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    • 3. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US09214238B2
    • 2015-12-15
    • US14474307
    • 2014-09-02
    • KABUSHIKI KAISHA TOSHIBA
    • Takuya FutatsuyamaMasanobu ShirakawaKenichi Abe
    • G11C16/10G11C16/34
    • G11C16/10G11C11/5628G11C11/5671G11C16/0483G11C16/3459H01L27/11582
    • A semiconductor memory device includes first to fourth memory cells that are stacked above a semiconductor substrate, first to fourth word lines that are connected to gates of the first to fourth memory cells, respectively, and a row decoder that applies voltages to the first to fourth word lines. The row decoder applies a first programming voltage to the first word line during a write operation performed on the first memory cell, applies the first programming voltage to the second word line during a write operation performed on the second memory cell, applies a second programming voltage to the third word line during a write operation performed on the third memory cell, and applies the second programming voltage to the fourth word line during a write operation performed on the fourth memory cell. The second programming voltage is higher than the first programming voltage.
    • 一种半导体存储器件包括堆叠在半导体衬底之上的第一至第四存储单元,分别连接到第一至第四存储单元的栅极的第一至第四字线以及向第一至第四存储单元施加电压的行解码器 字线。 行解码器在对第一存储单元执行的写入操作期间向第一字线施加第一编程电压,在对第二存储单元执行的写入操作期间将第一编程电压施加到第二字线,施加第二编程电压 在对第三存储器单元执行的写入操作期间将第二编程电压施加到第四字线,并且在对第四存储器单元执行的写入操作期间将第二编程电压施加到第四字线。 第二编程电压高于第一编程电压。
    • 4. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08772940B2
    • 2014-07-08
    • US13762787
    • 2013-02-08
    • Kabushiki Kaisha Toshiba
    • Kenichi AbeTakuya FutatsuyamaJumpei Sato
    • H01L23/48
    • H01L23/481H01L21/823871H01L21/823892H01L23/485H01L23/528H01L23/5283H01L27/0207H01L2924/0002H01L2924/00
    • In a semiconductor device, a first contact-diffusion-layer is in a first well to be connected to the first well and extends in a channel width direction of a first transistor in a first well. A second contact-diffusion-layer is in the first well so as to be electrically connected to the first well and extends in a channel-length direction of the first transistor. A first contact on the first contact-diffusion-layer has a shape with a diameter in the channel-width direction larger than that in the channel-length direction when viewed from above the substrate. A second contact on the second contact-diffusion-layer has a shape with a diameter in the channel-width direction smaller than that of the first contact and a diameter in the channel-length direction almost equal to that of the first contact when viewed from above the substrate. A wiring is electrically connected to the first transistor through the second contact.
    • 在半导体器件中,第一接触扩散层位于第一阱中,以连接到第一阱,并且在第一阱中的第一晶体管的沟道宽度方向上延伸。 第一接触扩散层位于第一阱中,以与第一阱电连接并在第一晶体管的沟道长度方向上延伸。 第一接触扩散层的第一接触部具有从基板的上方观察时的通道宽度方向的直径大于沟道长度方向的直径的形状。 在第二接触扩散层上的第二接触具有沟道宽度方向的直径小于第一接触部的直径的形状,并且当从第一接触扩散层观察时,通道长度方向上的直径几乎等于第一接触的直径 在基材之上。 布线通过第二触点与第一晶体管电连接。