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    • 10. 发明授权
    • Doped single crystal silicon silicided eFuse
    • 掺杂单晶硅硅片eFuse
    • US07572724B2
    • 2009-08-11
    • US12043226
    • 2008-03-06
    • Edward J. NowakJed H. RankinWilliam R. TontiRichard Q. Williams
    • Edward J. NowakJed H. RankinWilliam R. TontiRichard Q. Williams
    • H01L21/00
    • H01L27/10H01L23/5256H01L2924/0002H01L2924/3011H01L2924/00
    • An eFuse begins with a single crystal silicon-on-insulator (SOI) structure that has a single crystal silicon layer on a first insulator layer. The single crystal silicon layer is patterned into a strip. Before or after the patterning, the single crystal silicon layer is doped with one or more impurities. At least an upper portion of the single crystal silicon layer is then silicided to form a silicided strip. In one embodiment the entire single crystal silicon strip is silicided to create a silicide strip. Second insulator(s) is/are formed on the silicide strip, so as to isolate the silicided strip from surrounding structures. Before or after forming the second insulators, the method forms electrical contacts through the second insulators to ends of the silicided strip. By utilizing a single crystal silicon strip, any form of semiconductor, such as a diode, conductor, insulator, transistor, etc. can form the underlying portion of the fuse structure. The overlying silicide material allows the fuse to act as a conductor in its unprogrammed state. However, contrary to metal or polysilicon based eFuses which only comprise an insulator in the programmed state, when the inventive eFuse is programmed (and the silicide is moved or broken) the underlying semiconductor structure operates as an active semiconductor device.
    • eFuse从在第一绝缘体层上具有单晶硅层的单晶硅绝缘体(SOI)结构开始。 将单晶硅层图案化成条带。 在构图之前或之后,单晶硅层掺杂有一种或多种杂质。 至少单晶硅层的上部然后被硅化以形成硅化带。 在一个实施例中,整个单晶硅带被硅化以产生硅化物条。 在硅化物条上形成第二绝缘体,从而将硅化物带与周围结构隔离。 在形成第二绝缘体之前或之后,该方法通过第二绝缘体形成与硅化带的端部的电接触。 通过使用单晶硅条,任何形式的半导体,例如二极管,导体,绝缘体,晶体管等都可以形成熔丝结构的下面部分。 上覆的硅化物材料允许熔丝作为未编程状态的导体。 然而,与仅编程状态的仅包含绝缘体的金属或多晶硅基eFuse相反,当本发明的eFuse被编程(并且硅化物被移动或断开)时,下面的半导体结构作为有源半导体器件工作。