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1. 发明申请

US20070075408A1 Semiconductor device and radiation detector employing it 失效
标题翻译：采用它的半导体器件和辐射探测器
公开(公告)号：US20070075408A1
公开(公告)日：2007-04-05
申请号：US10546698
申请日：2004-02-26
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： H01L23/02
CPC分类号： H05K3/3436 , H01L23/15 , H01L23/49827 , H01L23/552 , H01L24/16 , H01L24/81 , H01L27/1462 , H01L27/14636 , H01L27/14658 , H01L27/14676 , H01L31/02322 , H01L2224/0345 , H01L2224/0401 , H01L2224/0603 , H01L2224/13099 , H01L2224/1403 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/15312 , H01L2924/15788 , H01L2924/30105 , H01L2924/3025 , H05K1/0306 , H05K2201/0979 , H05K2203/0455 , Y02P70/613 , H01L2924/00
摘要： A wiring substrate to which a semiconductor element 10 is connected, is a wiring substrate 20 comprised of a glass substrate with through-hole groups 20d, each group consisting of a plurality of through holes 20c extending from input surface 20a to output surface 20b and formed in a predetermined array, and conductive members 21 formed on respective inner walls of the through holes 20c in each through-hole group 20d so as to establish electrical continuity between input surface 20a and output surface 20b. A bump electrode 12 of semiconductor element 10 connected to the input surface 20a corresponds to each through-hole group 20d, conductive member 21, and conductive part 22 formed in a region covering the through-hole group 20d, and is connected so that a portion of the bump electrode 12 enters into an interior of each of the through holes 20c. This provides a semiconductor device in which good connection is made between the semiconductor element and the corresponding conduction path in the wiring substrate, and a radiation detector using it.
摘要翻译：连接有半导体元件10的布线基板是由具有通孔组20d的玻璃基板构成的布线基板20，每个组由从输入表面20A延伸到输出表面的多个通孔20c 20b并以预定阵列形成，并且形成在每个通孔组20d中的通孔20c的相应内壁上的导电构件21d，以便在输入表面20a和输出表面20b之间建立电连续性。连接到输入表面20A的半导体元件10的突起电极12对应于形成在覆盖通孔组20d的区域中的每个通孔组20d，导电构件21和导电部22，并且连接突起电极12的一部分进入每个通孔20c的内部。这提供了一种半导体器件，其中在半导体元件和布线基板中的相应导电路径之间形成良好的连接，以及使用它的放射线检测器。

2. 发明申请

US20070007459A1 Radioactive ray detector 失效
标题翻译：放射线检测器
公开(公告)号：US20070007459A1
公开(公告)日：2007-01-11
申请号：US10552705
申请日：2004-04-09
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： G01T1/20
CPC分类号： H01L27/14661 , G01T1/2018 , H01L27/14634 , H01L31/02322
摘要： A wiring substrate section 2 is provided between a radiation detecting section 1, which is formed of a scintillator 10 and a PD array 15, and signal processing elements 30 and 32 for processing a detected signal outputted from the PD array 15, and the wiring substrate section 2 has a wiring substrate 20 which is formed of a glass material having a radiation shielding function and in which a conductive member 21 serving as a conduction path for guiding the detected signal therethrough is provided in a through hole 20c. Relative to the through hole 20c of the wiring substrate 20, the signal processing elements 30 and 32 of the signal processing section 3, located downstream of the wiring substrate 20, are each disposed in an area excluding those areas on the extension of the through holes 20c, and this allows the signal processing elements 30 and 32 not to be seen through the through holes 20c. This arrangement realizes a radiation detector which suppresses radiation made incident on the signal processing means located downstream of the wiring substrate.
摘要翻译：布线基板部分2设置在由闪烁体10和PD阵列15形成的辐射检测部分1和用于处理从PD阵列15输出的检测信号的信号处理元件30和32之间，以及布线基板部分2具有布线基板20，该布线基板20由具有辐射屏蔽功能的玻璃材料形成，并且其中用作引导检测信号的导电路径的导电部件21设置在通孔20c中。相对于布线基板20的通孔20c，位于布线基板20下游的信号处理部3的信号处理元件30,32分别设置在除了贯通孔20的延伸部分以外的区域的区域孔20c，并且这允许信号处理元件30和32不被通过通孔20c看到。这种布置实现了辐射检测器，其抑制入射到位于布线基板下游的信号处理装置的辐射。

3. 发明申请

US20060231961A1 Semiconductor device and radiation detector employing it 失效
标题翻译：采用它的半导体器件和辐射探测器
公开(公告)号：US20060231961A1
公开(公告)日：2006-10-19
申请号：US10546604
申请日：2004-02-24
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： H01L23/29 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/3436 , G01T1/2018 , H01L23/13 , H01L27/14618 , H01L27/14634 , H01L27/14663 , H01L2224/1403 , H01L2224/16235 , H01L2224/16237 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12044 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/3025 , H05K1/0306 , H05K2201/09827 , H05K2203/0455 , Y02P70/613
摘要： A wiring substrate 20, comprising a glass substrate, which is provided with through holes 20c, each having a tapered part 20d that becomes large in opening area at the side of an input surface 20a, and conductive members 21, formed on the inner walls of through holes 20c, is used. A semiconductor device 5 is arranged by connecting bump electrodes 17, provided on an output surface 15b of a PD array 15 in correspondence with conductive members 21, to input portions 21a of conductive members 21 formed on input surface 20a of wiring substrate 20. A radiation detector is arranged by connecting a scintillator 10 via an optical adhesive agent 11 to a light-incident surface 15a of PD array 15 and connecting a signal processing element 30 via bump electrodes 31 to output surface 20b of wiring substrate 20. A semiconductor device, with which the semiconductor elements and the corresponding conductive paths of the wiring substrate are connected satisfactorily, and a radiation detector using this semiconductor device are thus provided.
摘要翻译：布线基板20包括设置有通孔20c的玻璃基板，每个通孔20c具有在输入表面20A侧的开口面积变大的锥形部分20d，以及导电部件21 使用通孔20c的内壁。通过将设置在与导电构件21对应的PD阵列15的输出表面15b上的凸块电极17连接到形成在布线基板20的输入表面20a上的导电构件21的输入部21a 。通过光学粘合剂11将闪烁体10连接到PD阵列15的光入射面15a并通过凸块电极31将信号处理元件30连接到布线基板20的输出面20b而布置放射线检测器。由此，能够令人满意地连接半导体元件和布线基板的对应导电路径的半导体器件，并且由此提供使用该半导体器件的放射线检测器。

4. 发明授权

US07545044B2 Semiconductor device and radiation detector employing it 失效
标题翻译：采用它的半导体器件和辐射探测器
公开(公告)号：US07545044B2
公开(公告)日：2009-06-09
申请号：US10546601
申请日：2004-02-24
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H05K3/002 , H01L23/13 , H01L27/14634 , H01L27/14661 , H01L27/14663 , H01L2224/16235 , H01L2224/16237 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12044 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/3025 , H05K1/0306 , H05K3/3436 , H05K2201/09827 , H05K2203/0235
摘要： A wiring substrate 20, comprising a glass substrate, formed by integrally bundling a plurality of glass fibers and provided with through holes 20c, and conductive members 21, disposed at through holes 20c, is used. Input portions 21a of conductive members 21, formed on an input surface 20a of this wiring substrate 20, are connected to bump electrodes 17, which are provided on an output surface 15b of a PD array 15 in one-to-one correspondence with respect to conductive members 21, thereby arranging a semiconductor device 5. A radiation detector is arranged by connecting a scintillator 10 via an optical adhesive agent 11 to a light-incident surface 15a of PD array 15 and connecting a signal processing element 30 via bump electrodes 31 to output surface 20b of wiring substrate 20. A semiconductor device, with which the semiconductor elements and the corresponding conductive paths of the wiring substrate are connected satisfactorily, and a radiation detector using this semiconductor device are thus provided.
摘要翻译：使用包括通过一体地捆扎多个玻璃纤维并且设置有通孔20c而形成的玻璃基板和布置在通孔20c的导电部件21的布线基板20。形成在该布线基板20的输入面20a上的导电部件21的输入部21a与突起电极17连接，突起电极17相对于PD阵列15的一个一对应地设置在PD阵列15的输出面15b上导电构件21，从而布置半导体器件5.通过将闪烁体10经由光学粘合剂11连接到PD阵列15的光入射表面15a并且经由凸起电极31连接到信号处理元件30而布置放射线检测器输出表面20b。使半导体元件和布线基板的相应导电路径令人满意地连接的半导体器件，并且由此提供使用该半导体器件的辐射检测器。

5. 发明授权

US07326907B2 Wiring substrate and radiation detector using same 失效
标题翻译：接线基板和辐射探测器使用相同
公开(公告)号：US07326907B2
公开(公告)日：2008-02-05
申请号：US10541616
申请日：2004-01-08
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： H01L31/00 , H01L23/48 , G01T1/20
CPC分类号： H01L27/14634 , H01L27/14618 , H01L31/02322 , H01L2224/16225 , H05K1/02 , H05K1/115 , H05K3/42
摘要： A wiring substrate section 2, which has a wiring substrate 20 with through holes 20c each filled with a conductive member 21 serving as a conduction path for guiding a detected signal, is installed between a radiation detecting section 1 comprised of a scintillator 10 and a PD array 15, and a signal processing element 30 for processing the detected signals outputted from the PD array 15. Each through hole 20c in the wiring substrate 20 is formed so that, with respect to a predetermined plane perpendicular to a conduction direction from an input surface 20a to an output surface 20b, an aperture of the through hole 20c in that plane is not on an extension along the conduction direction of an aperture of the through hole 20c in the input surface 20a and so that the through hole 20c cannot be seen through from the input surface 20a to the output surface 20b. This obtains the wiring substrate capable of suppressing transmission of radiation, and a radiation detector using it.
摘要翻译：具有布线基板20的布线基板20安装在由闪烁体10和闪光体10构成的放射线检测部1之间，该布线基板20具有通孔20c，每个通孔20均填充有用作引导检测信号的导电路径的导电部件21。 PD阵列15和用于处理从PD阵列15输出的检测信号的信号处理元件30。布线基板20中的每个通孔20c形成为使得相对于从输入表面20a到输出表面20b的与导电方向垂直的预定平面，在该平面中的通孔20c的孔沿着输入面20a中的通孔20c的孔的导通方向不在延伸部上，从而从输入面20a到输出面20b不能看到通孔20c。这获得了能够抑制辐射透射的布线基板和使用它的放射线检测器。

6. 发明申请

US20060267195A1 Wiring substrate and radiation detector using same 失效
标题翻译：接线基板和辐射探测器使用相同
公开(公告)号：US20060267195A1
公开(公告)日：2006-11-30
申请号：US10541616
申请日：2004-01-08
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： H01L23/48
CPC分类号： H01L27/14634 , H01L27/14618 , H01L31/02322 , H01L2224/16225 , H05K1/02 , H05K1/115 , H05K3/42
摘要： A wiring substrate section 2, which has a wiring substrate 20 with through holes 20c each filled with a conductive member 21 serving as a conduction path for guiding a detected signal, is installed between a radiation detecting section 1 comprised of a scintillator 10 and a PD array 15, and a signal processing element 30 for processing the detected signals outputted from the PD array 15. Each through hole 20c in the wiring substrate 20 is formed so that, with respect to a predetermined plane perpendicular to a conduction direction from an input surface 20a to an output surface 20b, an aperture of the through hole 20c in that plane is not on an extension along the conduction direction of an aperture of the through hole 20c in the input surface 20a and so that the through hole 20c cannot be seen through from the input surface 20a to the output surface 20b. This obtains the wiring substrate capable of suppressing transmission of radiation, and a radiation detector using it.
摘要翻译：具有布线基板20的布线基板20安装在由闪烁体10和闪光体10构成的放射线检测部1之间，该布线基板20具有通孔20c，每个通孔20均填充有用作引导检测信号的导电路径的导电部件21。 PD阵列15和用于处理从PD阵列15输出的检测信号的信号处理元件30。布线基板20中的每个通孔20c形成为使得相对于从输入表面20a到输出表面20b的与导电方向垂直的预定平面，在该平面中的通孔20c的孔沿着输入面20a中的通孔20c的孔的导通方向不在延伸部上，从而从输入面20a到输出面20b不能看到通孔20c。这获得了能够抑制辐射透射的布线基板和使用它的放射线检测器。

7. 发明授权

US07838994B2 Semiconductor device and radiation detector employing it 失效
标题翻译：采用它的半导体器件和辐射探测器
公开(公告)号：US07838994B2
公开(公告)日：2010-11-23
申请号：US10546604
申请日：2004-02-24
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： H01L23/29
CPC分类号： H05K3/3436 , G01T1/2018 , H01L23/13 , H01L27/14618 , H01L27/14634 , H01L27/14663 , H01L2224/1403 , H01L2224/16235 , H01L2224/16237 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12044 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/3025 , H05K1/0306 , H05K2201/09827 , H05K2203/0455 , Y02P70/613
摘要： A wiring substrate 20, comprising a glass substrate, which is provided with through holes 20c, each having a tapered part 20d that becomes large in opening area at the side of an input surface 20a, and conductive members 21, formed on the inner walls of through holes 20c, is used. A semiconductor device 5 is arranged by connecting bump electrodes 17, provided on an output surface 15b of a PD array 15 in correspondence with conductive members 21, to input portions 21a of conductive members 21 formed on input surface 20a of wiring substrate 20. A radiation detector is arranged by connecting a scintillator 10 via an optical adhesive agent 11 to a light-incident surface 15a of PD array 15 and connecting a signal processing element 30 via bump electrodes 31 to output surface 20b of wiring substrate 20. A semiconductor device, with which the semiconductor elements and the corresponding conductive paths of the wiring substrate are connected satisfactorily, and a radiation detector using this semiconductor device are thus provided.
摘要翻译：布线基板20包括设置有通孔20c的玻璃基板，每个通孔20c具有在输入表面20a侧的开口面积变大的锥形部分20d，以及形成在输入表面20a的内壁上的导电部件21 使用通孔20c。通过将设置在与导电构件21对应的PD阵列15的输出表面15b上的凸块电极17连接到形成在布线基板20的输入表面20a上的导电构件21的输入部21a来布置半导体器件5。通过光学粘合剂11将闪烁体10连接到PD阵列15的光入射表面15a并将信号处理元件30经由凸起电极31连接到布线基板20的输出表面20b来布置检测器。半导体器件具有使得半导体元件和布线基板的对应的导电路径令人满意地连接，从而提供使用该半导体器件的放射线检测器。

8. 发明申请

US20060244153A1 Wiring substrate and radiation detector using the same 审中-公开
标题翻译：接线基板和辐射探测器使用它
公开(公告)号：US20060244153A1
公开(公告)日：2006-11-02
申请号：US10541618
申请日：2004-01-08
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： H01L23/52 , H01L39/22 , H01L33/00 , H01L23/48 , H01L29/40
CPC分类号： H01L31/02322 , H01L27/14618 , H01L2224/16225 , H05K1/02 , H05K1/115 , H05K1/144
摘要： Between a radiation detecting section 1, arranged by a scintillator 10 and a PD array 15, and a signal processing element 30, processing detected signals output from PD array 15, is disposed a wiring substrate section 2, provided with conduction paths that guide the detected signals between PD array 15 and signal processing element 30. Wiring substrate section 2 has a first wiring substrate 20, having conductive members 21, which are to serve as the conduction paths at the PD array 15 side, provided in through holes 20c, and a second wiring substrate 25, having conductive members 26, which are to serve as the conduction paths at the signal processing element 30 side, provided in through holes 25c, and is arranged so that the positions of through holes 20c in wiring substrate 20 differ from the positions of through holes 25c in wiring substrate 25 as viewed in the alignment direction. A wiring substrate, with which the transmission of radiation is restrained, and a radiation detector, using this wiring substrate, are thus provided.
摘要翻译：在由闪烁体10和PD阵列15布置的放射线检测部分1和信号处理元件30之间，处理从PD阵列15输出的检测信号，布置在布线基板部分2上，布线基板部分2设置有引导检测到的传导路径 PD阵列15与信号处理元件30之间的信号。布线基板部分2具有第一布线基板20，其具有导电构件21，其用作在PD阵列15侧的导通路径，设置在通孔20c中，第二布线基板25具有导电构件26，其用作在通孔25c中设置在信号处理元件30侧的传导路径，并且布置成使得布线基板20中的通孔20c的位置与布线中的通孔25c的位置不同基板25。因此，提供了利用该布线基板来抑制辐射传播的布线基板和放射线检测器。

9. 发明授权

US07663113B2 Semiconductor device and radiation detector employing it 失效
标题翻译：采用它的半导体器件和辐射探测器
公开(公告)号：US07663113B2
公开(公告)日：2010-02-16
申请号：US10546698
申请日：2004-02-26
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： G01J1/00 , A61B6/00
CPC分类号： H05K3/3436 , H01L23/15 , H01L23/49827 , H01L23/552 , H01L24/16 , H01L24/81 , H01L27/1462 , H01L27/14636 , H01L27/14658 , H01L27/14676 , H01L31/02322 , H01L2224/0345 , H01L2224/0401 , H01L2224/0603 , H01L2224/13099 , H01L2224/1403 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/15312 , H01L2924/15788 , H01L2924/30105 , H01L2924/3025 , H05K1/0306 , H05K2201/0979 , H05K2203/0455 , Y02P70/613 , H01L2924/00
摘要： A wiring substrate to which a semiconductor element 10 is connected, is a wiring substrate 20 comprised of a glass substrate with through-hole groups 20d, each group consisting of a plurality of through holes 20c extending from input surface 20a to output surface 20b and formed in a predetermined array, and conductive members 21 formed on respective inner walls of the through holes 20c in each through-hole group 20d so as to establish electrical continuity between input surface 20a and output surface 20b. A bump electrode 12 of semiconductor element 10 connected to the input surface 20a corresponds to each through-hole group 20d, conductive member 21, and conductive part 22 formed in a region covering the through-hole group 20d, and is connected so that a portion of the bump electrode 12 enters into an interior of each of the through holes 20c. This provides a semiconductor device in which good connection is made between the semiconductor element and the corresponding conduction path in the wiring substrate, and a radiation detector using it.
摘要翻译：连接有半导体元件10的布线基板是由具有通孔组20d的玻璃基板构成的布线基板20，每个组由从输入表面20a延伸到输出表面20b并形成的多个通孔20c 以及形成在每个通孔组20d中的通孔20c的相应内壁上的导电构件21，以便在输入表面20a和输出表面20b之间建立电连续性。连接到输入表面20a的半导体元件10的突起电极12对应于形成在覆盖通孔组20d的区域中的每个通孔组20d，导电部件21和导电部分22，并且连接成使得部分突起电极12进入每个通孔20c的内部。这提供了一种半导体器件，其中在半导体元件和布线基板中的相应导电路径之间形成良好的连接，以及使用它的放射线检测器。

10. 发明授权

US07507971B2 Radioactive ray detector 失效
标题翻译：放射线检测器
公开(公告)号：US07507971B2
公开(公告)日：2009-03-24
申请号：US10552705
申请日：2004-04-09
申请人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
发明人： Katsumi Shibayama , Yutaka Kusuyama , Masahiro Hayashi
IPC分类号： G01T1/26
CPC分类号： H01L27/14661 , G01T1/2018 , H01L27/14634 , H01L31/02322
摘要： A wiring substrate section 2 is provided between a radiation detecting section 1, which is formed of a scintillator 10 and a PD array 15, and signal processing elements 30 and 32 for processing a detected signal outputted from the PD array 15, and the wiring substrate section 2 has a wiring substrate 20 which is formed of a glass material having a radiation shielding function and in which a conductive member 21 serving as a conduction path for guiding the detected signal therethrough is provided in a through hole 20c. Relative to the through hole 20c of the wiring substrate 20, the signal processing elements 30 and 32 of the signal processing section 3, located downstream of the wiring substrate 20, are each disposed in an area excluding those areas on the extension of the through holes 20c, and this allows the signal processing elements 30 and 32 not to be seen through the through holes 20c. This arrangement realizes a radiation detector which suppresses radiation made incident on the signal processing means located downstream of the wiring substrate.
摘要翻译：布线基板部分2设置在由闪烁体10和PD阵列15形成的辐射检测部分1和用于处理从PD阵列15输出的检测信号的信号处理元件30和32之间，以及布线基板部分2具有布线基板20，该布线基板20由具有辐射屏蔽功能的玻璃材料形成，并且其中用作导引检测信号的导电路径的导电部件21设置在通孔20c中。相对于布线基板20的通孔20c，位于布线基板20下游的信号处理部3的信号处理部30,32分别配置在除了贯通孔的延伸部的那些区域以外的区域 20c，并且这允许信号处理元件30和32不通过通孔20c被看到。这种布置实现了辐射检测器，其抑制入射到位于布线基板下游的信号处理装置的辐射。

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