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1. 发明申请

US20170184944A1 A FLASH MODULE CONTAINING AN ARRAY OF REFLECTOR CUPS FOR PHOSPHOR-CONVERTED LEDS 审中-公开
公开(公告)号：US20170184944A1
公开(公告)日：2017-06-29
申请号：US15312608
申请日：2015-06-16
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Mark Melvin Butterworth
IPC分类号： G03B15/05 , H01L33/50 , H01L33/60 , G03B15/00 , H04N5/228
CPC分类号： G03B15/05 , G03B15/00 , G03B2215/0503 , G03B2215/0567 , G03B2215/0585 , G03B2215/0592 , H01L33/50 , H01L33/60 , H01L2224/16225
摘要： In a thin flash module for a camera, a rectangular array of LEDs is mounted on a single lead frame. The lead frame connects the LEDs in series. The LEDs are much smaller than conventional LEDs in a flash module. The LEDs may be in 5×3 array or a 4×3 array, for example. An array of reflective cups is molded over the lead frame or attached to the lead frame, where each of the cups has a substantially square aperture to produce a square sub-beam. A layer of phosphor is located within each cup overlying its associated LED to produce white light. The aspect ratio of the array is selected to generally match the aspect ratio of the camera's field of view (e.g., 16:9). Since the LEDs are very small, the height of the cups may be small to form an ultra-thin flash module. Thin lenses may instead be used.

2. 发明授权

US09634208B2 Shallow reflector cup for phosphor-converted LED filled with encapsulant 有权
公开(公告)号：US09634208B2
公开(公告)日：2017-04-25
申请号：US15107867
申请日：2015-01-14
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Mark Melvin Butterworth
IPC分类号： H01L33/00 , H01L33/60 , H01L33/50 , H01L33/52 , H01L33/62
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62
摘要： An LED die (26) conformally coated with phosphor (28) is mounted at the base (24) of a shallow, square reflector cup (16). The cup has flat reflective walls (20) that slope upward from its base to its rim at a shallow angle of approximately 33 degrees. A clear encapsulant (30) completely fills the cup to form a smooth flat top surface. Any emissions from the LED die or phosphor at a low angle (48, 50) are totally internally reflected at the flat air-encapsulant interface toward the cup walls. This combined LED/phosphor light is then reflected upward by the walls (20) and out of the package. Since a large percentage of the light emitted by the LED and phosphor is mixed by the TIR and the walls prior to exiting the package, the color and brightness of the reflected light is fairly uniform across the beam. The encapsulant is intentionally designed to enhance TIR to help mix the light.

3. 发明授权

US09577151B2 Side interconnect for light emitting device 有权
标题翻译：用于发光器件的侧互连
公开(公告)号：US09577151B2
公开(公告)日：2017-02-21
申请号：US14786522
申请日：2014-04-10
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Toni Lopez , Mark Melvin Butterworth , Theodoros Mihopoulos
IPC分类号： H01L33/36 , H01L33/38 , H01L33/62 , H01L33/46 , H01L33/50 , H01L33/40
CPC分类号： H01L33/62 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/46 , H01L33/502 , H01L2933/0016 , H01L2933/0066
摘要： Embodiments of the invention include a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A metal n-contact is connected to the n-type region. A metal p-contact is in direct contact with the p-type region. An interconnect is electrically connected to one of the n-contact and the p-contact. The interconnect is disposed adjacent to the semiconductor structure.
摘要翻译：本发明的实施例包括包括设置在n型区域和p型区域之间的发光层的半导体结构。金属n型触点连接到n型区域。金属p型接触件与p型区域直接接触。互连电连接到n触点和p触点之一。互连配置成与半导体结构相邻。

4. 发明申请

US20160322549A1 DEEP MOLDED REFLECTOR CUP USED AS COMPLETE LED PACKAGE 审中-公开
标题翻译： DEEP模制反光杯用作完整的LED包装
公开(公告)号：US20160322549A1
公开(公告)日：2016-11-03
申请号：US15104475
申请日：2014-12-23
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Mark Melvin Butterworth
IPC分类号： H01L33/60 , H01L33/64 , H01L33/50 , H01L33/48 , H01L33/62 , H01L33/52
CPC分类号： H01L33/60 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/52 , H01L33/62 , H01L33/647 , H01L2224/16245 , H01L2224/48091 , H01L2224/73265 , H01L2933/0033 , H01L2933/0058 , H01L2924/00014
摘要： An LED package creates a narrow beam in a very compact package without use of a lens. A plastic is molded around a metal lead frame (12, 14) to form a molded cup (26), where the cup has parabolic walls extending from a bottom area of the cup to a top thereof. The lead frame forms a first set of electrodes exposed at the bottom area of the cup for electrically contacting a set of LED die electrodes (18, 20). The lead frame also forms a second set of electrodes outside of the cup for connection to a power supply. A reflective metal (28) is then deposited on the curved walls of the cup. An LED die (16) is mounted at the bottom area of the cup and electrically connected to the first set of electrodes. The cup is then partially filled with an encapsulant (64) containing a phosphor (66).
摘要翻译： LED封装在非常紧凑的封装中产生窄光束，而不使用透镜。在金属引线框架（12,14）周围模制塑料以形成模制杯（26），其中杯具有从杯的底部区域延伸到其顶部的抛物面壁。引线框架形成在杯的底部区域露出的电极接触一组LED管芯电极（18,20）的第一组电极。引线框架还在杯子的外部形成用于连接到电源的第二组电极。然后将反射金属（28）沉积在杯的弯曲壁上。 LED芯片（16）安装在杯子的底部区域并电连接到第一组电极。然后将杯部分地填充含有荧光体（66）的密封剂（64）。

5. 发明申请

US20160240735A1 Top emitting semiconductor light emitting device 有权
标题翻译：顶部发光半导体发光器件
公开(公告)号：US20160240735A1
公开(公告)日：2016-08-18
申请号：US14783780
申请日：2014-03-31
申请人： Koninklijke Philips N.V.
发明人： Brendan Jude Moran , Marc Andre de Samber , Grigoriy Basin , Norbertus Antonius Maria Sweegers , Mark Melvin Butterworth , Kenneth Vampola , Clarisse Mazuir
IPC分类号： H01L33/20 , H01L33/32 , H01L33/46 , H01L33/00 , H01L33/56 , H01L33/62 , H01L25/075 , H01L33/06 , H01L33/50
CPC分类号： H01L33/20 , H01L25/0753 , H01L33/007 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/46 , H01L33/465 , H01L33/502 , H01L33/56 , H01L33/62 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2933/0091
摘要： Embodiments of the invention include a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region. A growth substrate is attached to the semiconductor structure. The growth substrate has at least one angled sidewall. A reflective layer is disposed on the angled sidewall. A majority of light extracted from the semiconductor structure and the growth substrate is extracted through a first surface of the growth substrate.
摘要翻译：本发明的实施例包括包含夹在n型区域和p型区域之间的发光层的半导体结构。生长衬底附着于半导体结构。生长衬底具有至少一个成角度的侧壁。反射层设置在成角度的侧壁上。从半导体结构和生长衬底提取的大部分光通过生长衬底的第一表面提取。

6. 发明授权

US09899579B2 Substrate for LED with total-internal reflection layer surrounding LED 有权
公开(公告)号：US09899579B2
公开(公告)日：2018-02-20
申请号：US15032021
申请日：2014-10-22
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Mark Melvin Butterworth
IPC分类号： H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/50
CPC分类号： H01L33/56 , H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2933/0058
摘要： A packaged LED module includes an LED die mounted on a substrate surface. Formed on the substrate surface and surrounding the die is a first layer of a low index of refraction material. A lens of a higher index of refraction material is molded over the LED die and the first layer. The interface of the lens and the first layer reflects light by total internal reflection (TIR), in accordance with Snell's Law, when the LED light impinges at greater than the critical angle. The first layer may be a low index epoxy, silicone, or other material. In another embodiment, a layer surrounding the LED die is processed after the lens is formed to create an air/lens interface for TIR. The LED die may include a phosphor layer, which results in even more side light being reflected off the interface and not absorbed by the substrate surface.

7. 发明授权

US09711688B2 Controlling LED emission pattern using optically active materials 有权
公开(公告)号：US09711688B2
公开(公告)日：2017-07-18
申请号：US14516610
申请日：2014-10-17
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Daniel Roitman , Mark Melvin Butterworth , Matthias Heidemann , Hans Helmut Bechtel , Danielle Russell Chamberlin , Joan Liu
IPC分类号： H01L33/50 , H01L33/46 , H01L33/60
CPC分类号： H01L33/46 , H01L33/60
摘要： A light emission device comprising a light emitting element, a wavelength conversion (e.g. phosphor) element, and a filter that reduces Color over Angle (CoA) effects by at least partially reflecting light from the light emitting element that strike the filter at near-normal angles of incidence. In some embodiments, a combined phosphor and filter layer is formed over the LED die. The filter may comprise a dispersion of self-aligning moieties, such as dielectric platelets in a film that is vacuum laminated to the LED structure. Xirallic® Galaxy Blue pigment, comprising an aluminum oxide core coated on both sides with thin films of SnO2, and TiO2, and Ronastar® Blue, comprising Calcium Aluminum Borosilicate and TiO2 may provide the dielectric platelets.

8. 发明授权

US09391243B2 Phosphor separated from LED by transparent spacer 有权
标题翻译：荧光粉由LED透明隔离物分离
公开(公告)号：US09391243B2
公开(公告)日：2016-07-12
申请号：US14412026
申请日：2013-06-25
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Mark Melvin Butterworth , Kenneth Vampola
IPC分类号： H01L33/50 , H01L33/52 , H01L33/58
CPC分类号： H01L33/50 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/58 , H01L2224/16225
摘要： To reduce absorption by an LED die (12) of light emitted by a phosphor layer (48), the absorbing semiconductor layers of the LED die (12) are separated from the phosphor layer by a relatively thick glass plate (44) affixed to the LED die or by the LED die transparent growth substrate. Therefore, phosphor light emitted at a sufficient angle towards the LED die will pass through the transparent spacer (44) and exit the sidewalls of the spacer, preventing the light from being absorbed by the LED die. The LED die may be GaN based. The spacer is at least 100 microns thick. A 16% gain in light extraction is achievable using the technique compared to the light emission where phosphor is directly deposited on the LED semiconductor layers.
摘要翻译：为了减少由荧光体层（48）发射的光的LED管芯（12）的吸收，LED管芯（12）的吸收半导体层通过相对较厚的玻璃板（44）与荧光体层分离， LED芯片或由LED芯片透明生长衬底。因此，以足够的角度朝向LED管芯发射的荧光体光将穿过透明间隔物（44）并离开间隔物的侧壁，防止光被LED管芯吸收。 LED芯片可以是基于GaN的。间隔物至少为100微米厚。使用这种技术可以实现光提取16％的增益，与荧光体直接沉积在LED半导体层上的发光相比。

9. 发明申请

US20160093775A1 Side Interconnect for Light Emitting Device 有权
标题翻译：侧面互连用于发光装置
公开(公告)号：US20160093775A1
公开(公告)日：2016-03-31
申请号：US14786522
申请日：2014-04-10
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Toni Lopez , Mark Melvin Butterworth , Theodoros Mihopoulos
IPC分类号： H01L33/38 , H01L33/50 , H01L33/62 , H01L33/46
CPC分类号： H01L33/62 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/46 , H01L33/502 , H01L2933/0016 , H01L2933/0066
摘要： Embodiments of the invention include a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A metal n-contact is connected to the n-type region. A metal p-contact is in direct contact with the p-type region. An interconnect is electrically connected to one of the n-contact and the p-contact. The interconnect is disposed adjacent to the semiconductor structure.
摘要翻译：本发明的实施例包括包括设置在n型区域和p型区域之间的发光层的半导体结构。金属n型触点连接到n型区域。金属p型接触件与p型区域直接接触。互连电连接到n触点和p触点之一。互连配置成与半导体结构相邻。

10. 发明授权

US09871167B2 Top emitting semiconductor light emitting device 有权
公开(公告)号：US09871167B2
公开(公告)日：2018-01-16
申请号：US14783780
申请日：2014-03-31
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Brendan Jude Moran , Marc Andre de Samber , Grigoriy Basin , Norbertus Antonius Maria Sweegers , Mark Melvin Butterworth , Kenneth Vampola , Clarisse Mazuir
IPC分类号： H01L33/46 , H01L25/075 , H01L33/20 , H01L33/44 , H01L33/06 , H01L33/32 , H01L33/50 , H01L33/56 , H01L33/62 , H01L33/00
CPC分类号： H01L33/20 , H01L25/0753 , H01L33/007 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/46 , H01L33/465 , H01L33/502 , H01L33/56 , H01L33/62 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2933/0091
摘要： Embodiments of the invention include a semiconductor structure including a light emitting layer sandwiched between an n-type region and a p-type region. A growth substrate is attached to the semiconductor structure. The growth substrate has at least one angled sidewall. A reflective layer is disposed on the angled sidewall. A majority of light extracted from the semiconductor structure and the growth substrate is extracted through a first surface of the growth substrate.

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