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    • 3. 发明授权
    • Sharing conversion board for testing chips
    • 分享转换板进行芯片测试
    • US07688093B2
    • 2010-03-30
    • US12153728
    • 2008-05-23
    • Hsuan-Chung KoChen-Yang Hsieh
    • Hsuan-Chung KoChen-Yang Hsieh
    • G01R31/02
    • G01R31/2889
    • The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig. The device interface board comprises a chip test area and a second public signal area, in which the chip test area is used to carry a chip under test and is electrically connected with the second public signal area, whereby, through electrical connection between the device interface board and the first public signal area of each of the plurality of probe cards, test signals are transferred between the testing jig and the chip under test, and testing of chips under test having the same model are accomplished between different testing jigs.
    • 本发明涉及一种用于测试芯片的设备接口板,其与多个探针卡中的一个配合地安装。 多个探针卡中的每一个具有指定的布线区域和第一公共信号区域,所述指定布线区域与第一公共信号区域电连接。 多个探针卡中的每一个的第一公共信号区域位于相同的特定区域中,并且多个探针卡中的每一个的指定布线区域与测试夹具电连接,并且根据不同的测试夹具而不同 。 设备接口板包括芯片测试区域和第二公共信号区域,其中芯片测试区域用于承载被测芯片并且与第二公共信号区域电连接,由此通过设备接口之间的电连接 板和每个探针卡的第一公共信号区域,测试信号在测试夹具和被测芯片之间传递,并且在不同测试夹具之间实现具有相同模型的芯片的测试。
    • 5. 发明申请
    • Sharing conversion board for testing chips
    • 分享转换板进行芯片测试
    • US20090153162A1
    • 2009-06-18
    • US12153728
    • 2008-05-23
    • Hsuan-Chung KoChen-Yang Hsieh
    • Hsuan-Chung KoChen-Yang Hsieh
    • G01R1/073
    • G01R31/2889
    • The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig. The device interface board comprises a chip test area and a second public signal area, in which the chip test area is used to carry a chip under test and is electrically connected with the second public signal area, whereby, through electrical connection between the device interface board and the first public signal area of each of the plurality of probe cards, test signals are transferred between the testing jig and the chip under test, and testing of chips under test having the same model are accomplished between different testing jigs.
    • 本发明涉及一种用于测试芯片的设备接口板,其与多个探针卡中的一个配合地安装。 多个探针卡中的每一个具有指定的布线区域和第一公共信号区域,所述指定布线区域与第一公共信号区域电连接。 多个探针卡中的每一个的第一公共信号区域位于相同的特定区域中,并且多个探针卡中的每一个的指定布线区域与测试夹具电连接,并且根据不同的测试夹具而不同 。 设备接口板包括芯片测试区域和第二公共信号区域,其中芯片测试区域用于承载被测芯片并且与第二公共信号区域电连接,由此通过设备接口之间的电连接 板和每个探针卡的第一公共信号区域,测试信号在测试夹具和被测芯片之间传递,并且在不同测试夹具之间实现具有相同模型的芯片的测试。
    • 6. 发明申请
    • RF CHIP TEST METHOD
    • 射频芯片测试方法
    • US20100123475A1
    • 2010-05-20
    • US12356481
    • 2009-01-20
    • Hsuan-Chung KoHsiu-Ju Chen
    • Hsuan-Chung KoHsiu-Ju Chen
    • G01R31/02
    • G01R31/2822G01R27/04G01R31/043
    • An RF chip test method is disclosed. The RF chip test method includes disposing an RF chip within a chip socket, with the RF chip having at least one RF pin and at least one non-RF pin, the chip socket having conductive elements, and the conductive elements contacting the RF pin and the non-RF pin; connecting the non-RF pin to a ground end and connecting the RF pin to an RF measuring instrument; measuring a S11 parameter of the RF pin using the RF measuring instrument; and comparing the S11 parameter with an allowable range so as to judge the contact condition between the RF pin and the conductive element.
    • 公开了RF芯片测试方法。 RF芯片测试方法包括将RF芯片设置在芯片插座内,RF芯片具有至少一个RF引脚和至少一个非RF引脚,芯片插座具有导电元件,导电元件接触RF引脚和 非RF引脚; 将非RF引脚连接到接地端,并将RF引脚连接到RF测量仪器; 使用RF测量仪器测量RF引脚的S11参数; 并且将S11参数与允许范围进行比较,以便判断RF引脚和导电元件之间的接触状态。
    • 7. 发明授权
    • Method and apparatus for improving yield ratio of testing
    • 提高试验屈服比的方法和装置
    • US08193819B2
    • 2012-06-05
    • US12610270
    • 2009-10-30
    • Wei-Ping WangHsuan-Chung Ko
    • Wei-Ping WangHsuan-Chung Ko
    • G01R27/28
    • G01R31/2894G01R31/2879
    • A method and apparatus for improving yield ratio of testing are disclosed. The method includes the following steps. First of all, devices are tested and electromagnetic interference is measured. Next, the test results are examined for whether the devices pass the test or not. Then, electromagnetic interference data are examined for whether the electromagnetic interference data are over a predetermined standard if the devices fail the test. The above-mentioned steps are performed again if the electromagnetic interference data are over a predetermined standard. The test is terminated if the devices still fail the test and the values of electromagnetic interference are still over a predetermined standard.
    • 公开了一种用于提高测试屈服比的方法和装置。 该方法包括以下步骤。 首先,测试设备并测量电磁干扰。 接下来,检查测试结果是否通过测试。 然后,如果设备未通过测试,则检查电磁干扰数据是否超过预定标准。 如果电磁干扰数据超过预定标准,则再次执行上述步骤。 如果设备仍然测试失败并且电磁干扰值仍然超过预定标准,则测试终止。
    • 8. 发明授权
    • RF chip test method
    • RF芯片测试方法
    • US08085059B2
    • 2011-12-27
    • US12356481
    • 2009-01-20
    • Hsuan-Chung KoHsiu-Ju Chen
    • Hsuan-Chung KoHsiu-Ju Chen
    • G01R31/00
    • G01R31/2822G01R27/04G01R31/043
    • An RF chip test method is disclosed. The RF chip test method includes disposing an RF chip within a chip socket, with the RF chip having at least one RF pin and at least one non-RF pin, the chip socket having conductive elements, and the conductive elements contacting the RF pin and the non-RF pin; connecting the non-RF pin to a ground end and connecting the RF pin to an RF measuring instrument; measuring a S11 parameter of the RF pin using the RF measuring instrument; and comparing the S11 parameter with an allowable range so as to judge the contact condition between the RF pin and the conductive element.
    • 公开了RF芯片测试方法。 RF芯片测试方法包括将RF芯片设置在芯片插座内,RF芯片具有至少一个RF引脚和至少一个非RF引脚,芯片插座具有导电元件,导电元件接触RF引脚和 非RF引脚; 将非RF引脚连接到接地端,并将RF引脚连接到RF测量仪器; 使用RF测量仪器测量RF引脚的S11参数; 并且将S11参数与允许范围进行比较,以便判断RF引脚和导电元件之间的接触状态。