化电容器。 触点形成在电容器和导线上。 随后,电容器被放置在一个灵活的,可重复使用的塑料模具中,其特征在于引线用于精确地间隔电容器的引线。 将无环氧树脂倒入模具中并加热固化。 然后将适用于表面安装和波峰焊的环氧树脂封装电容器从模具中取出。