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1. 发明申请

US20180269264A1 MICRO LIGHT-EMITTING DIODE DISPLAY PANEL 审中-公开
公开(公告)号：US20180269264A1
公开(公告)日：2018-09-20
申请号：US15983106
申请日：2018-05-18
申请人： Shenzhen China Star Optoelectronics Technology Co., Ltd.
发明人： Lixuan Chen
IPC分类号： H01L27/32 , H01L33/20 , H01L25/075 , H01L27/15
CPC分类号： H01L27/326 , G09F9/302 , G09F9/33 , G09G3/32 , G09G3/3208 , H01L25/075 , H01L25/0753 , H01L27/153 , H01L27/156 , H01L27/3206 , H01L33/20
摘要： A micro LED display panel includes a plurality of active areas disposed on a substrate and arranged in an array. A plurality of micro LEDs are uniformly arranged in each of the active areas to achieve high-resolution of micro LED display panel. By controlling the number of micro LEDs in each of the active areas, the production cost can be effectively controlled, while a screen door effect can be eliminated to thereby enhance market competitiveness of the micro LED display panel.

2. 发明申请

US20180158807A1 LED MODULE AND METHOD FOR FABRICATING THE SAME 审中-公开
公开(公告)号：US20180158807A1
公开(公告)日：2018-06-07
申请号：US15883413
申请日：2018-01-30
申请人： LUMENS CO., LTD.
发明人： Taekyung YOO , Daewon KIM , Jinmo KIM , Jinwon CHOI , Jimin HER , Younghwan SHIN , Sol HAN , Kyujin LEE
IPC分类号： H01L25/075 , H01L33/62
CPC分类号： H01L25/0753 , H01L21/67144 , H01L21/677 , H01L21/6835 , H01L21/6836 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/97 , H01L25/075 , H01L27/15 , H01L33/00 , H01L33/007 , H01L33/0075 , H01L33/0079 , H01L33/06 , H01L33/08 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/60 , H01L33/62 , H01L2221/68322 , H01L2221/68354 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2221/68395 , H01L2224/1403 , H01L2224/81005 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/95001 , H01L2224/9511 , H01L2224/95115 , H01L2224/95136 , H01L2924/12041 , H01L2933/0066
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

3. 发明授权

US09982854B2 LED lamp filament 有权
公开(公告)号：US09982854B2
公开(公告)日：2018-05-29
申请号：US15314320
申请日：2014-07-08
申请人： HUIZHOU VERY LIGHT SOURCE TECHNOLOGY CO., LTD. , VERY OPTOELECTRONICS (HUIZHOU) CO., LTD.
发明人： Wenbo Ma , Qiurong Liao
IPC分类号： F21V21/00 , F21S4/20 , H01L25/075 , F21V19/00 , H01L33/52 , H01L33/50 , H01L33/64 , F21K9/235 , F21Y115/10 , F21K9/232 , F21Y103/10
CPC分类号： F21S4/20 , F21K9/232 , F21K9/235 , F21V19/001 , F21Y2103/10 , F21Y2115/10 , H01L25/075 , H01L25/0753 , H01L33/505 , H01L33/52 , H01L33/64 , H01L33/642 , H01L2924/0002 , H01L2924/00
摘要： A LED lamp filament, comprising: a long strip-shaped substrate, a plurality of light-emitting units arranged on a first surface of the substrate and distributed along the extending direction of the substrate, and a light-transmittable fluorescent glue layer covering the first surface and the plurality of light-emitting units. A plurality of bulges are provided on at least one side of the substrate, and the bulges are distributed along the extending direction of the substrate; one part of light excited by the fluorescent glue layer and emitted from the light-emitting units emits out in a direction towards a second surface, opposite to the first surface, of the substrate from a space between adjacent bulges.

4. 发明授权

US09941259B2 LED module and method for fabricating the same 有权
公开(公告)号：US09941259B2
公开(公告)日：2018-04-10
申请号：US15793030
申请日：2017-10-25
申请人： LUMENS CO., LTD.
发明人： Taekyung Yoo , Daewon Kim , Jinmo Kim , Jinwon Choi , Jimin Her , Younghwan Shin , Sol Han , Kyujin Lee
IPC分类号： H01L27/32 , H01L25/075 , H01L33/60 , H01L23/00 , H01L33/00 , H01L21/683 , H01L33/62 , H01L33/30 , H01L33/32 , H01L33/06 , H01L33/08
CPC分类号： H01L25/0753 , H01L21/67144 , H01L21/677 , H01L21/6835 , H01L21/6836 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/97 , H01L25/075 , H01L27/15 , H01L33/00 , H01L33/007 , H01L33/0075 , H01L33/0079 , H01L33/06 , H01L33/08 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/60 , H01L33/62 , H01L2221/68322 , H01L2221/68354 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2221/68395 , H01L2224/1403 , H01L2224/81005 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/95001 , H01L2224/9511 , H01L2224/95115 , H01L2224/95136 , H01L2924/12041 , H01L2933/0066
摘要： Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

5. 发明申请

US20170330866A1 PIXEL UNIT STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20170330866A1
公开(公告)日：2017-11-16
申请号：US15591135
申请日：2017-05-10
申请人： Shih-Hsien Tseng
发明人： Shih-Hsien Tseng
IPC分类号： H01L25/07 , H01L25/065 , H01L23/48 , H01L23/498 , H01L25/00 , H01L25/18
CPC分类号： H01L25/072 , G02F1/136 , H01L23/481 , H01L23/49838 , H01L25/0655 , H01L25/075 , H01L25/0753 , H01L25/167 , H01L25/18 , H01L25/50 , H01L27/156 , H01L27/32 , H01L27/3262 , H01L29/786
摘要： A pixel unit structure, as well as a manufacturing method thereof, is provided. The pixel unit structure includes a display medium module and an active switching element. The display medium module includes a first electrode, a second electrode and a display medium. The first electrode and the second electrode are separated from each other, and the display medium is disposed between the first electrode and the second electrode. The active switching element is electrically connected to the first electrode, for allowing the first electrode and the second electrode to change the state of the display medium. The active switching element includes a wafer portion and a transistor portion, which is formed on the wafer portion. Therefore, the active switching element can be manufactured independently without the restriction from the display medium module.

6. 发明申请

US20170200764A1 SEMICONDUCTOR OPTOELECTRONIC DEVICE WITH AN INSULATIVE PROTECTION LAYER AND THE MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20170200764A1
公开(公告)日：2017-07-13
申请号：US15472882
申请日：2017-03-29
申请人： Epistar Corporation
发明人： Chiu-Lin YAO , Chih-Chiang LU
IPC分类号： H01L27/15 , H01L33/62 , H01L33/44 , H01L33/38 , H01L33/32 , H01L33/42 , H01L33/46 , H01L33/24 , H01L33/22 , H01L33/00 , H01L29/861 , H01L29/20 , H01L29/22 , H01L29/66 , H01L33/64
CPC分类号： H01L27/15 , H01L25/075 , H01L25/0753 , H01L29/2003 , H01L29/22 , H01L29/6609 , H01L29/66969 , H01L29/861 , H01L33/007 , H01L33/0079 , H01L33/10 , H01L33/22 , H01L33/24 , H01L33/32 , H01L33/385 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2924/0002 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066 , H01L2933/0075 , H01L2924/00
摘要： The present disclosure is to provide an optoelectronic device. The optoelectronic device comprises a heat dispersion substrate; a first connecting layer on the heat dispersion substrate; a diode stack structure comprising a protection layer and a second connecting layer on the protection layer, wherein the protection layer is on the first connecting layer; a light-emitting structure on the diode stack structure, wherein the light-emitting structure comprises a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; and a first electrode electrically connected to the diode stack structure and the light-emitting structure.

7. 发明申请

US20160381749A1 VARIABLE-BEAM LIGHT SOURCE AND RELATED METHODS 审中-公开
标题翻译：可变光束光源及相关方法
公开(公告)号：US20160381749A1
公开(公告)日：2016-12-29
申请号：US14903209
申请日：2014-07-09
申请人： TERRALUX, INC.
发明人： Anthony W. Catalano
IPC分类号： H05B33/08 , F21V23/06 , F21V7/04 , F21V7/00 , F21V7/06 , H01L25/00 , H01L33/62 , H01L33/38 , H01L33/00 , H01L33/48 , H01L25/075 , F21V23/00 , G03B21/20
CPC分类号： H05B33/0845 , F21S10/00 , F21V7/0091 , F21V7/048 , F21V7/06 , F21V7/09 , F21V23/003 , F21V23/005 , F21V23/04 , F21V23/06 , F21Y2105/10 , F21Y2105/12 , F21Y2113/13 , F21Y2115/10 , G03B21/208 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/075 , H01L25/0753 , H01L25/167 , H01L25/50 , H01L33/0041 , H01L33/38 , H01L33/486 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014 , H01L2933/0016 , H01L2933/0066 , H05B33/0803 , H05B33/089 , H01L2224/45015 , H01L2924/207
摘要： Light sources with arrangements of multiple LEDs (or other light-emitting devices) (102) disposed at or near the focus (106,108) of a reflecting optic (104) having multiple segments facilitate varying the angular distribution of the light beam (e.g., the beam divergence) via the drive currents supplied to the LEDs (102).
摘要翻译：设置在具有多个片段的反射光学元件（104）的聚焦（106,108）处或附近的多个LED（或其他发光器件）（102）的布置的光源有助于改变光束的角度分布（例如，光束发散）通过提供给LED（102）的驱动电流。

8. 发明授权

US09410674B2 LED lens 有权
标题翻译： LED透镜
公开(公告)号：US09410674B2
公开(公告)日：2016-08-09
申请号：US14462312
申请日：2014-08-18
申请人： Cree, Inc.
发明人： Corey Goldstein , Kurt Wilcox
IPC分类号： F21V3/00 , F21V5/00 , F21V7/00 , F21V5/04 , F21V5/08 , H01L25/075 , G02B19/00 , F21W131/103 , F21Y101/02
CPC分类号： F21V7/0091 , F21V5/04 , F21V5/08 , F21W2131/103 , F21Y2115/10 , G02B19/0014 , G02B19/0061 , H01L25/075 , H01L25/0753 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A lens for primarily forward distribution of light from a light emitter which has an emitter axis in a front-to-back centerplane. The lens has a base surface which is adjacent the emitter and forms a light-entrance opening, an inner surface which defines a light-receiving cavity and includes front and back regions extending from the light-entrance opening, and an outer surface which has front and back regions adjoined by a middle region. The back region includes a back portion configured for forward total internal reflection (TIR) of rearward light received from the inner surface. The back portion extends transverse to the front-to-back centerplane away from the base surface from positions which are closer to the base surface than the innermost cavity region and terminates with a distal end which is closer to the base surface than outermost positions of the front region. The back portion terminates laterally at positions closer to the front-to-back centerplane than lateral edges of the light-entrance opening and, in the front-to-back centerplane, the emitter axis is no farther from the back portion of the outer surface than from a back edge of the light-entrance opening.
摘要翻译：用于主要从发射器向前分配光的透镜，其具有在前后中心平面中的发射体轴线。透镜具有与发射体相邻的基面，形成光入口，内表面形成受光腔，其内表面包括从入射口延伸出的前后区域和具有正面的外表面以及由中间区域相邻的后部区域。后部区域包括配置用于从内表面接收的向后光的前向全内反射（TIR）的后部。后部部分横向于前后中心平面从基部表面远离比最内腔区域更靠近基座表面的位置延伸，并且终端具有远离基底表面的远端，而不是位于前区后部部分在靠近前后中心平面的位置处终止于光入口的横向边缘，并且在前后中心平面中，发射器轴不远离外表面的后部而不是从光入口的后边缘。

9. 发明申请

US20150364443A1 Two Terminal Packaging 有权
标题翻译：两端包装
公开(公告)号：US20150364443A1
公开(公告)日：2015-12-17
申请号：US14834606
申请日：2015-08-25
申请人： Sensor Electronic Technology, Inc.
发明人： Yuri Bilenko , Michael Shur , Remigijus Gaska , Alexander Dobrinsky
IPC分类号： H01L23/00 , H01L21/78 , H01L25/075 , H01L25/07 , H01L33/00 , H01L33/62
CPC分类号： H01L23/49541 , H01L21/78 , H01L23/49562 , H01L23/49575 , H01L24/81 , H01L24/94 , H01L25/072 , H01L25/075 , H01L33/52 , H01L33/60 , H01L33/62 , H01L2224/0401 , H01L2224/06102 , H01L2224/1403 , H01L2224/16245 , H01L2224/48091 , H01L2224/81191 , H01L2224/94 , H01L2924/01322 , H01L2924/12 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/13 , H01L2933/0066 , H01L2924/00 , H01L2224/81
摘要： A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.
摘要翻译：提供了用于封装诸如发光二极管的两个终端设备的解决方案。在一个实施例中，一种封装双端子器件的方法包括：图案化金属片以包括多个开口; 将至少一个两个端子装置接合到所述金属板，其中第一开口对应于所述至少一个两个端子装置的第一触点和第二触点之间的距离; 以及围绕所述至少一个两端子装置中的每一个切割所述金属片，其中所述金属片形成到所述第一接触件的第一电极和到所述第二接触件的第二电极。

10. 发明授权

US09190586B2 Semiconductor light-emitting device 有权
标题翻译：半导体发光装置
公开(公告)号：US09190586B2
公开(公告)日：2015-11-17
申请号：US13862191
申请日：2013-04-12
申请人： PHOSTEK, INC.
发明人： Shih Tsun Yang , Yuan-Hsiao Chang , Jhih-Sin Hong
IPC分类号： H05B33/08 , H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/075 , H01L2924/0002 , H05B33/0806 , H05B33/0821 , H01L2924/00
摘要： A semiconductor light-emitting device includes at least one light-emitting chip. The light-emitting chip includes plural light-emitting units, which are electrically coupled to each other in series, in parallel or in series-parallel combination; a first-type electrode electrically coupled to an external power source, the first-type electrode being disposed on one of the light-emitting units; a second-type electrode disposed on another of the light-emitting units; and a tapped point for electrically coupling at least one of the light-emitting units to an electronic component.
摘要翻译：一种半导体发光器件包括至少一个发光芯片。发光芯片包括并联或串联并联电耦合彼此串联的多个发光单元; 电耦合到外部电源的第一类型电极，所述第一类型电极设置在所述发光单元中的一个上; 设置在另一个发光单元上的第二型电极; 以及用于将至少一个发光单元电耦合到电子部件的敲击点。

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