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1. 发明授权

US07732232B2 Series interconnected optoelectronic device module assembly 失效
标题翻译：系列互连光电器件组件
公开(公告)号：US07732232B2
公开(公告)日：2010-06-08
申请号：US11865691
申请日：2007-10-01
申请人： James R. Sheats , Sam Kao , Gregory A. Miller , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Gregory A. Miller , Martin R. Roscheisen
IPC分类号： H01L21/00
CPC分类号： H01L31/0392 , H01L27/3204 , H01L31/03925 , H01L31/03928 , H01L31/046 , H01L31/0465 , H01L31/0749 , H01L31/18 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Series interconnection of optoelectronic device modules is disclosed. Each device module includes an active layer disposed between a bottom electrode and a transparent conducting layer. An insulating layer is disposed between the bottom electrode of a first device module and a backside top electrode of the first device module. One or more vias are formed through the active layer, transparent conducting layer and insulating layer of the first device module. Sidewalls of the vias are coated with an insulating material such that a channel is formed through the insulating material to the backside top electrode of the first device module. The channel is at least partially filled with an electrically conductive material to form a plug that makes electrical contact between the transparent conducting layer and the backside top electrode of the first device module. Portions of the backside top electrode and insulating layer of a second device module are cut back to expose a portion of the bottom electrode of the second device module. The first and second device modules are attached to an insulating carrier substrate. Electrical contact is made between the backside top electrode of the first device module and the exposed portion of the bottom electrode of the second device module.
摘要翻译：公开了光电器件模块的串联互连。每个器件模块包括设置在底部电极和透明导电层之间的有源层。绝缘层设置在第一器件模块的底部电极和第一器件模块的背面顶部电极之间。通过第一器件模块的有源层，透明导电层和绝缘层形成一个或多个通孔。通孔的侧壁涂覆有绝缘材料，使得通过绝缘材料形成通道到第一器件模块的背面顶部电极。通道至少部分地填充有导电材料以形成在第一器件模块的透明导电层和背面顶部电极之间形成电接触的插塞。背面顶部电极和第二器件模块的绝缘层的部分被切割以暴露第二器件模块的底部电极的一部分。第一和第二器件模块附接到绝缘载体衬底。在第一器件模块的背面顶部电极和第二器件模块的底部电极的暴露部分之间形成电接触。

2. 发明授权

US07276724B2 Series interconnected optoelectronic device module assembly 有权
标题翻译：系列互连光电器件组件
公开(公告)号：US07276724B2
公开(公告)日：2007-10-02
申请号：US11039053
申请日：2005-01-20
申请人： James R. Sheats , Sam Kao , Gregory A. Miller , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Gregory A. Miller , Martin R. Roscheisen
IPC分类号： H01L29/06 , H01L21/00
CPC分类号： H01L31/0392 , H01L27/3204 , H01L31/03925 , H01L31/03928 , H01L31/046 , H01L31/0465 , H01L31/0749 , H01L31/18 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Series interconnection of optoelectronic device modules is disclosed. Each device module includes an active layer disposed between a bottom electrode and a transparent conducting layer. An insulating layer is disposed between the bottom electrode of a first device module and a backside top electrode of the first device module. One or more vias are formed through the active layer, transparent conducting layer and insulating layer of the first device module. Sidewalls of the vias are coated with an insulating material such that a channel is formed through the insulating material to the backside top electrode of the first device module. The channel is at least partially filled with an electrically conductive material to form a plug that makes electrical contact between the transparent conducting layer and the backside top electrode of the first device module. Portions of the backside top electrode and insulating layer of a second device module are cut back to expose a portion of the bottom electrode of the second device module. The first and second device modules are attached to an insulating carrier substrate. Electrical contact is made between the backside top electrode of the first device module and the exposed portion of the bottom electrode of the second device module.
摘要翻译：公开了光电器件模块的串联互连。每个器件模块包括设置在底部电极和透明导电层之间的有源层。绝缘层设置在第一器件模块的底部电极和第一器件模块的背面顶部电极之间。通过第一器件模块的有源层，透明导电层和绝缘层形成一个或多个通孔。通孔的侧壁涂覆有绝缘材料，使得通过绝缘材料形成通道到第一器件模块的背面顶部电极。通道至少部分地填充有导电材料以形成在第一器件模块的透明导电层和背面顶部电极之间形成电接触的插塞。背面顶部电极和第二器件模块的绝缘层的部分被切割以暴露第二器件模块的底部电极的一部分。第一和第二器件模块附接到绝缘载体衬底。在第一器件模块的背面顶部电极和第二器件模块的底部电极的暴露部分之间形成电接触。

3. 发明申请

US20110121353A1 OPTOELECTRONIC ARCHITECTURE HAVING COMPOUND CONDUCTING SUBSTRATE 失效
标题翻译：具有复合导体基板的光电结构
公开(公告)号：US20110121353A1
公开(公告)日：2011-05-26
申请号：US12952174
申请日：2010-11-22
申请人： James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L33/62 , H01L31/0224
CPC分类号： H01L31/18 , H01L27/3204 , H01L31/0392 , H01L31/03923 , H01L31/03925 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0749 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.
摘要翻译：公开了光电器件模块，阵列光电器件模块和用于制造光电器件模块的方法。器件模块使用具有夹在由柔性体导体制成的底电极和导电背面之间的绝缘体层的起始衬底制成。有源层设置在底部电极和透明导电层之间。通过透明导电层，有源层，柔性体导体和绝缘层形成透明导电层与背面之间的一个或多个电接触。电触点与有源层，底电极和绝缘层电隔离。

4. 发明申请

US20090178706A1 OPTOELECTRONIC ARCHITECTURE HAVING COMPOUND CONDUCTING SUBSTRATE 有权
标题翻译：具有复合导体基板的光电结构
公开(公告)号：US20090178706A1
公开(公告)日：2009-07-16
申请号：US12245734
申请日：2008-10-04
申请人： James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L31/048 , H01L31/0216 , H01L31/042
CPC分类号： H01L31/18 , H01L27/3204 , H01L31/0392 , H01L31/03923 , H01L31/03925 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0749 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.
摘要翻译：公开了光电器件模块，阵列光电器件模块和用于制造光电器件模块的方法。器件模块使用具有夹在由柔性体导体制成的底电极和导电背面之间的绝缘体层的起始衬底制成。有源层设置在底部电极和透明导电层之间。通过透明导电层，有源层，柔性体导体和绝缘层形成透明导电层与背面之间的一个或多个电接触。电触点与有源层，底电极和绝缘层电隔离。

5. 发明申请

US20080308148A1 Photovoltaic Devices With Conductive Barrier Layers and Foil Substrates 失效
标题翻译：具有导电阻挡层和箔基板的光伏器件
公开(公告)号：US20080308148A1
公开(公告)日：2008-12-18
申请号：US12064031
申请日：2006-08-16
申请人： Craig R. Leidholm , Brent Bollman , James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： Craig R. Leidholm , Brent Bollman , James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L31/00
CPC分类号： B82Y10/00 , H01L31/022425 , H01L31/02245 , H01L31/03928 , H01L31/046 , H01L31/0465 , H01L31/0512 , H01L31/0749 , H01L51/5203 , H01L2251/5338 , H02S20/23 , Y02B10/12 , Y02E10/541 , Y02P70/521
摘要： Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.
摘要翻译：为在箔基片上形成的吸收层提供了方法和装置。在一个实施例中，制造光伏器件的方法可以包括提供包括至少一个导电铝箔衬底，至少一个导电扩散阻挡层和在扩散阻挡层上方的至少一个导电电极层的衬底。扩散阻挡层可以防止铝箔衬底和电极层之间的化学相互作用。可以在基板上形成吸收层。在一个实施例中，吸收层可以是非硅吸收层。在另一个实施例中，吸收层可以是非晶硅（掺杂或未掺杂）吸收层。任选地，吸收层可以基于有机和/或无机材料。

6. 发明授权

US08525152B2 Formation of solar cells with conductive barrier layers and foil substrates 失效
标题翻译：形成具有导电阻挡层和箔基板的太阳能电池
公开(公告)号：US08525152B2
公开(公告)日：2013-09-03
申请号：US12795594
申请日：2010-06-07
申请人： Craig Leidholm , Brent Bollman , James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： Craig Leidholm , Brent Bollman , James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L29/06 , H01L21/00
CPC分类号： B82Y10/00 , H01L31/022425 , H01L31/02245 , H01L31/03928 , H01L31/046 , H01L31/0465 , H01L31/0512 , H01L31/0749 , H01L51/5203 , H01L2251/5338 , H02S20/23 , Y02B10/12 , Y02E10/541 , Y02P70/521
摘要： Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.
摘要翻译：为在箔基片上形成的吸收层提供了方法和装置。在一个实施例中，制造光伏器件的方法可以包括提供包括至少一个导电铝箔衬底，至少一个导电扩散阻挡层和在扩散阻挡层上方的至少一个导电电极层的衬底。扩散阻挡层可以防止铝箔衬底和电极层之间的化学相互作用。可以在基板上形成吸收层。在一个实施例中，吸收层可以是非硅吸收层。在另一个实施例中，吸收层可以是非晶硅（掺杂或未掺杂）吸收层。任选地，吸收层可以基于有机和/或无机材料。

7. 发明授权

US08309949B2 Optoelectronic architecture having compound conducting substrate 失效
标题翻译：具有复合导电衬底的光电架构
公开(公告)号：US08309949B2
公开(公告)日：2012-11-13
申请号：US12952174
申请日：2010-11-22
申请人： James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L29/06 , H01L21/00
CPC分类号： H01L31/18 , H01L27/3204 , H01L31/0392 , H01L31/03923 , H01L31/03925 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0749 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.
摘要翻译：公开了光电器件模块，阵列光电器件模块和用于制造光电器件模块的方法。器件模块使用具有夹在由柔性体导体制成的底电极和导电背面之间的绝缘体层的起始衬底制成。有源层设置在底部电极和透明导电层之间。通过透明导电层，有源层，柔性体导体和绝缘层形成透明导电层与背面之间的一个或多个电接触。电触点与有源层，底电极和绝缘层电隔离。

8. 发明授权

US08198117B2 Photovoltaic devices with conductive barrier layers and foil substrates 失效
标题翻译：具有导电阻挡层和箔基板的光伏器件
公开(公告)号：US08198117B2
公开(公告)日：2012-06-12
申请号：US12064031
申请日：2006-08-16
申请人： Craig R. Leidholm , Brent Bollman , James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： Craig R. Leidholm , Brent Bollman , James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L21/02
CPC分类号： B82Y10/00 , H01L31/022425 , H01L31/02245 , H01L31/03928 , H01L31/046 , H01L31/0465 , H01L31/0512 , H01L31/0749 , H01L51/5203 , H01L2251/5338 , H02S20/23 , Y02B10/12 , Y02E10/541 , Y02P70/521
摘要： Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.
摘要翻译：为在箔基片上形成的吸收层提供了方法和装置。在一个实施例中，制造光伏器件的方法可以包括提供包括至少一个导电铝箔衬底，至少一个导电扩散阻挡层和在扩散阻挡层上方的至少一个导电电极层的衬底。扩散阻挡层可以防止铝箔衬底和电极层之间的化学相互作用。可以在基板上形成吸收层。在一个实施例中，吸收层可以是非硅吸收层。在另一个实施例中，吸收层可以是非晶硅（掺杂或未掺杂）吸收层。任选地，吸收层可以基于有机和/或无机材料。

9. 发明授权

US07919337B2 Optoelectronic architecture having compound conducting substrate 有权
标题翻译：具有复合导电衬底的光电架构
公开(公告)号：US07919337B2
公开(公告)日：2011-04-05
申请号：US11933416
申请日：2007-10-31
申请人： James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L21/00
CPC分类号： H01L31/18 , H01L27/3204 , H01L31/0392 , H01L31/03923 , H01L31/03925 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0749 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.
摘要翻译：公开了光电器件模块，阵列光电器件模块和用于制造光电器件模块的方法。器件模块使用具有夹在由柔性体导体制成的底电极和导电背面之间的绝缘体层的起始衬底制成。有源层设置在底部电极和透明导电层之间。通过透明导电层，有源层，柔性体导体和绝缘层形成透明导电层与背面之间的一个或多个电接触。电触点与有源层，底电极和绝缘层电隔离。

10. 发明申请

US20120052613A1 OPTOELECTRONIC ARCHITECTURE HAVING COMPOUND CONDUCTING SUBSTRATE 审中-公开
标题翻译：具有复合导体基板的光电结构
公开(公告)号：US20120052613A1
公开(公告)日：2012-03-01
申请号：US13169985
申请日：2011-06-27
申请人： James R. Sheats , Sam Kao , Martin R. Roscheisen
发明人： James R. Sheats , Sam Kao , Martin R. Roscheisen
IPC分类号： H01L31/18
CPC分类号： H01L31/18 , H01L27/3204 , H01L31/0392 , H01L31/03923 , H01L31/03925 , H01L31/046 , H01L31/0463 , H01L31/0465 , H01L31/0749 , H01L51/5203 , Y02E10/541 , Y02P70/521
摘要： Optoelectronic device modules, arrays optoelectronic device modules and methods for fabricating optoelectronic device modules are disclosed. The device modules are made using a starting substrate having an insulator layer sandwiched between a bottom electrode made of a flexible bulk conductor and a conductive back plane. An active layer is disposed between the bottom electrode and a transparent conducting layer. One or more electrical contacts between the transparent conducting layer and the back plane are formed through the transparent conducting layer, the active layer, the flexible bulk conductor and the insulating layer. The electrical contacts are electrically isolated from the active layer, the bottom electrode and the insulating layer.
摘要翻译：公开了光电器件模块，阵列光电器件模块和用于制造光电器件模块的方法。器件模块使用具有夹在由柔性体导体制成的底电极和导电背面之间的绝缘体层的起始衬底制成。有源层设置在底部电极和透明导电层之间。通过透明导电层，有源层，柔性体导体和绝缘层形成透明导电层与背面之间的一个或多个电接触。电触点与有源层，底电极和绝缘层电隔离。

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