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1. 发明授权

US09112035B2 Semiconductor substrate, field-effect transistor, integrated circuit, and method for fabricating semiconductor substrate 有权
标题翻译：半导体衬底，场效晶体管，集成电路以及半导体衬底的制造方法
公开(公告)号：US09112035B2
公开(公告)日：2015-08-18
申请号：US13410872
申请日：2012-03-02
申请人： Hisashi Yamada , Masahiko Hata , Masafumi Yokoyama , Mitsuru Takenaka , Shinichi Takagi , Tetsuji Yasuda , Hideki Takagi , Yuji Urabe
发明人： Hisashi Yamada , Masahiko Hata , Masafumi Yokoyama , Mitsuru Takenaka , Shinichi Takagi , Tetsuji Yasuda , Hideki Takagi , Yuji Urabe
IPC分类号： H01L29/02 , H01L29/786 , H01L21/762 , H01L29/49 , H01L29/51 , H01L29/66
CPC分类号： H01L29/78681 , H01L21/76251 , H01L21/76256 , H01L29/4966 , H01L29/517 , H01L29/66742
摘要： A semiconductor substrate includes a substrate, an insulating layer, and a semiconductor layer. The insulating layer is over and in contact with the substrate. The insulating layer includes at least one of an amorphous metal oxide and an amorphous metal nitride. The semiconductor layer is over and in contact with the insulating layer. The semiconductor layer is formed by crystal growth.
摘要翻译：半导体衬底包括衬底，绝缘层和半导体层。绝缘层在衬底上并与衬底接触。绝缘层包括无定形金属氧化物和无定形金属氮化物中的至少一种。半导体层在绝缘层上方并与之接触。半导体层通过晶体生长形成。

2. 发明授权

US09349918B2 Light emitting element and method for manufacturing same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US09349918B2
公开(公告)日：2016-05-24
申请号：US14232517
申请日：2012-05-25
申请人： Yukio Kashima , Eriko Matsuura , Hiromi Nishihara , Takaharu Tashiro , Takafumi Ookawa , Hideki Hirayama , Sachie Fujikawa , Sung Won Youn , Hideki Takagi , Ryuichiro Kamimura , Yamato Osada
发明人： Yukio Kashima , Eriko Matsuura , Hiromi Nishihara , Takaharu Tashiro , Takafumi Ookawa , Hideki Hirayama , Sachie Fujikawa , Sung Won Youn , Hideki Takagi , Ryuichiro Kamimura , Yamato Osada
IPC分类号： H01L29/15 , H01L33/32 , H01L33/20 , H01L21/66 , H01L33/44
CPC分类号： H01L33/32 , H01L22/12 , H01L33/20 , H01L33/44 , H01L2933/0083
摘要： A semiconductor light emitting element including, in a light extraction layer thereof, a photonic crystal periodic structure including two systems (structures) with different refractive indices. An interface between the two systems (structures) satisfies Bragg scattering conditions, and the photonic crystal periodic structure has a photonic band gap.
摘要翻译：一种半导体发光元件，在其光提取层中包括具有不同折射率的两个系统（结构）的光子晶体周期性结构。两个系统（结构）之间的界面满足布拉格散射条件，光子晶体周期结构具有光子带隙。

3. 发明授权

US08608048B2 Room-temperature bonding method and room-temperature bonding apparatus including sputtering 有权
标题翻译：室温接合方法和包括溅射的室温接合装置
公开(公告)号：US08608048B2
公开(公告)日：2013-12-17
申请号：US13102778
申请日：2011-05-06
申请人： Takayuki Goto , Jun Utsumi , Kensuke Ide , Hideki Takagi , Masahiro Funayama
发明人： Takayuki Goto , Jun Utsumi , Kensuke Ide , Hideki Takagi , Masahiro Funayama
IPC分类号： B23K20/00 , B23K20/08 , B23K37/00
CPC分类号： H01L21/2007 , B23K20/02 , B23K20/16 , B23K20/24 , B23K2101/36 , C23C14/16 , C23C14/3464 , C23C14/46
摘要： A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
摘要翻译：一种经由中间构件将多个基板室温接合的方法包括：通过物理地溅射多个靶材，在所述基板的待结合面上形成中间部件; 并通过离子束激活待结合的表面。在这种情况下，优选由多种材料构成的靶物质溅射。由于中间构件的材料从从基板的待粘合表面排列在各个方向上的多个靶溅射，所以中间构件可以均匀地形成在待粘合的表面上。此外，由于中间构件由多种材料组成，所以当中间构件由单一材料构成时难以粘合的基板的室温结合可以在不加热和过度压制基板的情况下进行粘接。

4. 发明申请

US20060220233A1 Electronic component mounting package and package assembled substrate 有权
标题翻译：电子元件安装封装和封装组装基板
公开(公告)号：US20060220233A1
公开(公告)日：2006-10-05
申请号：US11389330
申请日：2006-03-27
申请人： Hideki Ito , Masanori Hongo , Masami Fukuyama , Hiroyuki Taguchi , Hideki Takagi
发明人： Hideki Ito , Masanori Hongo , Masami Fukuyama , Hiroyuki Taguchi , Hideki Takagi
IPC分类号： H01L23/34
CPC分类号： H05K3/3442 , H01L21/4857 , H01L23/15 , H01L23/49805 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H05K2201/09472 , H05K2201/09845 , H05K2201/10106 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.
摘要翻译：本发明的封装具有多个陶瓷层的叠层结构，并且包括用于容纳发光元件的空腔。安装表面限定在与空腔的深度方向平行的侧表面上。在安装面和与安装面垂直的两个侧面的交点形成的两个角处，在层叠方向的整个长度上形成有一对包含带电电极部分和涂覆电极部分的外部电极。当安装封装时，将一对充电电极部分和一对涂覆的电极部分焊接到基板的表面。

5. 发明授权

US08602289B2 Room temperature bonding using sputtering 有权
标题翻译：使用溅射进行室温接合
公开(公告)号：US08602289B2
公开(公告)日：2013-12-10
申请号：US12438346
申请日：2007-09-06
申请人： Takayuki Goto , Jun Utsumi , Kensuke Ide , Hideki Takagi , Masahiro Funayama
发明人： Takayuki Goto , Jun Utsumi , Kensuke Ide , Hideki Takagi , Masahiro Funayama
IPC分类号： B23K20/12 , B23K31/02 , B23K1/20 , C23C14/00
CPC分类号： H01L21/2007 , B23K20/02 , B23K20/16 , B23K20/24 , B23K2101/36 , C23C14/16 , C23C14/3464 , C23C14/46
摘要： A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. Preferably, the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
摘要翻译：一种经由中间构件将多个基板室温接合的方法包括：通过物理地溅射多个靶材，在所述基板的待结合面上形成中间部件; 并通过离子束激活待结合的表面。优选地，物理地溅射由多种类型的材料构成的靶。由于中间构件的材料从从基板的待粘合表面排列在各个方向上的多个靶溅射，所以中间构件可以均匀地形成在待粘合的表面上。此外，由于中间构件由多种材料组成，所以当中间构件由单一材料构成时难以粘合的基板的室温结合可以在不加热和过度压制基板的情况下进行粘接。

6. 发明授权

US08099982B2 Method of molding glass parts and molding apparatus 有权
标题翻译：玻璃部件和成型设备的成型方法
公开(公告)号：US08099982B2
公开(公告)日：2012-01-24
申请号：US12531815
申请日：2008-03-26
申请人： Hideki Takagi , Masaharu Takahashi , Ryutaro Maeda , Shinichi Miyazawa
发明人： Hideki Takagi , Masaharu Takahashi , Ryutaro Maeda , Shinichi Miyazawa
IPC分类号： C03B11/00 , B29D11/00
CPC分类号： C03B11/082 , C03B2215/07 , C03B2215/10 , C03B2215/17 , C03C23/008 , Y02P40/57 , Y10T428/265
摘要： A molding apparatus of a glass material according to the present invention is characterized by containing means for holding a glass material and a molding die in contact with each other, means for heating the glass material and the molding die, and means for applying a voltage across the glass material and the molding die, in which press-molding is performed by electrostatic attraction acting between a surface of the glass material and a surface of the molding die. Further, a molded product of a glass material according to the present invention is characterized by including an alkali metal as a component, in which a concentration of the alkali metal is lowered in vicinity of a surface to be molded as compared with that of a glass base material.
摘要翻译：根据本发明的玻璃材料的成型装置的特征在于包含用于保持彼此接触的玻璃材料和模制模具的装置，用于加热玻璃材料和模制模具的装置，以及用于施加电压的装置玻璃材料和成型模具，其中通过在玻璃材料的表面和成型模具的表面之间进行静电吸引来进行加压成型。此外，根据本发明的玻璃材料的成型体的特征在于，与玻璃相比，含有碱金属作为成分的成分，其中碱金属的浓度在待模制的表面附近降低基材。

7. 发明申请

US20100112341A1 METHOD OF MOLDING GLASS PARTS, MOLDING APPARATUS, AND MOLDED PRODUCT OF GLASS MATERIAL 有权
标题翻译：玻璃部件成型方法，成型设备和玻璃材料成型产品
公开(公告)号：US20100112341A1
公开(公告)日：2010-05-06
申请号：US12531815
申请日：2008-03-26
申请人： Hideki Takagi , Masaharu Takahashi , Ryutaro Maeda , Shinichi Miyazawa
发明人： Hideki Takagi , Masaharu Takahashi , Ryutaro Maeda , Shinichi Miyazawa
IPC分类号： B32B5/00 , C03B11/00 , B32B17/06
CPC分类号： C03B11/082 , C03B2215/07 , C03B2215/10 , C03B2215/17 , C03C23/008 , Y02P40/57 , Y10T428/265
摘要： In order to solve problems involved in micromolding of a glass, according to the present invention, there can be provided a technology for enabling molding of a glass without applying a large load.A molding apparatus of a glass material according to the present invention is characterized by containing means for holding a glass material and a molding die in contact with each other, means for heating the glass material and the molding die, and means for applying a voltage across the glass material and the molding die, in which press-molding is performed by electrostatic attraction acting between a surface of the glass material and a surface of the molding die. Further, a molded product of a glass material according to the present invention is characterized by including an alkali metal as a component, in which a concentration of the alkali metal is lowered in vicinity of a surface to be molded as compared with that of a glass base material.
摘要翻译：为了解决玻璃微成型所涉及的问题，根据本发明，可以提供一种能够在不施加大负荷的情况下成型玻璃的技术。根据本发明的玻璃材料的成型装置的特征在于包含用于保持彼此接触的玻璃材料和模制模具的装置，用于加热玻璃材料和模制模具的装置，以及用于施加电压的装置玻璃材料和成型模具，其中通过在玻璃材料的表面和成型模具的表面之间进行静电吸引来进行加压成型。此外，根据本发明的玻璃材料的成型体的特征在于，与玻璃相比，含有碱金属作为成分的成分，其中碱金属的浓度在待模制的表面附近降低基材。

8. 发明授权

US06509633B1 IC package capable of accommodating discrete devices 失效
标题翻译： IC封装能够容纳分立器件
公开(公告)号：US06509633B1
公开(公告)日：2003-01-21
申请号：US09545409
申请日：2000-04-07
申请人： Hideki Takagi
发明人： Hideki Takagi
IPC分类号： H01L2302
CPC分类号： H01L23/057 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An IC (Integrated Circuit) package includes a package body having a cavity formed for receiving an IC chip therein. A terrace protrudes from at least part of the edges defining the cavity into the cavity. Discrete devices can be mounted on the terrace, i.e., inside the IC package. With this configuration, the IC package insures the stable operation of a high-frequency IC circuit.
摘要翻译： IC（集成电路）封装包括具有形成为用于在其中接收IC芯片的空腔的封装体。露台从限定空腔的至少一部分边缘凸出到空腔中。分立器件可以安装在露台上，即IC封装内部。利用这种配置，IC封装确保高频IC电路的稳定操作。

9. 发明授权

US06280802B1 Method of forming film of ultrafine particles 有权
标题翻译：形成超微粒膜的方法
公开(公告)号：US06280802B1
公开(公告)日：2001-08-28
申请号：US09360450
申请日：1999-07-26
申请人： Jun Akedo , Hideki Takagi
发明人： Jun Akedo , Hideki Takagi
IPC分类号： B05D102
CPC分类号： C23C4/12 , C23C4/02 , C23C4/134 , C23C24/04
摘要： A method of forming a film of ultrafine particles includes the steps of accelerating ultrafine particles within a vacuum chamber to cause them to collide with a substrate and be deposited, and, at least before said ultrafine particles collide with said substrate, irradiating the ultrafine particles and the substrate with an ionic, atomic or molecular beam or low-temperature plasma or other high-speed, high-energy beam of high-energy atoms or molecules, whereby the surfaces of the ultrafine particles and substrate are activated without being fused, thus promoting bonding between said ultrafine particles and substrate or between the ultrafine particles to form a dense deposit that has good film properties and good adhesion to the substrate while maintaining the crystal properties of the ultrafine particles.
摘要翻译：形成超微粒子膜的方法包括以下步骤：在真空室内加速超细颗粒，使其与基材碰撞并沉积，并且至少在所述超细颗粒与所述基材碰撞之前，照射超细颗粒和具有离子，原子或分子束或低温等离子体或其他高能量高能量高能原子或分子束的衬底，由此超微粒子和衬底的表面被激活而不被熔化，从而促进在所述超微粒子与基底之间或超微粒子之间键合，形成致密的沉积物，其具有良好的膜性能和对基底的良好粘附性，同时保持超微粒子的晶体性质。

10. 发明授权

US08936998B2 Manufcaturing method for room-temperature substrate bonding 有权
标题翻译：室温基板粘合的制造方法
公开(公告)号：US08936998B2
公开(公告)日：2015-01-20
申请号：US13797521
申请日：2013-03-12
申请人： Jun Utsumi , Takayuki Goto , Kensuke Ide , Hideki Takagi , Masahiro Funayama
发明人： Jun Utsumi , Takayuki Goto , Kensuke Ide , Hideki Takagi , Masahiro Funayama
IPC分类号： H01L21/30 , H01L21/302 , H01L21/324 , H01L21/20 , H01L23/00 , H01L31/0203
CPC分类号： H01L21/2007 , C03C27/06 , H01L24/28 , H01L24/31 , H01L24/75 , H01L24/83 , H01L31/0203 , H01L33/0079 , H01L2224/83099 , H01L2224/8385 , H01L2224/83894 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01033 , H01L2924/0104 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/07802 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/3512 , H01L2924/00
摘要： A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.
摘要翻译：一种器件设置有：主要包含二氧化硅的第一衬底; 主要含有硅，化合物半导体，二氧化硅或氟化物的第二衬底; 以及布置在所述第一基板和所述第二基板之间的接合功能中间层。通过室温接合将第一衬底接合到第二衬底，其中第一衬底的溅射的第一表面经由接合功能中间层与第二衬底的溅射的第二表面接触。这里，接合功能中间层的材料选自氧化物，氟化物或氮化物的光学透明材料，该材料不同于第一衬底的主要成分并且不同于第二衬底的主要成分。

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