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    • 4. 发明授权
    • Three-dimensional memory device and manufacturing method thereof
    • US10475807B2
    • 2019-11-12
    • US15503833
    • 2014-09-25
    • Institute of Microelectronics, Chinese Academy of Sciences
    • Zongliang HuoMing LiuLei Jin
    • H01L27/11578H01L27/11582H01L49/02
    • A method for manufacturing three-dimensional memory, comprising the steps of: forming a stack structure composed of a plurality of first material layers and a plurality of second material layers on a substrate; etching the stack structure to expose the substrate, forming a plurality of first vertical openings; forming a filling layer in each of the first openings; etching the stack structure around each of the first openings to expose the substrate, forming a plurality of second vertical openings; forming a vertical channel layer and a drain in each of the second openings; removing the filling layer by selective etching, re-exposing the first openings; partially or completely removing the second material layers by lateral etching, leaving a plurality of recesses; forming a plurality of gate stack structure in the recesses; forming a plurality of common sources on and/or in the substrate at the bottom of each of the first openings. In accordance with the three-dimensional memory manufacturing method of the present invention, the deep trenches of word-line in the TCAT three-dimensional device are replaced with deep-hole etching to realize the same function, thereby improving the integration density, simplifying the etching process of stacked structure, and maintaining the control performance of the metal gate.
    • 7. 发明授权
    • Sub-wavelength extreme ultraviolet metal transmission grating and manufacturing method thereof
    • 亚波长极紫外金属透射光栅及其制造方法
    • US09442230B2
    • 2016-09-13
    • US14144222
    • 2013-12-30
    • INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
    • Hailiang LiChangqing XieMing LiuDongmei LiLina ShiXiaoli Zhu
    • G06K7/10G02B5/18G03F7/075G03F7/20G03F7/40
    • G02B5/1871G02B5/1809G02B5/1838G02B5/1857G02B2005/1804G03F7/0757G03F7/2059G03F7/40
    • A method of manufacturing a sub-wavelength extreme ultraviolet metal transmission grating is disclosed. In one aspect, the method comprises forming a silicon nitride self-supporting film window on a back surface of a silicon-based substrate having both surfaces polished, then spin-coating a silicon nitride film on a front surface of the substrate with an electron beam resist HSQ. Then, performing electron beam direct writing exposure on the HSQ, developing and fixing to form a plurality of grating line patterns and a ring pattern surrounding the grating line patterns. Then depositing a chrome material on the front surface of the substrate through magnetron sputtering. Then, removing the chrome material inside the ring pattern. Then, growing a gold material on the front surface of the substrate through atomic layer deposition. Lastly, removing the gold material on the chrome material outside the ring pattern as well as on and between the grating line patterns, thereby only retaining the gold material on sidewalls of the grating line patterns.
    • 公开了一种制造亚波长极紫外金属透射光栅的方法。 在一个方面,该方法包括在硅衬底的背表面上形成氮化硅自支撑膜窗,其两面被抛光,然后用电子束在衬底的前表面上旋涂氮化硅膜 抵制HSQ。 然后,在HSQ上执行电子束直接写入曝光,显影和固定以形成围绕光栅线图案的多个光栅线图案和环形图案。 然后通过磁控溅射在基板的前表面上沉积铬材料。 然后,移除环形图案内的铬材料。 然后,通过原子层沉积在基板的前表面上生长金材料。 最后,除去环形图案之外的铬材料上的金材料以及光栅线图案之间和之间的金材料,从而仅将金材料保留在光栅线图案的侧壁上。