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    • 4. 发明授权
    • Transistor with tunneling dust electrode
    • 晶体管与隧道式粉尘电极
    • US07759674B2
    • 2010-07-20
    • US10592664
    • 2005-09-01
    • Yang YangHaruo Kawakami
    • Yang YangHaruo Kawakami
    • H01L51/30
    • H01L51/0504H01L51/0055H01L51/0508H01L51/055
    • A transistor-like electronic device operates somewhat as a triode vacuum tube. Two electrodes (source and drain) sandwich an intermediate layer of organic semiconductor material in which fine metallic particles are dispersed. Due to the fineness and number of the particles, they are close enough to each other that electrons can tunnel from one to the nest, so that a voltage impressed at the edge of the intermediate layer causes current to flow through the dispersed particles, and causes the entire layer to reach the impressed voltage. By varying the impressed voltage, the voltage of the intermediate layer is caused to vary, which controls conduction between the source and drain. By making the particles small, the proportion of open area between the particles remains large so the electrons have room to move around the particles and through the organic material in intermediate layer, allowing high currents to flow through the device.
    • 晶体管状电子器件稍微作为三极管真空管工作。 两个电极(源极和漏极)夹着分散有金属微粒的有机半导体材料的中间层。 由于颗粒的细度和数量,它们彼此足够接近,电子可以从一个隧道到巢穴,使得在中间层的边缘处施加的电压导致电流流过分散的颗粒,并且导致 整个层达到外加电压。 通过改变外加电压,使中间层的电压发生变化,从而控制源极和漏极之间的导通。 通过使颗粒较小,颗粒之间的开放面积比例保持较大,因此电子具有在颗粒周围移动的空间,并通过中间层中的有机材料移动,允许高电流流过该装置。
    • 5. 发明授权
    • Corrosion preventing device for in-pile structures of helium gas-cooled
reactor
    • 氦气冷却反应堆桩内结构防锈装置
    • US4610841A
    • 1986-09-09
    • US582519
    • 1984-02-22
    • Masao YamadaHaruo Kawakami
    • Masao YamadaHaruo Kawakami
    • G21C19/303G21C9/00
    • G21C19/303
    • A corrosion preventing device for use in an in-pile structure of a helium gas-cooled reactor for removing gaseous oxidating components from a primary cooling gas in a pressure vessel of the reactor to thus prevent oxidation of graphite members of the reactor pile. An oxidation product consuming member is provided in series with a primary cooling gas supply pipeline or a bypass pipeline thereof along with a device for heating the oxidation product consuming member. The oxidation product consuming member may be a single cylindrical member or a bundle of rods having a large number of through holes formed therein in a honeycomb pattern in the lengthwise direction thereof or a large number of balls. The material of the oxidation product consuming member should have a high affinity for oxidizing impurities at elevated temperatures. Preferably, the material of the oxidation product consuming member is carbon or graphite.
    • 一种用于氦气冷却反应堆的堆叠结构的防腐蚀装置,用于从反应堆的压力容器中的一级冷却气体中除去气态氧化组分,从而防止反应堆堆石墨的氧化。 与主要冷却气体供应管线或其旁路管道串联地提供氧化产物消耗构件以及用于加热氧化产物消耗构件的装置。 氧化产物消耗部件可以是单个的圆柱形部件或具有在其长度方向上以蜂窝状图案形成的大量通孔的大量的棒或大量的球。 氧化产物消耗部件的材料应在高温下对于氧化杂质具有高亲和力。 优选地,氧化产物消耗部件的材料是碳或石墨。
    • 9. 发明授权
    • Oxide semiconductor, thin-film transistor and method for producing the same
    • 氧化物半导体,薄膜晶体管及其制造方法
    • US07807515B2
    • 2010-10-05
    • US12086628
    • 2007-05-25
    • Hisato KatoHaruo KawakamiNobuyuki SekineKyoko Kato
    • Hisato KatoHaruo KawakamiNobuyuki SekineKyoko Kato
    • H01L21/00H01L21/84
    • H01L29/78693C01G19/006C01P2006/40H01L29/66969
    • Disclosed is an oxide semiconductor having an amorphous structure, wherein higher mobility and reduced carrier concentration are achieved. Also disclosed are a thin film transistor, a method for producing the oxide semiconductor, and a method for producing the thin film transistor. Specifically disclosed is an oxide semiconductor which is characterized by being composed of an amorphous oxide represented by the following a general formula: Inx+1MZny+1SnzO(4+1.5x+y+2z) (wherein M is Ga or Al, 0≦x≦1, −0.2≦y≦1.2, z≧0.4 and 0.5≦(x+y)/z≦3). This oxide semiconductor is preferably subjected to a heat treatment in an oxidizing gas atmosphere after film formation. Also specifically disclosed is a thin film transistor which is characterized by comprising the oxide semiconductor.
    • 公开了具有非晶结构的氧化物半导体,其中实现了更高的迁移率和降低的载流子浓度。 还公开了薄膜晶体管,氧化物半导体的制造方法以及薄膜晶体管的制造方法。 具体公开了一种氧化物半导体,其特征在于由以下通式表示的无定形氧化物组成:Inx + 1MZny + 1SnzO(4 + 1.5x + y + 2z)(其中M为Ga或Al,0≦̸ x&nlE ; 1,-0.2≦̸ y≦̸ 1.2,z≥0.4和0.5≦̸(x + y)/ z≦̸ 3)。 该氧化物半导体优选在成膜后在氧化气体气氛中进行热处理。 还具体公开了一种薄膜晶体管,其特征在于包括氧化物半导体。